Patents by Inventor Nam-Hyun Kim

Nam-Hyun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155212
    Abstract: A camera module includes: a first body including a substrate; an image sensor mounted on the substrate; a second body including a lens module; a ball bearing disposed between the first body and the second body to enable movement of the second body relative to the first body; and a driving member disposed between the first body and the second body to provide driving force to move the second body in at least one direction intersecting an optical axis.
    Type: Application
    Filed: May 16, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Hwan KIM, Ju Ho KIM, Sang Hyun JI, Jung Hyun PARK, Nam Keun OH, Doo Seub SHIN, Dong Hoon LEE, Jong Eun PARK, Sangik CHO
  • Patent number: 11978602
    Abstract: A switch apparatus, includes: a base module including a base case, and a moving magnet movably mounted in the base case; and a manipulation module including a manipulation case, and a first magnet fixedly mounted in the manipulation case, wherein the moving magnet moves between a hold position and a releasable position, the hold position refers to a position in which the manipulation module is held onto the base module as an attractive force acts between the moving magnet and the first magnet, and the releasable position refers to a position in which the manipulation module is releasable from the base module as a repulsive force acts between the moving magnet and the first magnet.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: May 7, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, NOVATECH CO., LTD, ALPS ELECTRIC KOREA CO., LTD.
    Inventors: Sang Hoon Shin, Hoo Sang Lee, Jong Hyun Choi, Dae Woo Park, Youn Tak Kim, Nam I Jo, Choon Teak Oh, Hong Jun Choi, Kon Hee Chang, Woo Joo Ahn
  • Patent number: 11959193
    Abstract: Disclosed are a spinning dope for an aramid and carbon-nanotube composite fiber and a method of manufacturing an aramid and carbon-nanotube composite fiber using the same.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: April 16, 2024
    Assignee: Korea Institute of Science and Technology
    Inventors: Dae Yoon Kim, Ki Hyun Ryu, Bon Cheol Ku, Jun Yeon Hwang, Nam Dong Kim, Dong Ju Lee, Seo Gyun Kim
  • Patent number: 11943447
    Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus that perform inter-prediction using a motion vector predictor. For a candidate block in a col picture, a scaled motion vector is generated based on a motion vector of the candidate block. When the scaled motion vector indicates a target block, a motion vector predictor of the target block is generated based on the motion vector of the candidate block. The motion vector predictor is used to derive the motion vector of the target block in a specific inter-prediction mode such as a merge mode and an AMVP mode.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: March 26, 2024
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-ACADEMIA COOPERATION GROUP OF SEJONG UNIVERSITY, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY
    Inventors: Sung-Chang Lim, Jung-Won Kang, Hyunsuk Ko, Jin-Ho Lee, Ha-Hyun Lee, Dong-San Jun, Hui-Yong Kim, Yung-Lyul Lee, Nam-Uk Kim, Jae-Gon Kim
  • Publication number: 20240090328
    Abstract: The present invention relates to a multi-component host material and an organic electroluminescent device comprising the same. By comprising a specific combination of the multi-component host compounds, the organic electroluminescent device according to the present invention can provide high luminous efficiency and excellent lifespan characteristics.
    Type: Application
    Filed: October 26, 2023
    Publication date: March 14, 2024
    Inventors: Hee-Choon AHN, Young-Kwang KIM, Su-Hyun LEE, Ji-Song JUN, Seon-Woo LEE, Chi-Sik KIM, Kyoung-Jin PARK, Nam-Kyun KIM, Kyung-Hoon CHOI, Jae-Hoon SHIM, Young-Jun CHO, Kyung-Joo LEE
  • Patent number: 11930179
    Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 12, 2024
    Assignees: Electronics and Telecommunications Research Institute, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNI, CHIPS & MEDIA, INC, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY
    Inventors: Sung Chang Lim, Jung Won Kang, Ha Hyun Lee, Jin Ho Lee, Hui Yong Kim, Yung Lyul Lee, Ji Yeon Jung, Nam Uk Kim, Myung Jun Kim, Yang Woo Kim, Dae Yeon Kim, Jae Gon Kim, Do Hyeon Park
  • Publication number: 20240069535
    Abstract: The present disclosure relates to a simulation apparatus for secondary battery production.
    Type: Application
    Filed: July 14, 2022
    Publication date: February 29, 2024
    Inventors: Shinkyu KANG, Min Yong KIM, Youngduk KIM, Nam Hyuck KIM, Su Ho JEON, Min Hee KWON, Sung Nam CHO, Hyeong Geun CHAE, Gyeong Yun JO, Moon Kyu JO, Kyungchul HWANG, Moo Hyun YOO, Han Seung KIM, Daewoon JUNG, Seungtae KIM, Junhyeok JEON
  • Publication number: 20240071858
    Abstract: A vehicle power module includes an upper substrate and a lower substrate spaced from each other in a vertical direction, a semiconductor chip connected to one of the upper substrate and the lower substrate, and a spacer formed of a metal material containing copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or to connect the upper substrate to the lower substrate, the spacer including a plurality of penetration portions formed to penetrate an inside thereof.
