Patents by Inventor Myoung Lae ROH
Myoung Lae ROH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240032428Abstract: According to an embodiment, a thermoelectric module is disclosed, the thermoelectric module comprising: a first heat-conducting member; a second heat-conducting member; a thermoelectric element disposed between the first heat-conducting member and the second heat-conducting member; a first sealing member disposed outside the thermoelectric element; and a second sealing member disposed outside the first sealing member, wherein the thermoelectric element includes a first substrate, a second substrate facing the first substrate, and a semiconductor structure disposed between the first substrate and the second substrate, and the first sealing member is disposed between the upper surface of the first substrate and the lower surface of the second substrate, and includes a convex side surface toward the semiconductor structure, and the second sealing member is in contact with the side surface of the first substrate and the side surface of the second substrate, and includes a gap between the second sealing member andType: ApplicationFiled: September 7, 2021Publication date: January 25, 2024Inventor: Myoung Lae ROH
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Publication number: 20240008366Abstract: An embodiment of the present invention provides a heat conversion device comprising: a frame comprising a plurality of second through holes; and one or more thermoelectric devices connected to the frame, wherein the width of each of the plurality of second through holes is smaller than the distance between through holes which are closest to each other from among the plurality of second through holes.Type: ApplicationFiled: November 3, 2021Publication date: January 4, 2024Inventors: Seung Yong LEE, Myoung Lae ROH, Un Hak LEE
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Publication number: 20230354708Abstract: Disclosed according to an embodiment is a thermoelectric module comprising: a first heat-conducting member including a first recess; a second heat-conducting member spaced apart from the first heat-conducting member; a thermoelectric element disposed between the first heat-conducting member and the second heat-conducting member; and a circuit unit electrically connected to the thermoelectric element to control resistance, wherein the circuit unit is disposed in the first recess.Type: ApplicationFiled: August 11, 2021Publication date: November 2, 2023Inventors: Sue Kyung OH, Myoung Lae ROH, Seung Yong LEE
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Publication number: 20230345835Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first electrode; a semiconductor structure disposed on the first electrode; and a second electrode disposed on the semiconductor structure, wherein the bottom surface of the second electrode includes an overlap area vertically overlapping the first electrode, the semiconductor structure includes a top surface opposite to the second electrode, and the center of the top surface of the semiconductor structure is arranged to be offset from the center of the overlap area.Type: ApplicationFiled: September 17, 2021Publication date: October 26, 2023Inventors: Myoung Lae ROH, Tae Su YANG
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Publication number: 20220384701Abstract: A power-generating apparatus according to an embodiment of the present invention comprises: a housing in which a fluid flows along the interior thereof and at least a portion of the wall surface thereof includes a flat surface formed of metal; a thermoelectric module disposed on the flat surface of the housing; and an insulating member disposed on the flat surface of the housing so as to be beside the thermoelectric module.Type: ApplicationFiled: November 2, 2020Publication date: December 1, 2022Inventors: Myoung Lae ROH, Seung Yong LEE, Hyung Eui LEE
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Publication number: 20220376158Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first resin layer disposed on the first substrate, a first electrode disposed on the first resin layer, a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode, a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, a second resin layer disposed on the second electrode, and a second substrate disposed on the second resin layer, wherein at least one of the first electrode and the second electrode includes a copper layer, first plated layers disposed on both surfaces of the copper layer, and second plated layers disposed between both surfaces of the copper layer and the first plated layers, materials of the first plated layer and the second plated layer are different from each other, and the first plated layer has a melting point greater than or equal to 300° C.Type: ApplicationFiled: November 19, 2020Publication date: November 24, 2022Inventors: Myoung Lae ROH, Yong Sang CHO, Hyung Eui LEE
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Publication number: 20220359804Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first insulating layer disposed on the first substrate, a second insulating layer disposed on the first insulating layer, a first electrode disposed on the second insulating layer, and a semiconductor structure disposed on the first electrode, wherein the first insulating layer includes an uneven portion, a partial region of the first electrode is buried in the second insulating layer, the second insulating layer includes a concave portion which is concave in a direction toward the first insulating layer from a side surface of the first electrode, and the concave portion vertically overlaps the uneven portion.Type: ApplicationFiled: June 17, 2020Publication date: November 10, 2022Applicant: LG INNOTEK CO., LTD.Inventors: Myoung Lae ROH, Jin Gyeong PARK, Yong Sang CHO
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Patent number: 11417816Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metallic substrate; a first resin layer which is disposed on the first metallic substrate and comes in direct contact with the first metallic substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metallic substrate disposed on the second resin layer, wherein a surface of the first metallic substrate that faces the first resin layer comprises a first region and a second region disposed inside the first region, wherein a surface roughness of the second region is greater than a surface roughness of the first region, wherein the first resin layerType: GrantFiled: January 22, 2019Date of Patent: August 16, 2022Assignee: LG INNOTEK CO., LTD.Inventors: Myoung Lae Roh, Jong Min Lee, Yong Sang Cho
