Abstract: Provided herein are a sulfur copolymer derived from an elemental sulfur and a thiol monomer and a method for preparing the same. The sulfur copolymer is synthesized by a simple method, and can be widely used in cameras and lenses, or defense materials-related industries, by replacing expensive inorganic materials used in existing infrared lenses. In addition, by adjusting the content of one or more sulfur monomers or two or more sulfur monomers, not only mid-wave infrared transmission but also long-wave infrared transmittance can be maintained at a high level.

Abstract: The present invention relates to a method for manufacturing carbon composite fibers and carbon nanofibers, and more particularly, to a method for manufacturing carbon composite fiber with greatly improved specific tensile strength, specific modulus, electrical conductivity, and thermal conductivity.

Abstract: The present disclosure relates to a carbon nanotube fiber having improved physical properties and a method for manufacturing the same. The method according to the present disclosure comprises the steps of: spinning carbon nanotubes with a purity of 90% by weight or more to obtain a first carbon nanotube fiber; and heat-treating the first carbon nanotube fiber at 500 to 3,000° C. under an inert gas atmosphere to obtain a second carbon nanotube fiber, wherein the second carbon nanotube fiber has a density of 1.0 to 2.5 g/cm3.

Abstract: The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.

Abstract: Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.

Abstract: The present specification provides a carbon fiber reinforced composite structure comprising: a plurality of carbon fiber reinforced sheets, which are laminated; and a stitch member penetrating one or more carbon fiber reinforced sheets, in which the carbon fiber reinforced sheet includes a plurality of reinforcing carbon fibers arranged in one direction. The carbon fiber reinforced composite structure shows excellent thermal conductivity in a thickness direction.

Abstract: The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.

Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.

Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.

Abstract: Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.

Abstract: Disclosed are a method and an apparatus for repairing composite materials using a solvation process, in which, in the repair of composite materials comprising a matrix resin and a filler fiber, a solution capable of depolymerizing the matrix resin is provided to a portion to be repaired of the composite material to depolymerize the matrix resin. By removing the matrix resin constituting the composite material by solvating it with a solvent while leaving the internal filler fibers, it is possible to secure continuity of the fiber skeleton of the composite material even after the repair, perform very easy repair, and minimize damage to the fiber skeleton.

Abstract: Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.

Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.

Abstract: Disclosed are a method and an apparatus for recovering a fiber assembly by decomposing a thermosetting resin composite material, such as carbon fiber reinforced plastic (CFRP) in such a manner the fiber assembly used for the thermosetting composite material, such as CFRP, retains its original organizational shape after decomposition, and a fiber assembly recovered by the method.

Abstract: Provided are a composition for swelling pretreatment of a cured thermosetting resin material before decomposition, including a surfactant and an acidic material, and a method for swelling pretreatment of a cured thermosetting resin material before decomposition by using the same. When carrying out swelling pretreatment of a cured thermosetting resin material before decomposition by using the composition, it is possible to accelerate infiltration of the acidic material into the cured thermosetting resin material and swelling of the cured thermosetting resin material by virtue of the surfactant, and thus to increase the decomposition reactive surface area. Therefore, it is possible to increase reaction efficiency during the subsequent decomposition process, and to increase the decomposition ratio during the same period of time.

Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at 200° C., specifically 100° C. or lower, and to reduce a processing cost and an energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

Abstract: Block copolymers and methods of making patterns of organic thin films using the block copolymers. The block copolymers comprise a fluorinated block. Thin films of the block copolymers have microdomains that can be aligned. As a result the patterns of organic thin films having smaller dimensions than the pattern of incident deep-UV or e-beam radiation can be formed. For example, the block copolymers can be used in lithography, filtration, and templating applications.

Abstract: Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.