Patents by Inventor Nag Jong Choi

Nag Jong Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package and method of manufacturing the same
    Patent number: 8173454
    Abstract: Disclosed is a light emitting diode package, including a metal body including a cavity for receiving a light emitting diode therein, a lens mount for mounting thereon a lens through which light is transmitted, a heat sink for dissipating heat, a lead insertion recess formed on a bottom surface of the metal body so that a lead is inserted therein, and a bonding hole formed to communicate with the lead insertion recess and passing through the cavity of the metal body; and a lead seated into the lead insertion recess of the metal body and insulation bonded to the bottom surface of the metal body by means of an insulating binder, so that an insulation type bonding relationship between the metal body and the lead is maintained stable. A method of manufacturing the light emitting diode package is also provided.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: May 8, 2012
    Assignee: Intops LED Co., Ltd.
    Inventors: Hyung Tae Kim, Yong Hun Choi, Nag Jong Choi
  • LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110140143
    Abstract: Disclosed is a light emitting diode package, including a metal body including a cavity for receiving a light emitting diode therein, a lens mount for mounting thereon a lens through which light is transmitted, a heat sink for dissipating heat, a lead insertion recess formed on a bottom surface of the metal body so that a lead is inserted therein, and a bonding hole formed to communicate with the lead insertion recess and passing through the cavity of the metal body; and a lead seated into the lead insertion recess of the metal body and insulation bonded to the bottom surface of the metal body by means of an insulating binder, so that an insulation type bonding relationship between the metal body and the lead is maintained stable. A method of manufacturing the light emitting diode package is also provided.
    Type: Application
    Filed: January 21, 2010
    Publication date: June 16, 2011
    Inventors: Hyung Tae KIM, Yong Hun CHOI, Nag Jong CHOI