Abstract: Disclosed is a system for providing an open badge, and a method thereof. The reliability of proof may be improved by using advantages of preventing forgery and alteration of data and guaranteeing integrity of data, by providing an open badge linked to a blockchain DID.

Abstract: The present disclosure relates to a DID system and a method, using browser-based security PIN authentication, which can perform DID identity verification on a browser even though a program for the user's identity verification is not installed or is not used, thereby solving the problem of compatibility between programs. The DID system and method can easily obtain credentials through the cloud server even in using a browser in which the credentials are not stored, thereby simplifying the identity verification procedure. When there is a request for identity verification while using the browser in which the credentials are not stored, the present invention can provide a new control method capable of performing identity verification even if there is no cloud server since performing identity verification by utilizing the browser in which the credentials are stored or by loading the credentials from the browser in which the credentials are stored.

Abstract: The present disclosure relates to a method and a device for providing a blockchain DID-based certificate distribution service, whereby a certificate can be combined with a form and thereby used as a certificate to be submitted, to an individual or a corporation, for a specific order of business.

Abstract: A simple authentication method using browser web storage according to an embodiment of the present disclosure includes the operations in which: on the basis of a received user key, a server generates an authentication token, a public key and a private key, stores the same in a session, and transmits the authentication token, the public key and a session key corresponding to the session to a terminal; by using the received public key, the terminal encrypts PIN number data entered by a user, and transmits the encrypted data along with the received session key to the server; and by using the private key corresponding to the received session key, the server decrypts the PIN number data to perform simple authentication, wherein the user key and the PIN number data may be stored in the terminal web storage and set differently for each device or browser.

Abstract: Various embodiments of the present disclosure relate to a method for sharing and verifying blocks between specific nodes in a blockchain. In addition, various embodiments of the present disclosure relate to a method for distributing an electronic document using a smart contract in a blockchain.

Abstract: A simple authentication method using browser web storage according to an embodiment of the present disclosure includes the operations in which: on the basis of a received user key, a server generates an authentication token, a public key and a private key, stores the same in a session, and transmits the authentication token, the public key and a session key corresponding to the session to a terminal; by using the received public key, the terminal encrypts PIN number data entered by a user, and transmits the encrypted data along with the received session key to the server; and by using the private key corresponding to the received session key, the server decrypts the PIN number data to perform simple authentication, wherein the user key and the PIN number data may be stored in the terminal web storage and set differently for each device or browser.

Abstract: Various embodiments of the present disclosure relate to a method for sharing and verifying blocks between specific nodes in a blockchain. In addition, various embodiments of the present disclosure relate to a method for distributing an electronic document using a smart contract in a blockchain.

Abstract: A substrate processing apparatus includes an exhaust unit including a lower surface in which an outlet is formed and four side walls extended from the lower surface, the exhaust unit having exhaust wings protruding from two opposing side walls, a shower head located in the exhaust unit and having distribution holes, and an adjuster disposed on each of side walls of the exhaust unit between the exhaust wings.

Abstract: An imprint apparatus including a stage supporting a stamp master on which a master pattern for forming a stamping pattern on a flexible substrate is formed, or a substrate on which a pattern corresponding to the stamping pattern is formed by contact with the stamping pattern; a roll-to-roll mover to move the flexible substrate along a path adjacent to the stage; a clamp including a front clamp that secures a first portion of the flexible substrate, and a rear clamp that secures a second portion of the flexible substrate spaced apart from the first portion; a pressure roller to press the flexible substrate so that the flexible substrate secured by the clamp is brought into contact with the substrate or the stamp master; and a clamp driving controller to drive the clamp to adjust tension between the first portion and the second portion.

Abstract: A light-emitting device package including: a package substrate; first to fifth conductive patterns disposed on a top surface of the package substrate; a first rectifying circuit disposed on the first and second conductive patterns; a first light-emitting device disposed on the fifth conductive pattern and electrically connected to the first rectifying circuit; a second rectifying circuit disposed on the third and fourth conductive patterns; and a second light-emitting device disposed on the fifth conductive pattern and electrically connected to the second rectifying circuit.

Abstract: The present invention relates, in general, to a digital capture device for learning which captures (or photographs) images of both/either side of an open book in real time and transmits the captured images of the book to an output unit that enlarges or reduces the captured images (characters, pictures, etc.) of the book and displays them, thus allowing a learner to view the images, or that recognizes the characters of the images and outputs the recognized characters in the from of audio speech, thus allowing the learner to listen to the audio speech. More particularly, the present invention relates to a digital capture device for learning which is configured to exactly capture the images of the book without distorting the images.

Abstract: A light-emitting device package including: a package substrate; first to fifth conductive patterns disposed on a top surface of the package substrate; a first rectifying circuit disposed on the first and second conductive patterns; a first light-emitting device disposed on the fifth conductive pattern and electrically connected to the first rectifying circuit; a second rectifying circuit disposed on the third and fourth conductive patterns; and a second light-emitting device disposed on the fifth conductive pattern and electrically connected to the second rectifying circuit.

Abstract: The present invention relates, in general, to a digital capture device for learning which captures (or photographs) images of both/either side of an open book in real time and transmits the captured images of the book to an output unit that enlarges or reduces the captured images (characters, pictures, etc.) of the book and displays them, thus allowing a learner to view the images, or that recognizes the characters of the images and outputs the recognized characters in the from of audio speech, thus allowing the learner to listen to the audio speech. More particularly, the present invention relates to a digital capture device for learning which is configured to exactly capture the images of the book without distorting the images.

Abstract: There is provided a light emitting device package, including: a package body; a first lead frame coupled to the package body and including a first recess having an exposed side, the first recess having a chip mounting area formed to be downwardly recessed therein, wherein at least a part of a bottom surface of the chip mounting area is exposed to a bottom surface of the package body; a second lead frame coupled to the package body so as to have a predetermined distance from the first lead frame and including a second recess having an exposed side opposed to the exposed side of the first recess; and at least one light emitting device mounted on the chip mounting area of the first lead frame and electrically connected with the first and second lead frames.

Abstract: The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

Abstract: There is provided a back light unit having a light guide buffer plate. The back light unit having a light guide buffer plate includes a light source for generating the light when a power source is applied; a light guide panel whose light-receiving vertical surface that the light emitted from the light source enters is provided with a first prism pattern and whose bottom surface is provided with a refraction pattern, thereby converting the incident light from the light-receiving vertical surface into a surface light source; a reflection unit disposed in a bottom surface of the light guide panel to reflect light toward the light guide panel; and a buffer disposed between the light source and the light guide panel and whose light-emitting vertical surface corresponding to the light-receiving vertical surface of the light guide panel is provided with a second prism pattern.

Abstract: In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.

Abstract: An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.

Abstract: The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

Abstract: There is provided a back light unit having a light guide buffer plate. The back light unit having a light guide buffer plate includes a light source for generating the light when a power source is applied; a light guide panel whose light-receiving vertical surface that the light emitted from the light source enters is provided with a first prism pattern and whose bottom surface is provided with a refraction pattern, thereby converting the incident light from the light-receiving vertical surface into a surface light source; a reflection unit disposed in a bottom surface of the light guide panel to reflect light toward the light guide panel; and a buffer disposed between the light source and the light guide panel and whose light-emitting vertical surface corresponding to the light-receiving vertical surface of the light guide panel is provided with a second prism pattern.