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Publication number: 20220140220Abstract: A thermoelectric module according to an embodiment of the present invention comprises: a housing, a thermoelectric element accommodated in the housing; a sealing member disposed on a side portion of the thermoelectric element; and a heat transfer member disposed on the thermoelectric element. The thermoelectric element includes: a first substrate; a plurality of first electrodes disposed on the first substrate; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; and a second substrate disposed on the second electrodes. The heat transfer member includes a plurality of grooves, and the sealing member is in contact with a side surface of at least one of the first electrodes, the second electrodes, and the plurality of thermoelectric legs.Type: ApplicationFiled: February 26, 2020Publication date: May 5, 2022Inventors: Jong Hyun KIM, Myoung Lae ROH
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Publication number: 20210091293Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metallic substrate; a first resin layer which is disposed on the first metallic substrate and comes in direct contact with the first metallic substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metallic substrate disposed on the second resin layer, wherein a surface of the first metallic substrate that faces the first resin layer comprises a first region and a second region disposed inside the first region, wherein a surface roughness of the second region is greater than a surface roughness of the first region, wherein the first resin layerType: ApplicationFiled: January 22, 2019Publication date: March 25, 2021Inventors: Myoung Lae ROH, Jong Min LEE, Yong Sang CHO
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Publication number: 20210050504Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first metal substrate; a first resin layer disposed on the first metal substrate and in direct contact with the first metal substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metal substrate disposed on the second resin layer, wherein the first resin layer comprises a polymeric resin and an inorganic filler and at least a part of side surfaces of the plurality of first electrodes are embedded in the first resin layer.Type: ApplicationFiled: April 2, 2019Publication date: February 18, 2021Inventors: Myoung Lae ROH, Jong Min LEE, Yong Sang CHO
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Patent number: 10903410Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.Type: GrantFiled: May 3, 2019Date of Patent: January 26, 2021Assignee: LG INNOTEK CO., LTD.Inventors: Yong Sang Cho, Sang Gon Kim, Sook Hyun Kim, Chae Hoon Kim, Myoung Lae Roh, Jong Bae Shin, Boone Won, Jong Min Lee
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Publication number: 20190259930Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.Type: ApplicationFiled: May 3, 2019Publication date: August 22, 2019Inventors: Yong Sang CHO, Sang Gon KIM, Sook Hyun KIM, Chae Hoon KIM, Myoung Lae ROH, Jong Bae SHIN, Boone WON, Jong Min LEE
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Patent number: 10326070Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.Type: GrantFiled: March 7, 2018Date of Patent: June 18, 2019Assignee: LG INNOTEK CO., LTD.Inventors: Yong Sang Cho, Sang Gon Kim, Sook Hyun Kim, Chae Hoon Kim, Myoung Lae Roh, Jong Bae Shin, Boone Won, Jong Min Lee
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Publication number: 20180212132Abstract: The thermoelement according to one embodiment of the present invention includes: a first substrate; multiple p-type thermoelectric legs and multiple n-type thermoelectric legs, which are alternately disposed on the first substrate; a second substrate disposed on the multiple p-type thermoelectric legs and the multiple n-type thermoelectric legs; and multiple electrodes for serially connecting the multiple p-type thermoelectric legs and the multiple n-type thermoelectric legs, wherein the peak number of the n-type thermoelectric legs and that of the p-type thermoelectric legs differ in X-ray diffraction (XRD) analysis in the range of 2?=20-60°.Type: ApplicationFiled: July 20, 2016Publication date: July 26, 2018Inventors: Sang In YOON, Sung Chul KIM, Myoung Lae ROH
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Publication number: 20180198049Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.Type: ApplicationFiled: March 7, 2018Publication date: July 12, 2018Inventors: Yong Sang CHO, Sang Gon KIM, Sook Hyun KIM, Chae Hoon KIM, Myoung Lae ROH, Jong Bae SHIN, Boone WON, Jong Min LEE
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Patent number: 9947854Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.Type: GrantFiled: August 20, 2014Date of Patent: April 17, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Yong Sang Cho, Sang Gon Kim, Sook Hyun Kim, Chae Hoon Kim, Myoung Lae Roh, Jong Bae Shin, Boone Won, Jong Min Lee
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Patent number: 9780282Abstract: Provided is a thermoelectric module capable of preventing the leakage of a current generated from a connection portion upon connecting a thermoelectric semiconductor element to an electrode by forming an insulating layer having a low heat conductivity on an external surface of the thermoelectric semiconductor element and improving performance of the thermoelectric element by controlling a heat transfer phenomenon from a heating part to a cooling part.Type: GrantFiled: January 7, 2015Date of Patent: October 3, 2017Assignee: LG Innotek Co., Ltd.Inventor: Myoung Lae Roh
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Publication number: 20160204325Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module, and may provide a thermoelectric element and a thermoelectric module having notably improved cooling capacity (Qc) and rate of temperature change (AT) to be provided by constructing the thermoelectric element by stacking unit members, each of which comprises a semiconductor layer on a substrate, thereby lowering thermal conductivity and raising electric conductivity.Type: ApplicationFiled: August 20, 2014Publication date: July 14, 2016Applicant: LG Innotek Co., Ltd.Inventors: Yong Sang Cho, Sang Gon Kim, Sook Hyun Kim, Chae Hoon Kim, Myoung Lae Roh, Jong Bae Shin, Boone Won, Jong Min Lee
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Publication number: 20160204329Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.Type: ApplicationFiled: August 20, 2014Publication date: July 14, 2016Inventors: Yong Sang CHO, Sang Gon KIM, Sook Hyun KIM, Chae Hoon KIM, Myoung Lae ROH, Jong Bae SHIN, Boone WON, Jong Min LEE