Abstract: A vapor deposition reactor apparatus, systems and methods for deposition of thin films, particularly high-temperature superconducting (HTS) coated conductors, utilize multi-sided susceptors and susceptor pairs for increased production throughput. The reactors may also be configured in multi-stack arrangements of the susceptors within a single reactor chamber for additional throughput gains.

Abstract: A vapor deposition reactor apparatus, systems and methods for deposition of thin films, particularly high-temperature superconducting (HTS) coated conductors, utilize multi-sided susceptors and susceptor pairs for increased production throughput. The reactors may also be configured in multi-stack arrangements of the susceptors within a single reactor chamber for additional throughput gains.

Abstract: A multi-layer and method of making the same are provided. The multi-layer, such as a sensor, can include a high strength glass overlay and a lamination layer on a substrate layer. The overlay can be less than 250 micrometers thick and have at least one tempered surface incorporating a surface compression layer of at least 5 micrometers deep and a surface compressive stress of at least 200 MPa. The overlay can exhibit a puncture factor of at least 3000 N/?m2 at B10 (10th percentile of the probability distribution of failure) in a multi-layer structure, an apparent thickness of less than 0.014 mm, and a pencil hardness greater than 6H. The method can include ion-exchange tempering at least one major surface of a glass sheet, light etching the major surface to remove flaws and laminating the glass sheet on the tempered and lightly etched major surface to a substrate layer.

Abstract: Embodiments of the disclosure relate to a method for creating a strip of electronic components. In the method, a ribbon of ceramic substrate is provided. The ceramic substrate defines a thickness of no more than 200 ?m between a first outer surface and a second outer surface opposite of the first outer surface. A conductive layer is applied to at least one of the first outer surface or the second outer surface of the ceramic substrate. The ceramic substrate is then singulated into individual slabs, and the individual slabs are laminated to a strip of polymeric carrier. The polymeric carrier has a flexural rigidity less than the flexural rigidity of the ceramic substrate. Additionally, embodiments of a roll of electronic components are provided.

Abstract: Embodiments of the disclosure relate to a method of preparing a direct plated substrate. In the method, a dielectric layer is provided that has a first major surface, a second major surface opposite to the first major surface, and a thickness between the first major surface and the second major surface. The thickness of the dielectric layer is no more than 100 ?m. A first metal layer is applied to the first major surface of the dielectric layer. A second metal layer is applied to the second major surface of the dielectric layer. A base plate is joined to the second metal layer, and a metal substrate is joined to the first metal layer. A direct plated substrate made according to the method is also described herein.

Abstract: Disclosed herein are frameless display devices comprising a glass sheet having a first surface, an opposing second surface, and a thickness between the first and second surfaces of less than about 3 mm; a transparent adhesive layer; and an assembly comprising a backlight unit and a back panel; wherein at least one of the first and second surfaces is patterned with an image; and wherein the transparent adhesive layer affixes the first surface of the glass sheet to a surface of the assembly. Also disclosed herein are display devices comprising a glass sheet having a first surface, an opposing second surface, a thickness between the first and second surfaces of less than about 3 mm, and a core having a plurality of light extraction features; a transparent adhesive layer; and an assembly comprising a back panel. Further disclosed herein are kits for making frameless display devices.

Abstract: Disclosed herein are frameless display devices comprising a glass sheet (110) having a first surface, an opposing second surface, and a thickness between the first and second surfaces of less than 3 mm; a transparent adhesive layer (120); and an assembly comprising a backlight unit and a back panel (160); wherein at least one of the first and second surfaces is patterned with an image; and wherein the transparent adhesive layer (120) affixes the first surface of the glass sheet (110) to a surface of the assembly. Also disclosed herein are display devices comprising a glass sheet (110) having a first surface, an opposing second surface, a thickness between the first and second surfaces of less than about 3 mm, and a core having a plurality of light extraction features; a transparent adhesive layer (120); and an assembly comprising a back panel (160). Further disclosed herein are kits for making frameless display devices.

