Patents by Inventor Na Rim HA
Na Rim HA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9455085Abstract: Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern.Type: GrantFiled: February 7, 2014Date of Patent: September 27, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTDInventors: Hae Sock Chung, Doo Young Kim, Na Rim Ha, Chang Hoon Kim, Sang Hyun Park
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Patent number: 9349537Abstract: Disclosed herein is a multilayer ceramic device including: a device body having side surfaces spaced apart from each other and circumferential surfaces connecting the side surfaces to each other; internal electrodes disposed in a length direction of the device body in the device body; external electrodes having a front surface portion covering the side surfaces and a band portion extended from the front surface portion and covering portions of the circumferential surfaces; and crack guide patterns disposed in the device body and guiding a progress direction of a crack generated from the circumferential surfaces so that the crack is directed toward the side surface, wherein the crack guide pattern includes: a first metal pattern; and a second metal pattern disposed to be closer to the circumferential surface as compared with the first metal pattern and having gaps.Type: GrantFiled: February 7, 2014Date of Patent: May 24, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hae Sock Chung, Doo Young Kim, Na Rim Ha, Chang Hoon Kim, Sang Hyun Park
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Patent number: 9336952Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer.Type: GrantFiled: March 13, 2014Date of Patent: May 10, 2016Assignee: SAMSUNG ELECTRO-MECANICS CO., LTD.Inventors: Hae Sock Chung, Doo Young Kim, Na Rim Ha, Chang Hoon Kim, Kyung Pyo Hong, Sang Hyun Park
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Publication number: 20160111210Abstract: Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern.Type: ApplicationFiled: December 28, 2015Publication date: April 21, 2016Inventors: Hae Sock CHUNG, Doo Young KIM, Na Rim HA, Chang Hoon KIM, Sang Hyun PARK
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Patent number: 9072178Abstract: There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance.Type: GrantFiled: March 15, 2013Date of Patent: June 30, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hae Sock Chung, Doo Young Kim, Na Rim Ha, Youn Sik Jin, Tae Ok Kim
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Publication number: 20150077898Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer.Type: ApplicationFiled: March 13, 2014Publication date: March 19, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hae Sock Chung, Doo Young Kim, Na Rim Ha, Chang Hoon Kim, Kyung Pyo Hong, Sang Hyun Park
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Publication number: 20140240897Abstract: Disclosed herein is a multilayer ceramic device, including a device body having a plurality of dielectric sheets stacked on one another, the device body having spaced-apart sides and circumferential surfaces connecting the sides; internal electrodes formed on the dielectric sheets; an external electrode having a front portion to cover the sides and a band portion to extend from the front portion to cover parts of the circumferential surfaces; and a reinforcement pattern having a plurality of metal patterns arranged facing one another between the internal electrodes and the circumferential surfaces, wherein a distance between the metal patterns may be smaller than thicknesses of the dielectric sheets on which the internal electrodes are formed.Type: ApplicationFiled: February 25, 2014Publication date: August 28, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hae Sock CHUNG, Youn Sik JIN, Na Rim HA, Sang Hyun PARK, Doo Young KIM
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Publication number: 20140233150Abstract: Disclosed herein is a multilayer ceramic device including: a device body having side surfaces spaced apart from each other and circumferential surfaces connecting the side surfaces to each other; internal electrodes disposed in a length direction of the device body in the device body; external electrodes having a front surface portion covering the side surfaces and a band portion extended from the front surface portion and covering portions of the circumferential surfaces; and crack guide patterns disposed in the device body and guiding a progress direction of a crack generated from the circumferential surfaces so that the crack is directed toward the side surface, wherein the crack guide pattern includes: a first metal pattern; and a second metal pattern disposed to be closer to the circumferential surface as compared with the first metal pattern and having gaps.Type: ApplicationFiled: February 7, 2014Publication date: August 21, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hae Sock CHUNG, Doo Young Kim, Na Rim Ha, Chang Hoon Kim, Sang Hyun Park
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Publication number: 20140226255Abstract: Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern.Type: ApplicationFiled: February 7, 2014Publication date: August 14, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hae Sock CHUNG, Doo Young KIM, Na Rim HA, Chang Hoon KIM, Sang Hyun PARK
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Publication number: 20140160622Abstract: There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance.Type: ApplicationFiled: March 15, 2013Publication date: June 12, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hae Sock CHUNG, Doo Young KIM, Na Rim HA, Youn Sik JIN, Tae Ok KIM