Patents by Inventor Myeung Hwa HEO

Myeung Hwa HEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9035516
    Abstract: There are provided a hydrodynamic bearing assembly and a motor including the same. The hydrodynamic bearing assembly includes a sleeve rotatably supporting a shaft and including a first circulation hole formed therein, the first circulation hole penetrating between an inner peripheral surface thereof and an outer peripheral surface thereof; a sleeve housing into which the sleeve is inserted; and a second circulation hole formed between the outer peripheral surface of the sleeve and an inner peripheral surface of the sleeve housing to be in communication with the first circulation hole, wherein an upper portion of the second circulation hole has a larger diameter than a lower portion thereof in an axial direction.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: May 19, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeung Hwa Heo, Won Ki Park, Satoru Sodeoka
  • Publication number: 20140159525
    Abstract: There are provided a hydrodynamic bearing assembly and a motor including the same. The hydrodynamic bearing assembly includes a sleeve rotatably supporting a shaft and including a first circulation hole formed therein, the first circulation hole penetrating between an inner peripheral surface thereof and an outer peripheral surface thereof; a sleeve housing into which the sleeve is inserted; and a second circulation hole formed between the outer peripheral surface of the sleeve and an inner peripheral surface of the sleeve housing to be in communication with the first circulation hole, wherein an upper portion of the second circulation hole has a larger diameter than a lower portion thereof in an axial direction.
    Type: Application
    Filed: March 5, 2013
    Publication date: June 12, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myeung Hwa HEO, Won Ki PARK, Satoru SODEOKA