    Type: Application
    Filed: November 11, 2022
    Publication date: February 29, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Tae Hwa KIM, Suk Hyun LIM, Nam Sik KONG
  • Publication number: 20240054927
    Abstract: A display device includes a plurality of pixels, a dummy pixel, and a repair line, wherein the plurality of pixels may include a first subpixel including a first pixel circuit connected with a first initialization voltage line through which a first initialization voltage is provided, and a first light emitting element, and a second subpixel including a second pixel circuit connected with a second initialization voltage line through which a second initialization voltage different from the first initialization voltage is provided, and a second light emitting element, wherein the dummy pixel may include a first transistor connectable with the repair line and connected with the first initialization voltage line, a second transistor connectable with the repair line and connected with the second initialization voltage line, and a dummy pixel circuit connectable with the repair line.
    Type: Application
    Filed: June 23, 2023
    Publication date: February 15, 2024
    Inventors: YONGSUNG PARK, NAM-HYUN KIM, SUNGWOO JUNG, JIEUN CHOI
  • Patent number: 11787933
    Abstract: A thermoplastic resin composition according to the present invention contains about 100 parts by weight of a polycarbonate resin, about 5 to about 50 parts by weight of a polyolefin resin, about 5 to about 50 parts by weight of a glass fiber, and about 1 to about 20 parts by weight of a modified olefin-based copolymer, wherein the modified olefin-based copolymer includes an epoxy-modified olefin-based copolymer and a maleic acid anhydride-modified olefin-based copolymer, and the weight ratio of the epoxy-modified olefin-based copolymer to the maleic acid anhydride-modified olefin-based copolymer is about 1:0.05 to about 1:15. The thermoplastic resin composition has excellent stiffness, impact resistance, and the like, and has a low specific gravity, dielectric constant, dielectric dissipation factor, and the like.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: October 17, 2023
    Assignee: Lotte Chemical Corporation
    Inventors: Nam Hyun Kim, Bong Jae Lee
  • Patent number: 11718750
    Abstract: The present invention relates to a thermoplastic resin composition for laser direct structuring process, and a molded product comprising the same. In one specific embodiment, the thermoplastic resin composition comprises: approximately 100 parts by weight of a base resin; approximately 0.1-20 parts by weight of an additive for laser direct structuring; and approximately 1-20 parts by weight of an impact modifier, wherein the base resin comprises a polycarbonate resin, a polycarbonate-polysiloxane copolymer and a polyester resin.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: August 8, 2023
    Assignee: Lotte Chemical Corporation
    Inventors: Nam Hyun Kim, Jung Ki Kim, Sang Hyun Hong
  • Publication number: 20230171997
    Abstract: A display panel includes a base layer including a display area and a non-display area, a repair circuit disposed in the non-display area, a pixel disposed in the display area and including a pixel circuit and a light emitting element electrically connected to the pixel circuit, and a repair line electrically connecting the repair circuit to the pixel. The pixel circuit includes a silicon transistor including a silicon semiconductor pattern and a first gate disposed on the silicon semiconductor pattern, an oxide transistor including a light shielding pattern disposed on the first gate and disposed on the same layer as the repair line, an oxide semiconductor pattern disposed on the light shielding pattern, and a second gate disposed on the oxide semiconductor pattern, and a bridge electrode electrically connected to the light emitting element and the silicon transistor.
    Type: Application
    Filed: August 1, 2022
    Publication date: June 1, 2023
    Inventors: JIEUN CHOI, YONGSUNG PARK, NAM-HYUN KIM, YOUHAN MOON, SUNGWOO JUNG
  • Patent number: 11661513
    Abstract: A thermoplastic resin composition according to the present invention comprises: about 100 parts by weight of a polycarbonate resin; about 5 to about 100 parts by weight of an inorganic filler; about 0.1 to about 2 parts by weight of a maleic anhydride-modified olefin-based copolymer; and about 0.1 to about 2 parts by weight of a phosphite compound represented by chemical formula 1. The thermoplastic resin composition is excellent in terms of chemical resistance, impact resistance, rigidity, physical property balance thereof, and the like.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: May 30, 2023
    Assignee: Lotte Chemical Corporation
    Inventors: Nam Hyun Kim, Bong Jae Lee, Young Mi Kim, Ik Mo Kim, Sang Hwa Lee, Sang Hyun Hong
  • Patent number: 11651556
    Abstract: Provided is a virtual exhibition space providing method for efficient data management. The method comprises the steps of: displaying, on a screen, a space image in which an exhibition space including multiple wall surfaces is expressed in three dimensions; receiving a first user's selection of a particular wall surface among multiple wall surfaces on the space image; displaying, on a screen, a wall surface image of the particular wall surface, in which the particular wall surface is expressed in two dimensions; receiving a command of the first user which causes at least one work image having a particular size to overlap and be arranged at a particular position on the wall surface image; generating a snapshot image of the particular wall surface in which the at least one work image overlaps and is arranged on the wall surface image; and transmitting, to a server, identification information of the particular wall surface, the snapshot image, and the at least one work image.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: May 16, 2023
    Assignee: DIFT CORPORATION
    Inventors: Chi Hyung Park, Dong Ree Kim, Nam Hyun Kim, In Je Cho
  • Publication number: 20220213317
    Abstract: A thermoplastic resin composition of the present invention comprises: approximately 100 parts by weight of a polycarbonate resin; approximately 1-10 parts by weight of an additive for laser direct structuring; approximately 0.1-7 parts by weight of a maleic anhydride-modified olefin-based copolymer; and approximately 0.1-4 parts by weight of a phosphite compound represented by chemical formula 1. The thermoplastic resin composition has excellent plating reliability, impact resistance, chemical resistance and the like, and generates a small amount of gas during injection molding, and thus has excellent injection stability.
