Abstract: A microfluidic detection unit comprises at least one fluid injection section, a fluid storage section and a detection section. Each fluid injection section defines a fluid outlet; the fluid storage section is in gas communication with the atmosphere and defines a fluid inlet; the detection section defines a first end in communication with the fluid outlet and a second end in communication with the fluid inlet. A height difference is defined between the fluid outlet and the fluid inlet along the direction of gravity. When a first fluid is injected from the at least one fluid injection section, the first fluid is driven by gravity to pass through the detection section and accumulate to form a droplet at the fluid inlet, such that a state of fluid pressure equilibrium of the first fluid is established.

Abstract: A new flip-chip technology, denominated as DDFC (Direct-Downset Flip-Chip) technology, is characterized by the forming of a downset device hole in the substrate, and by the use of an array of solder bumps over the semiconductor chip and an array of recessed solder-bump pads of an inwardly-tapered conical shape over the bottom surface of the device hole for bonding the semiconductor chip to the substrate. During assembly, the semiconductor chip is embedded in a direct-downset manner into the device hole of the substrate, with the solder bumps being fitted and wetted to the recessed solder-bump pads. The proposed DDFC technology can be implemented without requiring solder-deflux or flip-chip underfill processes, thereby simplifying overall package fabrication.

Abstract: A new flip-chip technology, denominated as DDFC (Direct-Downset Flip-Chip) technology, is proposed, which is characterized by the forming of a downset device hole in the substrate and by the use of an array of solder bumps over the semiconductor chip and an array of recessed solder-bump pads of an inwardly-tapered conic shape over the bottom surface of the device hole for bonding the semiconductor chip to the substrate. During assembly, the semiconductor chip is embedded in a direct-downset manner into the device hole of the substrate, with the solder bumps being fitted and wetted to the recessed solder-bump pads.