Abstract: There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1): (where R1 and R2 individually represent an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group or a halogenated, aminated or nitrated derivative of any of the groups) and a compound (ii) having a glycidyl group in a molecule thereof, and an inorganic particle (II); and the B agent contains a curing agent (III).

Abstract: A process for producing a composition of a polymerizable organic compound containing silica particles characterized by comprising: (a) a process of preparing an amine-added organic solvent-dispersed silica sol, in which an amine compound is added to an organic solvent-dispersed silica sol that contains colloidal silica particles having an average primary particle size of 5 to 100 nm and that has a pH of 2.5 to 4.0 at 20° C. as measured in a diluted solution obtained by a method in which the same mass of the organic solvent-dispersed silica sol, methanol, and pure water are mixed together, so that the diluted solution obtained by the mixing method has a pH of 4.5 to 11.0 at 20° C.; and (b) a process of mixing the amine-added organic solvent-dispersed silica sol obtained in the process (a) with a polymerizable organic compound.

Abstract: Colloidal silica particles dispersed in a reactive monomer may cause the polymerization, degradation, or the like of the reactive monomer by an action of the solid acidity of the surfaces of the particles and a monomer may be polymerized during a process for producing a monomer-dispersed silica sol, or a stable silica sol may not be obtained. In addition, a polymer of a resin formed article etc. obtained by curing a monomer-dispersed silica sol may be deteriorated, degraded, or the like with time. Therefore, there are provided a reactive monomer-dispersed silica sol having high stability by reducing the solid acidity of the surfaces of the colloidal silica particles contained in the reactive monomer-dispersed silica sol, and a production method thereof, and a curable composition using the reactive monomer-dispersed silica sol, and a cured article in which the deterioration, the degradation, or the like of the polymer is suppressed.

Abstract: A reactive monomer-dispersed silica sol having high stability by reducing the solid acidity of the surfaces of the colloidal silica particles contained in the reactive monomer-dispersed silica sol, and a production method thereof, and a curable composition using the reactive monomer-dispersed silica sol, and a cured article in which the deterioration, the degradation, or the like of the polymer is suppressed. A reactive monomer-dispersed silica sol containing a colloidal silica particle in which an alkaline earth metal ion is bonded to a surface of the colloidal silica particle.

Abstract: Disclosed is a conductive coating composition containing an organic solvent dispersion of an intrinsically conductive polymer such as a doped polyaniline or a doped polythiophene, and a binder. The conductive coating composition is characterized in that the binder contains a polymerizable monomer-dispersed silica sol, which is obtained by dispersing a colloidal silica into a polymerizable organic compound monomer. The composition provides a conductive thin film having high transparency and excellent strength.

Abstract: There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.

Abstract: The present invention provides an epoxy curing agent comprising colloidal silica particles, which is a liquid having low viscosity and excellent transparency and is suitable as a curing agent for a resin composition for sealing optical semiconductor elements. The epoxy curing agent comprises colloidal silica particles with an average primary particle size of from 5 to 40 nm and a fully saturated dicarboxylic anhydride which is a liquid at 30° C., and it has a light transmittance of at least 60% at a wavelength of 500 nm for a light path length of 10 mm when the concentration of the colloidal silica particles is adjusted to 10 mass %.

Abstract: A process for producing an inorganic oxide organosol that has good dispersibility and low viscosity, has excellent transparency, and shows good compatibility with resin solutions, and includes the steps (A) and (B) of: (A) adding silicon alkoxide having two or more alkoxy groups bonded to a silicon atom or having one or more hydroxy groups bonded to a silicon atom and one or more alkoxy groups bonded to a silicon atom to a hydrophilic inorganic oxide sol containing a hydrophilic solvent having a boiling point (1 atm) of 100° C. or less in an amount of 25 to 100% by weight in a dispersion medium to treat surface of the inorganic oxide particles in the sol; and (B) replacing the dispersion medium of the surface treated inorganic oxide sol obtained in step (A) with a non-alcoholic organic solvent in the presence of a primary alcohol having 3 to 12 carbon atoms.

Abstract: There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1): (where R1 and R2 individually represent an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group or a halogenated, aminated or nitrated derivative of any of the groups) and a compound (ii) having a glycidyl group in a molecule thereof, and an inorganic particle (II); and the B agent contains a curing agent (III).

Abstract: Colloidal silica particles dispersed in a reactive monomer may cause the polymerization, degradation, or the like of the reactive monomer by an action of the solid acidity of the surfaces of the particles and a monomer may be polymerized during a process for producing a monomer-dispersed silica sol, or a stable silica sol may not be obtained. In addition, a polymer of a resin formed article etc. obtained by curing a monomer-dispersed silica sol may be deteriorated, degraded, or the like with time. Therefore, there are provided a reactive monomer-dispersed silica sol having high stability by reducing the solid acidity of the surfaces of the colloidal silica particles contained in the reactive monomer-dispersed silica sol, and a production method thereof, and a curable composition using the reactive monomer-dispersed silica sol, and a cured article in which the deterioration, the degradation, or the like of the polymer is suppressed.

Abstract: The present invention relates to a polishing composition for silicon wafer comprising silica, a basic compound, a polyaminopolycarboxylic acid compound having hydroxy group, and water. The polishing composition can prevent metal contamination by nickel, chromium, iron, copper or the like, particularly copper contamination in polishing of silicon wafer.

Abstract: The present invention relates to a polishing composition for silicon wafer comprising silica; a basic compound; at least one compound selected from the group consisting of amino acid derivatives represented by formula (1) wherein R1, R2 and R3 are identical or different one another, C1-12alkylene group that may be substituted by hydroxyl group, carboxyl group, phenyl group or amino group, and formula (2) wherein R4 and R5 are identical or different each other, hydrogen atom, or C1-12alkyl group that may be substituted by hydroxyl group, carboxyl group, phenyl group or amino group, with a proviso that both R4 and R5 are not hydrogen at the same time, and R6 is C1-12alkylene group that may be substituted by hydroxyl group, carboxyl group, phenyl group or amino group, and the salts of the amino acid derivatives; and water. The polishing composition can prevent metal contamination, particularly copper contamination in polishing of silicon wafer.

Abstract: There provides an organosol of silica, wherein alkaline earth metal ions are bonded on surface of colloidal silica particles. The silica sol has a low solid acidity of silica, thus, in case where it is used in a mixture with a resin and the like, it can inhibit change of properties or decomposition, etc. of the resin, compared with silica sols that no alkaline earth metal is bonded to the surface of the particles. Further, the silica sol can be used as hard coat films for forming the surface of resin molded forms such as lenses, bottles, films or plates, or micro-fillers for thin films, resin internal agents, and the like.

Abstract: A process for producing an inorganic oxide organosol comprises the steps (A) and (B) of: (A) adding silicon alkoxide having two or more alkoxy groups bonded to a silicon atom or having one or more hydroxy groups bonded to a silicon atom and one or more alkoxy groups bonded to a silicon atom to a hydrophilic inorganic oxide sol containing a hydrophilic solvent having a boiling point (1 atm) of 100° C. or less in an amount of 25 to 100% by weight in a dispersion medium to treat surface of the inorganic oxide particles in the sol; and (B) replacing the dispersion medium of the surface treated inorganic oxide sol obtained in step (A) with a non-alcoholic organic solvent in the presence of a primary alcohol having 3 to 12 carbon atoms. The process gives an inorganic oxide organosol that has a good dispersibility and a low viscosity, is excellent in transparency, and shows a good compatibility with resin solutions.