Abstract: Disclosed herein is a method of manufacturing a hybrid packaging material, comprising the steps of: (a) forming a colloidal inorganic nanosol; (b) surface-treating the inorganic nanosol of step (a) with an organic metal alkoxide containing an organic function group by stirring the inorganic nanosol together with the organic metal alkoxide; (c) replacing a solvent of the inorganic nanosol with an organic solvent different in type from the solvent to prepare an organic solvent-type inorganic nanosol; (d) substituting the organic solvent of the inorganic nanosol of step (c) with a functional organic monomer or a silicon compound, followed by concentration to prepare a solvent-free organic-inorganic hybrid material; and (e) adding a nanoclay dispersed in a solvent to the solvent-free organic-inorganic hybrid material.

Abstract: Disclosed herein is a method of manufacturing a hybrid packaging material, comprising the steps of: (a) forming a colloidal inorganic nanosol; (b) surface-treating the inorganic nanosol of step (a) with an organic metal alkoxide containing an organic function group by stirring the inorganic nanosol together with the organic metal alkoxide; (c) replacing a solvent of the inorganic nanosol with an organic solvent different in type from the solvent to prepare an organic solvent-type inorganic nanosol; (d) substituting the organic solvent of the inorganic nanosol of step (c) with a functional organic monomer or a silicon compound, followed by concentration to prepare a solvent-free organic-inorganic hybrid material; and (e) adding a nanoclay dispersed in a solvent to the solvent-free organic-inorganic hybrid material.

Abstract: The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.

Abstract: The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.