Abstract: A radio frequency module includes a mounting substrate including a first main surface and a second main surface opposite to the first main surface. A first electronic component is disposed on the first main surface of the mounting substrate. A second electronic component is disposed on the second main surface of the mounting substrate. A plurality of connection terminals are disposed on the second main surface of the mounting substrate. A wiring layer faces the second main surface of the mounting substrate. The wiring layer includes a plurality of external connection electrodes, each connected to at least one of the second electronic component and the plurality of connection terminals. At least one of the plurality of external connection electrodes overlaps the second electronic component when viewed in plan in a thickness direction of the substrate.

Abstract: A radio frequency module is provided that includes a plurality of power amplifiers, an external connection terminal, a filter, and a switch. The amplifiers include a first power amplifier and a second power amplifier. The external connection terminal is connected to a tracker component configured to supply a power supply voltage to the power amplifiers. Moreover, the filter is not disposed on a first path between the external connection terminal and the first power amplifier, but instead it is disposed on a second path between the external connection terminal and the second power amplifier. The switch is configured to switch connection to the external connection terminal between the first path and the second path.

Abstract: A radio-frequency module includes a module substrate and a power amplification circuit that includes first to fourth amplification elements, a transformer including primary and secondary coils, an output terminal to which the secondary coil is connected, and a circuit component disposed on the module substrate. Output terminals of the first and third amplification elements and output terminals of the second and fourth amplification elements are respectively connected to a first terminal and a second terminal of the primary coil. A capacitor is connected to a wiring line path connected between the output terminal of the first amplification element and the first terminal of the primary coil and to a wiring line path connected between the output terminal of the second amplification element and the second terminal of the primary coil. The primary or secondary coil includes a conductive layer surrounding at least part of the circuit component.

Abstract: A radio-frequency signal transmitting and receiving circuit includes a power amplifier, a transmission band pass filter configured to transmit a radio-frequency input signal, a first reception band pass filter configured to transmit a first radio-frequency reception signal, a first low-noise amplifier configured to amplify the first radio-frequency reception signal and output a first radio-frequency output signal, a first transmitting and receiving filter having a first end and a second end, the first end being electrically connected to a first antenna terminal, and a switch configured to electrically connect the transmission band pass filter to the second end of the first transmitting and receiving filter to output the radio-frequency input signal to the first antenna terminal and electrically connect the second end of the first transmitting and receiving filter to the first reception band pass filter to receive the first radio-frequency reception signal from the first antenna terminal.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a semiconductor integrated circuit (IC) that is on the second principal surface and includes a third principal surface and a fourth principal surface on opposite sides of the semiconductor IC; and an external-connection terminal on the second principal surface. In this radio frequency module, the third principal surface faces the second principal surface, and is closer to the second principal surface than the fourth principal surface is. The semiconductor IC includes: a reception low noise amplifier; and a ground electrode on the fourth principal surface.

Abstract: Improved is the isolation in a case in which a circuit element provided in a signal path for a transmission signal and a circuit element provided in a signal path for a reception signal are mounted on the same main surface of a mounting substrate. A radio frequency module includes the mounting substrate, a first, a second, and a third circuit elements, and a plurality of external connection terminals. The second circuit element and the third circuit element are mounted on a second main surface of the mounting substrate and are provided in signal paths for transmission and reception signals. The plurality of external connection terminals is arranged on the second main surface of the mounting substrate. The plurality of external connection terminals includes a ground terminal positioned between the second circuit element and the third circuit element in a plan view from a thickness direction of the mounting substrate.

Abstract: A radio-frequency signal transmitting and receiving circuit includes a power amplifier, a transmission band pass filter configured to transmit a radio-frequency input signal, a first reception band pass filter configured to transmit a first radio-frequency reception signal, a first low-noise amplifier configured to amplify the first radio-frequency reception signal and output a first radio-frequency output signal, a first transmitting and receiving filter having a first end and a second end, the first end being electrically connected to a first antenna terminal, and a switch configured to electrically connect the transmission band pass filter to the second end of the first transmitting and receiving filter to output the radio-frequency input signal to the first antenna terminal and electrically connect the second end of the first transmitting and receiving filter to the first reception band pass filter to receive the first radio-frequency reception signal from the first antenna terminal.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a semiconductor integrated circuit (IC) that is on the second principal surface and includes a third principal surface and a fourth principal surface on opposite sides of the semiconductor IC; and an external-connection terminal on the second principal surface. In this radio frequency module, the third principal surface faces the second principal surface, and is closer to the second principal surface than the fourth principal surface is. The semiconductor IC includes: a reception low noise amplifier; and a ground electrode on the fourth principal surface.

Abstract: A substrate for feeding cells and/or tissues which is composed of a porous body having a thin film surface and a porous surface and which can be used in the regenerative medical techniques. A cell/tissue feeder is produced by cultivating tissues on the porous surface of the porous body. Cells are seeded on the porous surface of the body, followed by the cultivation of the cells to thus form and/or regenerate tissues. An aqueous solution of silk proteins, to which a water-soluble organic solvent is added, is introduced into a mold whose bottom or top surface is surface-roughened, followed by freezing the aqueous solution and then thawing the frozen aqueous solution to form a porous body having a thin film surface and a porous surface.

Abstract: A substrate for feeding cells and/or tissues which is composed of a porous body having a thin film surface and a porous surface and which can be used in the regenerative medical techniques. A cell/tissue feeder is produced by cultivating tissues on the porous surface of the porous body. Cells are seeded on the porous surface of the body, followed by the cultivation of the cells to thus form and/or regenerate tissues. An aqueous solution of silk proteins, to which a water-soluble organic solvent is added, is introduced into a mold whose bottom or top surface is surface-roughened, followed by freezing the aqueous solution and then thawing the frozen aqueous solution to form a porous body having a thin film surface and a porous surface.

Abstract: The optimal design support system is to design a structure that outputs a desired load or displacement to a portion by using elastic deformation when a load or displacement is applied to a predetermined portion.

Abstract: A prosthetic knee joint enabling high-angle flexion includes the following members (a)-(c).