Abstract: PROBLEM TO BE SOLVED Under conventional methods, calculation for determining the extent of damage progression inside a structural body by computation is difficult to apply in actual practice, and also time consuming. In addition, detection of damage occurring in objects with complicated shapes or infinitesimal damage is particularly difficult. SOLUTION When pressure applied from one surface of an object to be measured to another surface thereof is pressurized or depressurized, the distance d1 between two distorted sections R1, R2 due to damage formed on the other surface S, is detected and the extent of the said damage progression is measured.

Abstract: A shearography system may include light source that may be configured to produce a beam of light to illuminate a test area, a camera, and an optical path between the light source and the camera, the test area disposed in the optical path between the light source and the camera. In embodiments, an image plane may be disposed in the optical path between the test area and the camera. In embodiments, the camera may be configured to obtain intensity information that may correspond to specular reflections of the beam of light off of the test area via diffuse reflections of the beam of light off of the image plane. The intensity information may correspond to out-of-plane strain of the test area.

Abstract: Embodiments of a shearography system may include light sources configured to produce beams of light to illuminate a test area. Each of the beams of light may include a different wavelength. A camera may be configured to obtain intensity information corresponding to reflections of the lights off of the test area. An optical shearing device may be disposed in an optical path between the light sources and the camera and the optical shearing device may be configured to provide a shearing angle.

Abstract: A method for assembling a packaged semiconductor device includes mounting a pressure-sensing die onto a die paddle of a metal lead frame. A pressure-sensitive gel is dispensed into a recess of a lid, and the lead frame is mated with the lid such that the pressure-sensing die is immersed in the pressure-sensitive gel within the recess of the lid.

Abstract: Provided is a mechanoluminescent material which can radiate near-infrared light. The mechanoluminescent material includes an aluminate co-doped with Eu2+, Cr3+, and an ion or ion cluster of at least any one rare earth metal element selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, or Lu. In addition, in the mechanoluminescent material, the aluminate is an aluminate represented by Formula MAl2O4 (provided that, M is any of Mg, Ca, Sr, or Ba) and Eu2+, Cr3+, and the ion or ion cluster of a rare earth metal element are co-doped at a concentration at which M in the aluminate is substituted by from 0.25 to 10%.

Abstract: Source radio frequency energy (RF) is coupled wirelessly (no physical contact) between two compound loop (CPL) antennas or one CPL and another type of antenna across a variety of barriers such as plastic, human tissues, glass, and air. The compound coupling interface created between the two antennas is highly efficient in transferring the RF energy from a source antenna to a destination including a CPL antenna. A re-radiating structure including a further CPL antenna or a different type of antenna may be connected on the destination side to completely physically isolate the source side from the destination side. When the destination coupling antenna is removed, the source coupling antenna may operate as an efficient radiator at the desired operating frequencies. Likewise, the destination coupling antenna may operate as an efficient radiator in the absence of the source coupling antenna.

Abstract: A Quad Flat Non-leaded (QFN) semiconductor package has a semiconductor die mounted on a die flag of a lead frame. A molded housing with a base and sides covers the die. The package has electrically conductive mounting feet each of which includes an exposed base surface in the base of the housing, an opposite parallel surface covered by the housing, and an exposed end surface in the one of the sides of the housing. The exposed end surface is normal to, and located between, the exposed base surface and the opposite parallel surface. Bond wires selectively electrically connect electrodes of the die to respective ones of the mounting feet. An electrically conductive plating coats the exposed base portion and exposed end surface of the mounting feet.

Abstract: A Quad Flat Non-leaded (QFN) semiconductor die package has a semiconductor die mounted on a die flag of a lead frame. A covers the semiconductor die. The housing has a base and sides. There are electrically conductive mounting feet, each of which has an exposed base portion in the base of the housing and an exposed side portion in the one of the sides of the housing. Bond wires electrically connect electrodes of the semiconductor die to respective ones of the mounting feet.

Abstract: The present invention aims to provide a mechanoluminescent material which is excellent in mechanoluminescent properties and can achieve a mechanoluminescence intensity sufficiently suited to practical use, a raw material composition for producing the mechanoluminescent material, and a method for producing a mechanoluminescent material. The mechanoluminescent material of the present invention includes strontium aluminate as a base material, a Eu ion, and at least one ion selected from the group consisting of Nd, Dy, and Ho. An amount of the Eu ion contained in the mechanoluminescent material is 0.0001 to 0.1 mol per mole of the strontium aluminate. An amount of the at least one ion selected from the group consisting of Nd, Dy, and Ho contained in the mechanoluminescent material is, as the sum of amounts of the three ions Nd, Dy, and Ho, 0.0001 to 0.01 mol per mole of the strontium aluminate.

