Abstract: The present invention relates to a method for forming a ceramic coating having improved plasma resistance and a ceramic coating formed thereby. The present invention discloses the method for forming the ceramic coating having improved plasma resistance and the ceramic coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of ceramic powders having a first powder particle size range, and transporting the powders using a transport gas; and forming a ceramic coating in which a plurality of first ceramic particles within a first coating particle size range and a plurality of second ceramic particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported ceramic powders to collide with a substrate inside a process chamber, at the speed of 100 to 500 m/s so as to be pulverized.

Abstract: The present invention discloses the method for forming the coating having the composite coating particle size and the coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of powders within a first powder particle size range, and transporting the powders using a transport gas; and forming a coating in which a plurality of first particles within a first coating particle size range and a plurality of second particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported powders to collide with a substrate inside a process chamber at the speed of 100 to 500 m/s so as to be pulverized.

Abstract: One embodiment of the present invention relates to a method for forming a transparent fluorine film, and a transparent fluorine film formed thereby, and the technical issues to be resolved are to provide a method for forming a transparent fluorine film, and transparent fluorine film formed thereby that can protect the transparent windows of display devices by having not only high transmissivity due to no or extremely small nano-structured pores in the interior, but also having high strength and adhesiveness. To that end, disclosed are a method for forming a transparent fluorine film, and a transparent fluorine film formed thereby, the method comprising the steps of: receiving transport gas from a transport gas supply unit and YF3 powder from a powder supply unit, and transporting the YF3 powder in aerosol form; and colliding and crushing the YF3 powder transported in aerosol form against a substrate in the interior of a processing chamber, and forming a transparent YF3 film on the substrate.

Abstract: The present invention relates to a method for forming a ceramic coating having improved plasma resistance and a ceramic coating formed thereby. The present invention discloses the method for forming the ceramic coating having improved plasma resistance and the ceramic coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of ceramic powders having a first powder particle size range, and transporting the powders using a transport gas; and forming a ceramic coating in which a plurality of first ceramic particles within a first coating particle size range and a plurality of second ceramic particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported ceramic powders to collide with a substrate inside a process chamber, at the speed of 100 to 500 m/s so as to be pulverized.

Abstract: The present invention discloses the method for forming the coating having the composite coating particle size and the coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of powders within a first powder particle size range, and transporting the powders using a transport gas; and forming a coating in which a plurality of first particles within a first coating particle size range and a plurality of second particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported powders to collide with a substrate inside a process chamber at the speed of 100 to 500 m/s so as to be pulverized.