Abstract: A laser projection apparatus includes a laser source, an optical engine and a projection lens. The optical engine includes a housing, a light pipe, a lens assembly, a reflector, a prism assembly, a digital micromirror device and at least one prism fixing member. The at least one prism fixing member is configured to fix the prism assembly on the housing, so that a relative position of the prism assembly to the projection lens is kept fixed.

Abstract: A digital light processing projector includes a light machine having a shell. The shell is provided with a first positioning post and a second positioning post. A digital micromirror device is configured with a first positioning hole and a second positioning hole. The first positioning post is located in the first positioning hole. The second positioning post is located in the second positioning hole. The light machine includes a circuit board assembly, a pressing plate, and a first connection assembly for fixed connection with the shell, and fixation of the pressing plate, the circuit board assembly and the digital micromirror device on the shell.

Abstract: A digital light processing projector includes a light machine having a shell. The shell is provided with a first positioning post and a second positioning post. A digital micromirror device is configured with a first positioning hole and a second positioning hole. The first positioning post is located in the first positioning hole. The second positioning post is located in the second positioning hole. The light machine includes a circuit board assembly, a pressing plate, and a first connection assembly for fixed connection with the shell, and fixation of the pressing plate, the circuit board assembly and the digital micromirror device on the shell.

Abstract: The DMD assembly in present disclosure includes a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with driver board on the first side; a second side of the base includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.

Abstract: A projection equipment may including a housing arranged with a first opening and a DMD circuit board arranged with a DMD chip on a side facing the housing, where the DMD chip is arranged with an operational region and a non-operational region. The non-operational region may be located in the periphery of the operational region, and the operational region may modulate a portion of a beam that passes through the first opening when the portion of the beam irradiates onto the operational region. A first heat dissipation member may be arranged between the DMD chip and the housing such that there is a space between the first heat dissipation member and the DMD chip. The first heat dissipation member may be arranged with a second opening which provides a passage for the portion of the beam, while blocking the other portion of the beam.

Abstract: A projection equipment may including a housing arranged with a first opening and a DMD circuit board arranged with a DMD chip on a side facing the housing, where the DMD chip is arranged with an operational region and a non-operational region. The non-operational region may be located in the periphery of the operational region, and the operational region may modulate a portion of a beam that passes through the first opening when the portion of the beam irradiates onto the operational region. A first heat dissipation member may be arranged between the DMD chip and the housing such that there is a space between the first heat dissipation member and the DMD chip. The first heat dissipation member may be arranged with a second opening which provides a passage for the portion of the beam, while blocking the other portion of the beam.

Abstract: Embodiments of the present invention provide a light homogenizing device and a laser projection apparatus. The light homogenizing device comprises a shell and a light stick, wherein the shell forms a holding chamber having openings at both ends thereof; the light stick is located within the holding chamber, and the openings at both ends of the holding chamber correspond to an incident end and an emergent end of the light stick, respectively; and, an elastic component is provided on at least one surface of the shell, with a first end of the elastic component being connected to the shell while a second end thereof extending into the interior of the holding chamber and pressing against the light stick.

Abstract: The DMD assembly in present disclosure includes a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with driver board on the first side; a second side of the base includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.

Abstract: The present disclosure relates to the field of optical and projecting technology, and particularly to a DMD assembly, DLP optical engine and DLP projection device.

Abstract: Embodiments of the present invention provide a light homogenizing device and a laser projection apparatus. The light homogenizing device comprises a shell and a light stick, wherein the shell forms a holding chamber having openings at both ends thereof; the light stick is located within the holding chamber, and the openings at both ends of the holding chamber correspond to an incident end and an emergent end of the light stick, respectively; and, an elastic component is provided on at least one surface of the shell, with a first end of the elastic component being connected to the shell while a second end thereof extending into the interior of the holding chamber and pressing against the light stick.

Abstract: The present disclosure relates to the field of optical and projecting technology, and particularly to a DMD assembly, DLP optical engine and DLP projection device.