Patents by Inventor Naohiro SEZAKI

Naohiro SEZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9024196
    Abstract: There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: May 5, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Masanao Yoneya, Kazunori Nakajima, Naohiro Sezaki, Kenji Kashiwagi, Akio Ikeya
  • Patent number: 8745275
    Abstract: A blade server apparatus including a plurality of server modules, a backplane for mounting the plurality of server modules thereon, and an SMP coupling device having wiring lines to SMP couple the plurality of server modules. Each of the server modules has one or more processors controlled by firmware and a module manager for managing its own server module, the module manager has an ID determiner for informing each processor of a processor ID, each processor has a processing unit and an SMP virtual connecting unit for instructing ones of wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted, and an ID converter for converting the processor ID and informing it to the SMP virtual connecting unit is provided within the firmware.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: June 3, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Akio Ikeya, Takashi Aoyagi, Kenji Kashiwagi, Naohiro Sezaki, Kazunori Nakajima
  • Publication number: 20120054469
    Abstract: A blade server apparatus including a plurality of server modules, a backplane for mounting the plurality of server modules thereon, and an SMP coupling device having wiring lines to SMP couple the plurality of server modules. Each of the server modules has one or more processors controlled by firmware and a module manager for managing its own server module, the module manager has an ID determiner for informing each processor of a processor ID, each processor has a processing unit and an SMP virtual connecting unit for instructing ones of wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted, and an ID converter for converting the processor ID and informing it to the virtual connecting unit is provided within the firmware.
    Type: Application
    Filed: August 15, 2011
    Publication date: March 1, 2012
    Inventors: AKIO IKEYA, Takashi Aoyagi, Kenji Kashiwagi, Naohiro Sezaki, Kazunori Nakajima
  • Publication number: 20110203834
    Abstract: There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.
    Type: Application
    Filed: January 6, 2011
    Publication date: August 25, 2011
    Applicant: HITACHI, LTD.
    Inventors: Masanao YONEYA, Kazunori NAKAJIMA, Naohiro SEZAKI, Kenji KASHIWAGI, Akio IKEYA