Patents by Inventor Myeungseon KIM

Myeungseon KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240040291
    Abstract: An electronic device includes: a first housing that is at least a part of an exterior of the electronic device; and a speaker module located in the first housing. The speaker module includes: a first plate includes a first magnetic material; a first magnet disposed on one surface of the first plate; a center pole connected to the first plate and surrounded by the first magnet; a coil structure includes a coil inserted into a gap between the first magnet and the center pole; a diaphragm connected to the coil structure; a second housing includes an opening corresponding to the diaphragm. The first magnet includes: a first surface coupled to the first plate; and a second surface positioned opposite to the first surface, and wherein the second housing is coupled to a first portion of the second surface.
    Type: Application
    Filed: October 13, 2023
    Publication date: February 1, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myeungseon KIM, Seongkwan Yang, Kiwon Kim, Joonrae Cho
  • Publication number: 20230239614
    Abstract: In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member comprising an air adsorbing material disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member configured to reduce air resistance to the diaphragm disposed above the speaker module without limiting the vibration of the diaphragm.
    Type: Application
    Filed: April 3, 2023
    Publication date: July 27, 2023
    Inventors: Joonrae CHO, Changshik YOON, Kiwon KIM, Myeungseon KIM, Taeeon KIM, Myungcheol LEE, Byounghee LEE, Seongkwan YANG, Woojin CHO, Hochul HWANG
  • Publication number: 20230144261
    Abstract: A speaker structure according to various embodiments disclosed in the present document may comprise: a speaker housing which receives a diaphragm to which a voice coil is fixed and the speaker housing has a first surface and a second surface opposite to the first surface; a cover plate disposed on the first surface of the speaker housing; a yoke disposed on the second surface of the speaker housing; first and second pads disposed on the second surface of the speaker housing and electrically connected to the voice coil; and a connection member electrically connected to the first pad and the second pad, wherein the connection member may have a portion connecting the first pad and the second pad, and may be disposed on the yoke. Various other embodiments are also possible.
    Type: Application
    Filed: January 13, 2023
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joonrae CHO, Woojin CHO, Kiwon KIM, Changshik YOON, Byounghee LEE, Myeungseon KIM, Hochul HWANG
  • Publication number: 20230143417
    Abstract: An electronic device is provided. The electronic device includes: a housing at least partially surrounding a space between a front surface and a rear surface of the electronic device, and including a side structure through which a speaker hole is formed; a speaker configured to emit a sound signal through the speaker hole; a vibration motor structure provided adjacent the speaker, and including a plurality of side surfaces, wherein a motor ventilation hole is formed through a first side surface of the plurality of side surfaces; an enclosure provided in the housing, and surrounding at least a portion of the speaker and at least a portion of the vibration motor structure; a sound absorbing structure provided in the enclosure; and a protection structure provided in the enclosure, and overlapping at least a portion of the motor ventilation hole.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woojin CHO, Kiwon KIM, Myeungseon KIM, Youngbae PARK, Incheol BAEK, Sunyoung LEE
  • Patent number: 11622190
    Abstract: In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member comprising an air adsorbing material disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member configured to reduce air resistance to the diaphragm disposed above the speaker module without limiting the vibration of the diaphragm.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: April 4, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joonrae Cho, Changshik Yoon, Kiwon Kim, Myeungseon Kim, Taeeon Kim, Myungcheol Lee, Byounghee Lee, Seongkwan Yang, Woojin Cho, Hochul Hwang
  • Publication number: 20230033112
    Abstract: An electronic device including a speaker with a porous sheet, a speaker is provided. The electronic device includes a main body, a sound generator, which includes a voice coil, a sound body surrounding the voice coil, and a terminal that is at least partially exposed to an outside of the sound body, a printed circuit board (PCB) connected to the terminal and extending outwardly from the main body, and a porous sheet inserted into the main body and spaced apart from the terminal.
