Abstract: Processing along one circular path is performed by irradiating a laser beam to a ceramic green sheet attached on an outer peripheral surface of a rotating drum, and the processing path is changed by moving at least one of the rotating drum and a beam irradiated position through a predetermined distance in the direction of drum centerline each time the processing on one circular path is completed. If the laser beam is intermittently irradiated to the ceramic green sheet, a matrix of through holes or concave portions can be easily formed in the ceramic green sheet.

Abstract: A method of manufacturing multilayer electronic parts including a processing step asnd an apparatus for manufacturing multilayer electronic parts including a processing apparatus for subjecting a green sheet to a predetermined processing by irradiating it with the laser beam. A green sheet attached to the periphery of one of two drums is subjected to the predetermined processing by irradiating it with the laser beam from a beam irradiation means while allowing the drum to rotate about a drum's centerline as an axis and travel in the direction of the drum's centerline. And while subjecting the green sheet to the processing, processed green sheets are detached from the periphery of the other drum and unprocessed green sheets are attached to it with a sheet attaching/detaching means.

Abstract: Delamination in the conventional chip-type electronic part may create voids thereinside, allowing an internal electrode therein to vibrate in presence of external impacts or large electromagnetic forces caused by a high frequency current flowing inside the electrode, in such a way that fatigue may accumulate in the internal electrode, which eventually will results in the internal electrode being electrically disconnected. To solve this problem, a chip-type electronic part of the present invention includes synthetic resins impregnated into the voids to secure the internal electrode, wherein external electrodes of the chip-type electronic part are made of a conductive synthetic resin or a porous conductive material formed by sintering a conductive paste.

Abstract: A method useful for the manufacture of multilayer ceramic electronic components such as a multilayer chip inductor, a multilayer transformer, a multilayer hybrid components containing a coil conductor, and the like comprises a process A for preparing a ceramic green sheet, a process B for forming a through hole to the ceramic green sheet, a process C for forming a conductor pattern on the ceramic green sheet, and a process D for stacking said ceramic green sheet to another ceramic green sheet, wherein said process B is executed by irradiating a laser beam onto the ceramic green sheets so as to form through holes to the fragile ceramic green sheet with a pinpoint accuracy.

Abstract: A method useful for the manufacture of multilayer ceramic electronic components such as a multilayer chip inductor, a multilayer transformer, a multilayer hybrid components containing a coil conductor, and the like comprises a process A for preparing a ceramic green sheet, a process B for forming a through hole to the ceramic green sheet, a process C for forming a conductor pattern on the ceramic green sheet, and a process D for stacking said ceramic green sheet to another ceramic green sheet, wherein said process B is executed by irradiating a laser beam onto the ceramic green sheets so as to form through holes to the fragile ceramic green sheet with a pinpoint accuracy.

Abstract: A method useful for the manufacture of multilayer ceramic electronic components such as a multilayer chip inductor, a multilayer transformer, a multilayer hybrid components containing a coil conductor, and the like comprises a process A for preparing a ceramic green sheet, a process B for forming a through hole to the ceramic green sheet, a process C for forming a conductor pattern on the ceramic green sheet, and a process D for stacking said ceramic green sheet to another ceramic green sheet, wherein said process B is executed by irradiating a laser beam onto the ceramic green sheets so as to form through holes to the fragile ceramic green sheet with a pinpoint accuracy.