Patents by Inventor Mutsumi Kinoshita

Mutsumi Kinoshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7230515
    Abstract: A resin-made base body 1 has first recessed portions 11 and 12 for respectively accommodating a plurality of pulse transformers as well as second recessed portions 13 and 14 for accommodating common mode choke coils which are respectively connected to the pulse transformers. The first recessed portions 11 and 12 are formed on one terminal fixing edge 7 side of the base body 1. The second recessed portions 13 and 14 are formed on the other terminal fixing edge 10 side. The first recessed portions 11 and 12 and the second recessed portions 13 and 14 are arranged by being longitudinally connected in a direction from the one terminal fixing edge 7 toward the other terminal fixing edge 10. The adjacent first recessed portions 11 and 12 are connected at one end portion, and the adjacent second recessed portions 13 and 14 are also formed by being connected at one end portion. Thus, provided are a package for parts for LAN and a module for LAN which is miniaturized, and the insertion loss is reduced.
    Type: Grant
    Filed: April 13, 2006
    Date of Patent: June 12, 2007
    Assignee: TDK Corporation
    Inventors: Gentaro Takeda, Mutsumi Kinoshita, Mitsutaka Yasuda
  • Publication number: 20060291145
    Abstract: A resin-made base body 1 has first recessed portions 11 and 12 for respectively accommodating a plurality of pulse transformers as well as second recessed portions 13 and 14 for accommodating common mode choke coils which are respectively connected to the pulse transformers. The first recessed portions 11 and 12 are formed on one terminal fixing edge 7 side of the base body 1. The second recessed portions 13 and 14 are formed on the other terminal fixing edge 10 side. The first recessed portions 11 and 12 and the second recessed portions 13 and 14 are arranged by being longitudinally connected in a direction from the one terminal fixing edge 7 toward the other terminal fixing edge 10. The adjacent first recessed portions 11 and 12 are connected at one end portion, and the adjacent second recessed portions 13 and 14 are also formed by being connected at one end portion. Thus, provided are a package for parts for LAN and a module for LAN which is miniaturized, and the insertion loss is reduced.
    Type: Application
    Filed: April 13, 2006
    Publication date: December 28, 2006
    Applicant: TDK CORPORATION
    Inventors: Gentaro TAKEDA, Mutsumi Kinoshita, Mitsutaka Yasuda
  • Patent number: 6926558
    Abstract: A first terminal block having first terminals to be in contact with terminals of a plug is incorporated in a housing. The first terminals are exposed to an internal space portion 1e of the housing, while the rear ends of the first terminals project at the rear of the block. A second terminal block has second terminals to be connected to a motherboard the modular jack should be attached to. Electronic parts a are mounted on an internal board. The internal board includes through-hole-like terminals or notch-like terminals to which the first and second terminals and should be soldered. Winding terminals of winding parts are inserted and soldered to through holes of the internal board.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: August 9, 2005
    Assignee: TDK Corporation
    Inventors: Hiroshi Sasai, Mutsumi Kinoshita, Mitsutaka Yasuda, Tadashi Fukuda
  • Publication number: 20040110422
    Abstract: A first terminal block 3 having first terminals 2 to be in contact with terminals of a plug is incorporated in a housing 1. The first terminals 2 are exposed to an internal space portion 1e of the housing 1, while the rear ends of the first terminals 2 project at the rear of the block 3. A second terminal block 5 has second terminals 4 to be connected to a motherboard the modular jack should be attached to. Electronic parts 7a and 7b are mounted on an internal board 6. The internal board 6 includes through-hole-like terminals 6a and 6b or notch-like terminals to which the first and second terminals 2 and 4 should be soldered. Winding terminals 8 of winding parts are inserted and soldered to through holes 6c and 6d of the internal board 6.
    Type: Application
    Filed: December 5, 2003
    Publication date: June 10, 2004
    Applicant: TDK CORPORATION
    Inventors: Hiroshi Sasai, Mutsumi Kinoshita, Mitsutaka Yasuda, Tadashi Fukuda
  • Patent number: 6215386
    Abstract: A combined-type coil device provided with a core, a first coil and a second coil, where the core is provided with at least four through holes and the through holes are roughly parallel to one another. When a combination of two through holes constitutes a first through holes pair and the combination of the remaining two through holes constitutes a second through holes pair, a center line passing through the centers of the holes in the first through hole pair and a center line passing through the centers of the holes in the second through hole pair extend almost perpendicular to each other. The first coil passes through the first through hole pair, whereas the second coil passes through the second through hole pair.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: April 10, 2001
    Assignee: TDK Corporation
    Inventors: Katsuhiro Gokita, Mutsumi Kinoshita, Hiroshi Sasai, Kazuhiko Umeda, Tadashi Fukuda, Toshio Chamura