Abstract: A multi-layer and method of making the same are provided. The multi-layer, such as a sensor, can include a high strength glass overlay and a lamination layer on a substrate layer. The overlay can be less than 250 micrometers thick and have at least one tempered surface incorporating a surface compression layer of at least 5 micrometers deep and a surface compressive stress of at least 200 MPa. The overlay can exhibit a puncture factor of at least 3000 N/?m2 at B10 (10thpercentile of the probability distribution of failure) in a multi-layer structure, an apparent thickness of less than 0.014 mm, and a pencil hardness greater than 6H. The method can include ion-exchange tempering at least one major surface of a glass sheet, light etching the major surface to remove flaws and laminating the glass sheet on the tempered and lightly etched major surface to a substrate layer.

Abstract: Disclosed herein are frameless display devices comprising a glass sheet (110) having a first surface, an opposing second surface, and a thickness between the first and second surfaces of less than 3 mm; a transparent adhesive layer (120); and an assembly comprising a backlight unit and a back panel (160); wherein at least one of the first and second surfaces is patterned with an image; and wherein the transparent adhesive layer (120) affixes the first surface of the glass sheet (110) to a surface of the assembly. Also disclosed herein are display devices comprising a glass sheet (110) having a first surface, an opposing second surface, a thickness between the first and second surfaces of less than about 3 mm, and a core having a plurality of light extraction features; a transparent adhesive layer (120); and an assembly comprising a back panel (160). Further disclosed herein are kits for making frameless display devices.

Abstract: Described herein are various polymer-covered glass and glass-ceramic articles that exhibit improved adhesion between the polymer and the glass or glass-ceramic, along with methods for their manufacture and use. The improved articles generally include a glass or glass-ceramic substrate, a surface-roughened coating disposed on at least a portion of an edge of the glass or glass-ceramic substrate, and a polymer covering disposed on at least a portion of the surface-roughened coating. The surface-roughened coatings beneficially allow the polymer coverings to adhere better to the edge surfaces of the glass or glass-ceramic substrates relative to similar or identical articles that lack the surface-roughened coating.

Abstract: A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.

Abstract: A cover assembly for an electronic device includes a sensor element embedded in the opening of a substrate such that the first side of the sensor element is flush with the first surface of the substrate. This allows for conductive elements in the sensor element to be present at a surface of the cover assembly. The conductive elements are inside via holes. A sensor substrate with the via holes can be formed using a redraw process or a laser damage and etch process.

Abstract: Described herein are various polymer-covered glass and glass-ceramic articles that exhibit improved adhesion between the polymer and the glass or glass-ceramic, along with methods for their manufacture and use. The improved articles generally include a glass or glass-ceramic substrate, a surface-roughened coating disposed on at least a portion of an edge of the glass or glass-ceramic substrate, and a polymer covering disposed on at least a portion of the surface-roughened coating. The surface-roughened coatings beneficially allow the polymer coverings to adhere better to the edge surfaces of the glass or glass-ceramic substrates relative to similar or identical articles that lack the surface-roughened coating.

Abstract: A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.

Abstract: A biometrics-enabled smart card for use in transactional or identity applications (e.g., credit cards and identity cards). The biometric smart card includes a substrate, a biometric sensor capable of reading biometric information through the substrate, and a microprocessor to process, store, and authenticate biometric information. The substrate has a Young's modulus of at least abut 50 GPa and a thickness of up to about 0.5 mm.

Abstract: A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.

Abstract: The invention is directed to a high strength, chemically toughened protective glass article, the glass article having a high damage tolerance threshold of at least 1500 g as measured by the lack of radial cracks when the load is applied to the glass using a Vickers indenter; preferably greater than 2000 g s measured by the lack of initiation of radial cracks when the load is applied to the glass using a Vickers indenter

Abstract: The invention is directed to a high strength, chemically toughened protective glass article, the glass article having a high damage tolerance threshold of at least 1500 g as measured by the lack of radial cracks when the load is applied to the glass using a Vickers indenter; preferably greater than 2000 g is measured by the lack of initiation of radial cracks when the load is applied to the glass using a Vickers indenter

Abstract: A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.

Abstract: A glass and an enclosure, including windows, cover plates, and substrates for mobile electronic devices comprising the glass. The glass has a crack initiation threshold that is sufficient to withstand direct impact, has a retained strength following abrasion that is greater than soda lime and alkali aluminosilicate glasses, and is resistant to damage when scratched. The enclosure includes cover plates, windows, screens, and casings for mobile electronic devices and information terminal devices.