Abstract: A method for assembling a packaged semiconductor device includes mounting a pressure-sensing die onto a die paddle of a metal lead frame. A pressure-sensitive gel is dispensed into a recess of a lid, and the lead frame is mated with the lid such that the pressure-sensing die is immersed in the pressure-sensitive gel within the recess of the lid.

Abstract: A crystal form I of (S)-4-hydroxy-2-oxo-1-pyrrolidine acetamide, or named (S)-oxiracetam, is provided, which is characterized by a powder x-ray diffraction pattern that exhibits data of d-values versus the relative intensities as: 7.075(M), 5.355(S), 5.092(S), 4.590(M), 4.325(M), 4.259(S), 4.041(VS), 3.808(M), 3.542(M), 3.445(M), 3.393(M), 2.972(M), 2.914(S). A method for preparing a crystal form I of (S)-oxiracetam is also provided, which includes preparing the crude product and crystallizing A use of the crystal form I of (S)-oxiracetam in the manufacture of a medicament for preventing and treating memory dysfunction is also provided. Accordingly, the crystal form I of (S)-oxiracetam prepared by the method has high purity of more than 99.3% based on the percentages of the mass, with better efficacy than (S)-oxiracetam for preventing or treating memory dysfunction.

Abstract: Designs and techniques of Composite Right-Left Handed (CRLH) Metamaterial (MTM) antenna devices, including a CRLH MTM devices that include MTM cells formed on a substrate and a conductive launch stub formed on the substrate to be adjacent to each of the MTM cells and electromagnetically coupled to each of the MTM cells.

Abstract: An apparatus including an antenna having an active element and a parasitic element; and at least one support, where the antenna is at least partially on the at least one support, where the at least one support includes a first section coupled to a second different section, where the active element is at least partially on the first section, and where the first section is at least partially formed with a first manufacturing process and a first material. The parasitic element is at least partially on the second section, and the second section is at least partially formed with a second different manufacturing process and a second different material.

Abstract: An apparatus including an antenna having an active element and a parasitic element; and at least one support, where the antenna is at least partially on the at least one support, where the at least one support includes a first section coupled to a second different section, where the active element is at least partially on the first section, and where the first section is at least partially formed with a first manufacturing process and a first material. The parasitic element is at least partially on the second section, and the second section is at least partially formed with a second different manufacturing process and a second different material.

Abstract: An apparatus including an antenna; a first antenna carrier forming a first support substrate for a first portion of the antenna; and a different second antenna carrier forming a second support substrate for a second portion of the antenna. The first and second antenna carriers are coupled to each other. The antenna extends across a joint between the first and second antenna carriers.

Abstract: A method for detecting the integrity of a bond of a multi-piece work piece includes capturing a first image of the work piece, stressing the work piece, capturing a stressed image of the work piece, and comparing the first image of the work piece with the stressed image of the work piece to determine the integrity of the bond.

Abstract: A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units.

Abstract: A semiconductor device has first and semiconductor dies having active faces presenting electrical contact elements and back faces attached to first and second bonding areas side by side on an electrically conductive die support. A layer of electrically insulating material is applied to the first bonding area of the die support. A layer of electrically insulating adhesive bonding material attaches the back face of the first semiconductor die to the first bonding area of the die support through the layer of electrically insulating material. A layer of electrically conductive adhesive bonding material attaches the back face of the second semiconductor die to the second bonding area of the die support.

Abstract: Antennas for wireless communications based on metamaterial (MTM) structures to arrange one or more antenna sections of an MTM antenna away from one or more other antenna sections of the same MTM antenna so that the antenna sections of the MTM antenna are spatially distributed in a non-planar configuration to provide a compact structure adapted to fit to an allocated space or volume of a wireless communication device, such as a portable wireless communication device.

Abstract: Antenna structures and configurations which incorporate alignment keys and support structures which mate Composite Right and Left Handed (CRLH) metamaterial (MTM) structures formed on two or more substrates.