Abstract: A method and system for heating a circuit board component to an approximately uniform temperature sufficient to reflow the connections between the circuit board component and the circuit board. The method and system include a supplemental gas heater having a diffuser plate. The circuit board is placed against the diffuser plate and heated gas is channeled through openings in the diffuser plate into vias in the circuit board to heat a circuit board component connected on the opposite side of the circuit board. Heated gas can be channeled through selected vias towards predetermined areas and/or specified connections such as towards those areas or connections where there is a temperature differential greater than approximately 10 degrees Celsius compared to other areas or connections across the circuit board component. Hot gas can be channeled through selected vias by baffling or patterning the diffuser plate, accordingly.

Abstract: Disclosed are a tool and a procedure for flattening a site on a printed circuit board. The tool comprises three sections: a nozzle, a throat and a flattening block. The nozzle connects the tool to a hot air source and receives hot air from said source, and the throat is connected to the nozzle section for receiving the hot air from the nozzle section. The flattening block has a generally planar bottom surface for engaging a site on a printed circuit board. The flattening block forms a vent for venting the hot air from the flattening block to the ambient to help maintain said site at an approximately constant temperature when said bottom surface engages said site. A resilient mechanism is mounted on the throat section, for forcing said bottom surface against said site, with a constant, known force.