Abstract: In the release film of the present invention, each of thermal shrinkage ratios in an MD direction and a TD direction at 120° C. is not less than 5%.

Abstract: A soft agglomerate of copper oxide ultrafine particles which has an average primary particle diameter of not more than 100 nm and an average secondary particle diameter of not less than 0.2 ?m and of producing the soft agglomerate by (1) forming ultrafine copper oxide by reducing a cuprous carboxyl compound in an aqueous solution, with hydrazine and/or a hydrazine derivative, optionally with a base and optionally with organic compounds, such as alcohol (e.g., ethylene glycol or ethanol), ether, ester or amide; and simultaneously or separately applying an agglomerating force, e.g., agglomerating agent; to produce copper oxide soft agglomerate. Alternatively (2), forming a colloidal dispersion of cuprous oxide ultrafine particles by heating and reducing at least one copper compound (e.g., copper carboxyl, copper alkoxy and copper diketonate compound) at a temperature of not lower than 160 ° C.

Abstract: The present invention relates to a metal oxide dispersion, which can form a metal thin film onto a substrate by heat treatment at a low temperature, wherein a metal oxide having a particle diameter of less than 200 nm is dispersed in the dispersion medium. By heat treating the dispersion after applying it onto a substrate, a metal thin film is formed.

Abstract: A laminate comprising: an insulated substrate, an insulating resin layer having an imide bond and/or amide bond superimposed on the insulated substrate, and a metal thin film layer involving a structure having metal particles fusion bonded to each other, superimposed on the insulating resin layer, wherein the insulating resin layer sticks fast to the metal thin film layer in such a fashion that some of the fusion bonded metal particles are buried in the insulating resin layer, and wherein a metal oxide is present at a contact interface of the insulating resin layer with the metal thin film layer.

Abstract: There are provided a soft agglomerate of copper oxide ultrafine particles which has an average primary particle diameter of not more than 100 nm and an average secondary particle diameter of not less than 0.2 ?m and a method for producing the soft agglomerate.

Abstract: The present invention relates to a metal oxide dispersion, which can form a metal thin film onto a substrate by heat treatment at a low temperature, wherein a metal oxide having a particle diameter of less than 200 nm is dispersed in the dispersion medium. By heat treating the dispersion after applying it onto a substrate, a metal thin film is formed.