Abstract: A method for constructing a prediction model of an auto trips quantity and a prediction method and system are disclosed. The prediction model construction method designs a deep neural network Multitask GCN-LSTM based on GCN and LSTM for predicting the auto trips quantity. The deep neural network comprises three modules, wherein the three modules are respectively used for extracting a spatial correlation, a temporal correlation and a feature fusion. The prediction method and system predict the auto trips quantity based on a model constructed. By considering a road segment local relationship and a road segment global relationship and taking an auto arrival quantity as a related task in constructing the model, the prediction model construction method uses a multi-task learning method to avoid overfitting of the deep neural network and reduce a prediction error of the auto trips quantity effectively.

Abstract: A method for co-producing blister copper by enriching germanium and indium from a copper sulfide ore comprises: mixing a copper sulfide ore containing germanium and indium, a reducing agent and a fluxing agent in proportion and then grinding; subjecting the mixture to reduction matte smelting to obtain volatile smoke containing germanium and indium and copper matte respectively; subjecting the copper matte to oxygen-enriched blowing to volatilize germanium and indium, so as to obtain the blister copper and volatile smoke containing germanium and indium respectively; and oxidizing fumes discharged from bag dust collection by ozone, and then absorbing them by spraying alkali liquor to reach up-to-standard discharge. In the reduction smelting stage, the volatilization rate of germanium and indium is more than 70%; and in the copper matte oxygen-enriched blowing stage, the volatilization rate of germanium and indium is more than 25%.

Abstract: A modified positive electrode material includes an inner core and a cladding layer. The inner core is a positive electrode material, and the cladding layer includes a polymer electrolyte body and a ferroelectric ceramic material dispersed in the polymer electrolyte body.

Abstract: A positive active material, a secondary battery, a battery module, a battery pack, and an electrical device are disclosed. The positive active material includes a spinel-type lithium-manganese-containing composite oxide with a molecular formula of Li1+xAaMbXcMn2?a?b?c?xO4?t. In the molecular formula: A is a doping element for a manganese site of the spinel-type lithium-manganese-containing composite oxide; M is used for combining with O to form a second phase containing a polyoxyanion, and M includes one or more of B, C, N, Si, P, S, or Cl; X includes one or more of Mg, Al, Si, Ca, Sc, Ti, Cr, Fe, Co, Ni, Cu, Zn, or Zr; and the molecular formula satisfies: ?0.1?x?0.3, 0<a?0.2, 0<b?0.2, 0<c?0.7, and 0?t?0.2.

Abstract: A method for constructing a prediction model of an auto trips quantity and a prediction method and system are disclosed. The prediction model construction method designs a deep neural network Multitask GCN-LSTM based on GCN and LSTM for predicting the auto trips quantity. The deep neural network comprises three modules, wherein the three modules are respectively used for extracting a spatial correlation, a temporal correlation and a feature fusion. The prediction method and system predict the auto trips quantity based on a model constructed. By considering a road segment local relationship and a road segment global relationship and taking an auto arrival quantity as a related task in constructing the model, the prediction model construction method uses a multi-task learning method to avoid overfitting of the deep neural network and reduce a prediction error of the auto trips quantity effectively.

Abstract: A method of manufacturing a press-fit apparatus suitable for press-fitting multiple connectors to a circuit board is provided. A machine press head that is movable by a power supplier of the press-fit apparatus is provided. A universal press block is fixed to the machine press head to allow the universal press block to be movable with the machine press head. A locating block is fixed to the bottom plate of the universal press block, by inserting a locating fastener of the locating block into a locating hole. A press block is fixed to the locating block at a predetermined position suitable for press-fitting one of the connectors.

Abstract: An apparatus and method for press-fitting a connector to a circuit board is provided. The apparatus has a universal press block fixedly connected to a machine press head. A bottom plate of the universal press block has multiple locating holes. A locating block is fixedly connected to the bottom plate. A press block is fixedly connected to the locating block at a predetermined position suitable for press-fitting the connector. The press block has a press block head, a press block body and a sensor provided between the head and the body. The press block head is movable to contact the connector to apply a pressing force to the connector. The sensor detects the pressing force and generates a signal indicative of the pressing force. The press block body receives the signal from the sensor and controls the movement of the press block head based on the signal.

Abstract: An apparatus and method for press-fitting a connector to a circuit board is provided. The apparatus has a universal press block fixedly connected to a machine press head. A bottom plate of the universal press block has multiple locating holes. A locating block is fixedly connected to the bottom plate. A press block is fixedly connected to the locating block at a predetermined position suitable for press-fitting the connector. The press block has a press block head, a press block body and a sensor provided between the head and the body. The press block head is movable to contact the connector to apply a pressing force to the connector. The sensor detects the pressing force and generates a signal indicative of the pressing force. The press block body receives the signal from the sensor and controls the movement of the press block head based on the signal.

Abstract: An apparatus and method for press-fitting a connector to a circuit board is provided. The apparatus has a universal press block fixedly connected to a machine press head. A bottom plate of the universal press block has multiple locating holes. A locating block is fixedly connected to the bottom plate. A press block is fixedly connected to the locating block at a predetermined position suitable for press-fitting the connector. The press block has a press block head, a press block body and a sensor provided between the head and the body. The press block head is movable to contact the connector to apply a pressing force to the connector. The sensor detects the pressing force and generates a signal indicative of the pressing force. The press block body receives the signal from the sensor and controls the movement of the press block head based on the signal.

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.