    Type: Application
    Filed: October 13, 2022
    Publication date: February 2, 2023
    Inventors: Joonrae CHO, Myeungseon KIM, Myungcheol LEE, Kiwon KIM, Hunki LEE, Woojin CHO
  • Publication number: 20230036176
    Abstract: The electronic device including the plurality of acoustic ducts according to various example embodiments may include the main body; the PCB disposed on the main body; the microphone including the microphone body connected to the PCB and the diaphragm connected to the microphone body; the main acoustic duct penetrating the main body and configured to connect the space in which the diaphragm is placed to the external space of the electronic device; and the sub acoustic duct penetrating the main body and configured to connect the external space of the electronic device to the main acoustic duct. In addition, various example embodiments are possible.
    Type: Application
    Filed: July 12, 2022
    Publication date: February 2, 2023
    Inventors: Jonghwan KIM, Kiwon KIM, Sukgyong KIM, Myeungseon KIM, Changmin KIM, Hakhoon SONG
  • Publication number: 20220394374
    Abstract: An electronic device is provided. The electronic device includes a speaker module. The speaker module includes an enclosure including a first housing and a second housing and a speaker driver included in the first housing. The second housing includes an adsorption cavity forming a back volume of the speaker driver, a variable structure included in at least a part of the second housing, at least one vent hole for ventilation between the adsorption cavity and an external environment, and a housing cover fixed to the variable structure. The adsorption cavity is filled with an adsorptive filler.
    Type: Application
    Filed: June 16, 2022
    Publication date: December 8, 2022
    Inventors: Hunki LEE, Joonrae CHO, Kiwon KIM, Myeungseon KIM, Choonghyo PARK, Seongkwan YANG, Myungcheol LEE, Byounghee LEE, Woojin CHO
  • Publication number: 20220248141
    Abstract: A speaker and/or an electronic device are provided. The electronic device includes the same may include a diaphragm, a yolk disposed to face the diaphragm and including an avoidance groove formed on a surface thereof facing the diaphragm, a coil mounted to one surface of the diaphragm and disposed between the diaphragm and the yolk, and a first magnet mounted to the yolk and disposed to be surrounded by at least part of the coil or a second magnet disposed to surround at least part of the coil. The coil may be disposed to make a surface thereof facing the yolk correspond to the avoidance groove and configured to linearly reciprocate the diaphragm by receiving an electric signal.
    Type: Application
    Filed: November 8, 2021
    Publication date: August 4, 2022
    Inventors: Seongkwan YANG, Kiwon KIM, Joonrae CHO, Myeungseon KIM
  • Patent number: 10993022
    Abstract: An electronic device includes a housing including a front plate forming a first surface, a back plate forming a second surface, and a side member forming a side surface surrounding a space between the first and second surfaces; a sound output device disposed in the housing; an electrical component disposed in the housing and having a variable thickness; and a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate. The vibration damping member is disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component. The vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and divides the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: April 27, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joonrae Cho, Junhee Han, Jaehyoung Park, Myeungseon Kim, Myoungsung Sim, Woojin Cho, Sanggon Shin, Junyoung Lee, Hochul Hwang
  • Publication number: 20210037312
    Abstract: In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member comprising an air adsorbing material disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member configured to reduce air resistance to the diaphragm disposed above the speaker module without limiting the vibration of the diaphragm.
    Type: Application
    Filed: June 23, 2020
    Publication date: February 4, 2021
    Inventors: Joonrae CHO, Changshik YOON, Kiwon KIM, Myeungseon KIM, Taeeon KIM, Myungcheol LEE, Byounghee LEE, Seongkwan YANG, Woojin CHO, Hochul HWANG
  • Publication number: 20200275191
    Abstract: An electronic device includes a housing including a front plate forming a first surface, a back plate forming a second surface, and a side member forming a side surface surrounding a space between the first and second surfaces; a sound output device disposed in the housing; an electrical component disposed in the housing and having a variable thickness; and a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate. The vibration damping member is disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component. The vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and divides the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.
    Type: Application
    Filed: January 22, 2020
    Publication date: August 27, 2020
    Inventors: Joonrae CHO, Junhee HAN, Jaehyoung PARK, Myeungseon KIM, Myoungsung SIM, Woojin CHO, Sanggon SHIN, Junyoung LEE, Hochul HWANG