Abstract: An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.

Abstract: A heat sink attachment structure includes an integrated circuit chip mounted on a substrate surface, and a thermal interface layer in contact with the integrated circuit chip. A heat sink is in contact with the thermal interface layer, and at least one spacer member is in contact between the substrate surface and the heat sink, wherein the at least one spacer member is provided with an adhesive material on top and bottom surfaces thereof.

Abstract: A circuit board structure is described for facilitating engineering changes for a multichip module mounted on the circuit board. The structure includes a first layer of a conductive material overlying a portion of a surface of the circuit board, and a second layer overlying the first layer and in contact therewith. The second layer has openings therein; bonding pads are formed in the openings of the second layer. The bonding pads are of a conductive material and in contact with the first layer. The multichip module is surrounded by a hermetic seal on the second layer, so that a first bonding pad is inside a hermetically sealed area of the circuit board and a second bonding pad is outside the hermetically sealed area. An engineering change of the multichip module is performed by connecting the multichip module to the first bonding pad by a first wire inside the hermetically sealed area, and by connecting a second wire to the second bonding pad outside the hermetically sealed area.