    Type: Application
    Filed: May 19, 2020
    Publication date: July 7, 2022
    Inventors: Nam Hyun KIM, Yang Il KIM, Young Mi KIM, Bong Jae LEE, Sang Hwa LEE
  • Patent number: 11312832
    Abstract: A thermoplastic resin composition and a molded article including the same. The thermoplastic resin composition includes: about 100 parts by weight of a thermoplastic resin; about 1 to about 30 parts by weight of an additive for laser direct structuring (LDS additive); about 0.01 to about 5 parts by weight of a hindered phenol-based compound; about 0.01 to about 10 parts by weight of a sodium phosphate salt; about 0.01 to about 5 parts by weight of a phosphite compound; about 0.01 to about 5 parts by weight of a sulfonate compound; and about 0.01 to about 10 parts by weight of a metal oxide, wherein a weight ratio of the hindered phenol-based compound, the sodium phosphate salt, the phosphite compound and the sulfonate compound to the metal oxide may range from about 2:1 to about 10:1.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: April 26, 2022
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Jee Kwon Park, Ik Mo Kim, Nam Hyun Kim, Jung Ki Kim, Sang Hyun Hong
  • Patent number: 11250643
    Abstract: A method for providing a virtual exhibition space by using a 2.5-dimensionalization is provided.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: February 15, 2022
    Assignee: DIFT CORPORATION
    Inventors: Chi Hyung Park, Dong Ree Kim, Nam Hyun Kim, In Je Cho
  • Publication number: 20220033650
    Abstract: A thermoplastic resin composition according to the present invention contains about 100 parts by weight of a polycarbonate resin, about 5 to about 50 parts by weight of a polyolefin resin, about 5 to about 50 parts by weight of a glass fiber, and about 1 to about 20 parts by weight of a modified olefin-based copolymer, wherein the modified olefin-based copolymer includes an epoxy-modified olefin-based copolymer and a maleic acid anhydride-modified olefin-based copolymer, and the weight ratio of the epoxy-modified olefin-based copolymer to the maleic acid anhydride-modified olefin-based copolymer is about 1:0.05 to about 1:15. The thermoplastic resin composition has excellent stiffness, impact resistance, and the like, and has a low specific gravity, dielectric constant, dielectric dissipation factor, and the like.
    Type: Application
    Filed: March 11, 2020
    Publication date: February 3, 2022
    Inventors: Nam Hyun KIM, Bong Jae LEE
  • Patent number: 11208555
    Abstract: The present invention relates to a thermoplastic resin composition for a laser direct structuring process and a molded article produced therefrom. In one embodiment, the thermoplastic resin composition comprises: a polyamide resin; a polyester resin; a rubber-modified aromatic vinyl-based graft copolymer; an inorganic filler; and an additive for laser direct structuring.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: December 28, 2021
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Nam Hyun Kim, Sang Hyun Hong
  • Publication number: 20210380802
    Abstract: A thermoplastic resin composition according to the present invention comprises: about 100 parts by weight of a polycarbonate resin; about 5 to about 100 parts by weight of an inorganic filler; about 0.1 to about 2 parts by weight of a maleic anhydride-modified olefin-based copolymer; and about 0.1 to about 2 parts by weight of a phosphite compound represented by chemical formula 1. The thermoplastic resin composition is excellent in terms of chemical resistance, impact resistance, rigidity, physical property balance thereof, and the like.
    Type: Application
    Filed: December 11, 2019
    Publication date: December 9, 2021
    Inventors: Nam Hyun KIM, Bong Jae LEE, Young Mi KIM, Ik Mo KIM, Sang Hwa LEE, Sang Hyun HONG