Abstract: A semiconductor package includes a substrate, a die coupled to the substrate, the die being smaller in size than the substrate and placed on top of the substrate, a mold formed around and over the die, the mold having a top surface and a mold volume, wherein the mold includes at least one of thermally conductive fin and pillar formed within the mold volume to enhance heat transfer within the package, and a film layer formed over the top surface of the mold volume. The mold includes a plurality of grooves and holes formed above and around the die, and a thermally conductive material is filled into the grooves and holes forming at least one of thermally conductive fin and pillar within the mold volume.

Abstract: An RF amplifier assembly employing a finned heat sink and a heat pipe enhanced aluminum pallet is disclosed. The hybrid heat pipe enhanced aluminum pallet reduces the spreading thermal conduction resistance associated with the conduction of localized energy from RF amplifier devices when compared to a copper pallet. The localized energy concentration of RF amplifier devices is spread along the length of the heat pipe increasing the overall efficiency of the heat sink coupled to the pallet and accommodating non-uniform heat loading. This reduces the junction temperature of the devices, which leads to higher mean time before failure and higher output levels. The pipes are formed and embedded into the pallet so as to pass under different areas of interest and extend to the under-utilized regions.

Abstract: An RF amplifier assembly employing a finned heat sink and a heat pipe enhanced aluminum pallet is disclosed. The hybrid heat pipe enhanced aluminum pallet reduces the spreading thermal conduction resistance associated with the conduction of localized energy from RF amplifier devices when compared to a copper pallet. The localized energy concentration of RF amplifier devices is spread along the length of the heat pipe increasing the overall efficiency of the heat sink coupled to the pallet and accommodating non-uniform heat loading. This reduces the junction temperature of the devices, which leads to higher mean time before failure and higher output levels. The pipes are formed and embedded into the pallet so as to pass under different areas of interest and extend to the under-utilized regions.