Patents by Inventor Nao Honda
Nao Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240168380Abstract: The present invention relates to a photosensitive resin composition containing a cationic curable resin (A), a photocationic polymerization initiator (B), and a quencher (C), wherein the cationic curable resin (A) contains a polyfunctional epoxy resin (a-1) having a softening point of 50° C. or higher and/or an acid-modified product (a-2) of a polyfunctional epoxy resin having a softening point of 50° C. or higher in an amount of 60 mass % or more, and the quencher (C) is a compound represented by Formula (I) below: wherein R1 to R3 each independently represent an alkyl group or a phenyl group. R1 to R3 may be preferably phenyl groups. A dry film resist formed from the photosensitive resin composition and a cured product of the photosensitive resin composition are also disclosed.Type: ApplicationFiled: October 30, 2023Publication date: May 23, 2024Inventors: Masahiro Tagami, Naoki Kawamoto, Nao Honda
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Patent number: 11955394Abstract: A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.Type: GrantFiled: December 13, 2019Date of Patent: April 9, 2024Assignee: Nippon Kayaku Kabushiki KaishaInventors: Tadashi Naito, Nao Honda, Yoshihiro Hakone, Hiroki Oshida, Mamoru Sunada
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Publication number: 20220068737Abstract: A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.Type: ApplicationFiled: December 13, 2019Publication date: March 3, 2022Inventors: Tadashi Naito, Nao Honda, Yoshihiro Hakone, Hiroki Oshida, Mamoru Sunada
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Patent number: 10509316Abstract: The invention relates to polysulfonamide compositions for use as redistribution layers as used in the manufacture of semiconductors and semiconductor packages. More specifically it relates to photoimageable polysulfonamide composition for redistribution applications. The invention also relates to the use of the compositions in semiconductor manufacture.Type: GrantFiled: May 10, 2017Date of Patent: December 17, 2019Inventors: Daniel J Nawrocki, Qingzhou Cui, Nao Honda
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Patent number: 10241408Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).Type: GrantFiled: October 25, 2013Date of Patent: March 26, 2019Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Patent number: 10012901Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).Type: GrantFiled: November 21, 2013Date of Patent: July 3, 2018Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Publication number: 20170329222Abstract: The invention relates to polysulfonamide compositions for use as redistribution layers as used in the manufacture of semiconductors and semiconductor packages. More specifically it relates to photoimageable polysulfonamide composition for redistribution applications. The invention also relates to the use of the compositions in semiconductor manufacture.Type: ApplicationFiled: May 10, 2017Publication date: November 16, 2017Inventors: Daniel J. Nawrocki, Qingzhou Cui, Nao Honda
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Patent number: 9684239Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).Type: GrantFiled: October 25, 2013Date of Patent: June 20, 2017Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Patent number: 9448479Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.Type: GrantFiled: November 21, 2013Date of Patent: September 20, 2016Assignee: Nippon Kayaku Kabushiki KaishaInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Patent number: 9411229Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.Type: GrantFiled: June 19, 2012Date of Patent: August 9, 2016Assignee: Nippon Kayaku Kabushiki KaishaInventors: Shinya Inagaki, Nao Honda, Naoko Imaizumi, Misato Oonishi
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Patent number: 9223212Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.Type: GrantFiled: July 26, 2012Date of Patent: December 29, 2015Assignee: Nippon Kayaku Kabushiki KaishaInventors: Misato Oonishi, Shinya Inagaki, Naoko Imaizumi, Nao Honda
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Publication number: 20150309409Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyhydric phenol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). The reactive epoxy monomer (E) is a bisphenol epoxy resin.Type: ApplicationFiled: November 21, 2013Publication date: October 29, 2015Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Publication number: 20150301450Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).Type: ApplicationFiled: October 25, 2013Publication date: October 22, 2015Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Publication number: 20150293448Abstract: The purpose of the present invention is to provide: a photosensitive epoxy resin composition and/or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat/humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).Type: ApplicationFiled: October 25, 2013Publication date: October 15, 2015Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Publication number: 20150293444Abstract: The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).Type: ApplicationFiled: November 21, 2013Publication date: October 15, 2015Inventors: Naoko Imaizumi, Shinya Inagaki, Nao Honda
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Patent number: 8865392Abstract: Disclosed is a photosensitive resin composition containing a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in each molecule, which is characterized in that the cationic photopolymerization initiator (A) is a cationic photopolymerization initiator (A-1) that is represented by formula (1).Type: GrantFiled: July 13, 2011Date of Patent: October 21, 2014Assignee: Nippon Kayaku Kabushiki KaishaInventors: Misato Oonishi, Naoko Imaizumi, Ryo Sakai, Nao Honda, Tadayuki Kiyoyanagi
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Publication number: 20140186765Abstract: An alkali-developing-type photosensitive resin composition comprising: a polycarboxylic acid resin (A) obtained by reacting a polybasic anhydride (c) with a reactant (ab) between a difunctional bisphenol epoxy resin (a) having an epoxy group at both terminals and an epoxy equivalent of 600-1300 g/eq., and a monocarboxylic acid compound (b) having an alcoholic hydroxyl group; an epoxy resin (B) having two or more epoxy groups in a molecule; and a photoacid generator (C), wherein the addition ratio the monocarboxylic acid compound (b) with respect to 1 equivalent of the epoxy group of the epoxy resin (a) is 80 equivalent % or more, and the addition ratio the polybasic anhydride with respect to one equivalent of the primary hydroxyl group of the reactant (ab) is 80 equivalent % or more.Type: ApplicationFiled: July 26, 2012Publication date: July 3, 2014Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Misato Oonishi, Shinya Inagaki, Naoko Imaizumi, Nao Honda
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Publication number: 20140099581Abstract: A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.Type: ApplicationFiled: June 19, 2012Publication date: April 10, 2014Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Shinya Inagaki, Nao Honda, Naoko Imaizumi, Misato Oonishi
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Patent number: D772265Type: GrantFiled: March 19, 2015Date of Patent: November 22, 2016Assignee: PFU LimitedInventors: Nao Honda, Kiichi Taniho, Tetsuo Oda, Shinichiro Kamimaru
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Patent number: D782510Type: GrantFiled: March 19, 2015Date of Patent: March 28, 2017Assignee: PFU LimitedInventors: Nao Honda, Kiichi Taniho, Tetsuo Oda, Shinichiro Kamimaru