Patents by Inventor Myung-Sub Kum

Myung-Sub Kum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-contact sensing module and method of manufacturing the same
    Patent number: 9513144
    Abstract: A non-contact sensing module includes a coil printed circuit board in which a reference pattern coil may be formed at an upper surface and in which a sensing pattern coil may be formed at a lower surface and that has a mounting hole at the center, and a main printed circuit board that may be coupled to the mounting hole and that may be vertically disposed at an upper surface of the coil printed circuit board and that may be electrically connected to the reference pattern coil and the sensing pattern coil.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: December 6, 2016
    Assignees: Hyundai Motor Company, DH Holdings Co., Ltd.
    Inventors: Myung-Sub Kum, Jong-Sang Noh, Jung-Min Lee
  • NON-CONTACT SENSING MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160061632
    Abstract: A non-contact sensing module includes a coil printed circuit board in which a reference pattern coil may be formed at an upper surface and in which a sensing pattern coil may be formed at a lower surface and that has a mounting hole at the center, and a main printed circuit board that may be coupled to the mounting hole and that may be vertically disposed at an upper surface of the coil printed circuit board and that may be electrically connected to the reference pattern coil and the sensing pattern coil.
    Type: Application
    Filed: November 6, 2015
    Publication date: March 3, 2016
    Applicants: Hyundai Motor Company, DH Holdings Co., Ltd.
    Inventors: Myung-Sub KUM, Jong-Sang NOH, Jung-Min LEE
  • Non-contact sensing module and method of manufacturing the same
    Patent number: 9214936
    Abstract: A non-contact sensing module includes a coil printed circuit board in which a reference pattern coil may be formed at an upper surface and in which a sensing pattern coil may be formed at a lower surface and that has a mounting hole at the center, and a main printed circuit board that may be coupled to the mounting hole and that may be vertically disposed at an upper surface of the coil printed circuit board and that may be electrically connected to the reference pattern coil and the sensing pattern coil.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: December 15, 2015
    Assignees: HYUNDAI MOTOR COMPANY, DH HOLDINGS CO., LTD.
    Inventors: Myung-Sub Kum, Jong-Sang Noh, Jung-Min Lee
  • NON-CONTACT SENSING MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140368220
    Abstract: A non-contact sensing module includes a coil printed circuit board in which a reference pattern coil may be formed at an upper surface and in which a sensing pattern coil may be formed at a lower surface and that has a mounting hole at the center, and a main printed circuit board that may be coupled to the mounting hole and that may be vertically disposed at an upper surface of the coil printed circuit board and that may be electrically connected to the reference pattern coil and the sensing pattern coil.
    Type: Application
    Filed: June 18, 2013
    Publication date: December 18, 2014
    Applicants: DH Holdings Co., Ltd., Hyundai Motor Company
    Inventors: Myung-Sub Kum, Jong-Sang Noh, Jung-Min Lee