Patents by Inventor Naohisa Akashi

Naohisa Akashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10400090
    Abstract: Provided is a thermoplastic resin composition a resin molded article of which has excellent mechanical strength. The thermoplastic resin composition comprising: a thermoplastic resin; relative to 100 parts by weight of the thermoplastic resin, 0.01 to 30 parts by weight of an additive having a Mohs hardness of 5.5 or larger; and 10 to 200 parts by weight of glass fiber, wherein the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: September 3, 2019
    Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Masaki Tamura, Naohisa Akashi
  • Patent number: 10148006
    Abstract: Provided is a thermoplastic resin composition that allows a plated layer to be successfully formed on a surface of resin molded article obtained therefrom under a wide range of laser irradiation condition. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 0.1 to 10 parts by weight of a laser marking additive per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive comprises 70% by weight or more of a tin oxide.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: December 4, 2018
    Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Naohisa Akashi
  • Patent number: 9587316
    Abstract: Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: March 7, 2017
    Assignee: Mitsubishi Engineering-Plastics Corporation
    Inventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Naohisa Akashi
  • Publication number: 20150353714
    Abstract: Providing a thermoplastic resin composition from which a resin molded article having high mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 10 to 200 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.
    Type: Application
    Filed: September 5, 2013
    Publication date: December 10, 2015
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Takahiro TAKANO, Takahiko SUMINO, Kentarou ISHIHARA, Naohisa AKASHI
  • Publication number: 20150247243
    Abstract: Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.
    Type: Application
    Filed: September 5, 2013
    Publication date: September 3, 2015
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Naohisa Akashi
  • Publication number: 20150244066
    Abstract: Provided is a thermoplastic resin composition that allows a plated layer to be successfully formed on a surface of resin molded article obtained therefrom under a wide range of laser irradiation condition. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 0.1 to 10 parts by weight of a laser marking additive per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive comprises 70% by weight or more of a tin oxide.
    Type: Application
    Filed: September 5, 2013
    Publication date: August 27, 2015
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Naohisa Akashi
  • Publication number: 20150210835
    Abstract: Provided is a thermoplastic resin composition a resin molded article of which has excellent mechanical strength. The thermoplastic resin composition comprising: a thermoplastic resin; relative to 100 parts by weight of the thermoplastic resin, 0.01 to 30 parts by weight of an additive having a Mohs hardness of 5.5 or larger; and 10 to 200 parts by weight of glass fiber, wherein the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.
    Type: Application
    Filed: September 5, 2013
    Publication date: July 30, 2015
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Masaki Tamura, Naohisa Akashi
  • Patent number: 8945867
    Abstract: The present invention relates to a process for producing a desired polypeptide using rat cells. Specifically, the present invention relates to a process for producing the polypeptide which comprises culturing rat cells such as YB2/3HL.P2.G11.16Ag.20 (hereinafter referred to as YB2/0), preferably rat cells to which a recombinant DNA comprising DNA encoding a desired polypeptide such as an immunologically functional molecule is introduced, in a medium which does not contain serum (hereinafter referred to as a serum-free medium). Among the desired polypeptides obtained by the process of the present invention, an antibody obtained by using a transformant of YB2/0 has a high antibody-dependent cell-mediated cytotoxic activity (hereinafter sometimes referred to as ADCC activity) and is useful as a pharmaceutical agent.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: February 3, 2015
    Assignee: Kyowa Hakko Kirin Co., Ltd.
    Inventors: Tatsuya Ogawa, Yoshinobu Konno, Naohisa Akashi, Hiroshi Takasugi, Seiji Sugimoto, Keiichi Yano
  • Publication number: 20090203078
    Abstract: The present invention relates to a process for producing a desired polypeptide using rat cells. Specifically, the present invention relates to a process for producing the polypeptide which comprises culturing rat cells such as YB2/3HL.P2.G11.16Ag.20 (hereinafter referred to as YB2/0), preferably rat cells to which a recombinant DNA comprising DNA encoding a desired polypeptide such as an immunologically functional molecule is introduced, in a medium which does not contain serum (hereinafter referred to as a serum-free medium). Among the desired polypeptides obtained by the process of the present invention, an antibody obtained by using a transformant of YB2/0 has a high antibody-dependent cell-mediated cytotoxic activity (hereinafter sometimes referred to as ADCC activity) and is useful as a pharmaceutical agent.
    Type: Application
    Filed: February 2, 2009
    Publication date: August 13, 2009
    Inventors: Tatsuya OGAWA, Yoshinobu Konno, Naohisa Akashi, Hiroshi Takasugi, Seiji Sugimoto, Keiichi Yano
  • Patent number: 7504256
    Abstract: The present invention relates to a process for producing a desired polypeptide using rat cells. Specifically, the present invention relates to a process for producing the polypeptide which comprises culturing rat cells such as YB2/3HL.P2.G11.16Ag.20 (hereinafter referred to as YB2/0), preferably rat cells to which a recombinant DNA comprising DNA encoding a desired polypeptide such as an immunologically functional molecule is introduced, in a medium which does not contain serum (hereinafter referred to as a serum-free medium). Among the desired polypeptides obtained by the process of the present invention, an antibody obtained by using a transformant of YB2/0 has a high antibody-dependent cell-mediated cytotoxic activity (hereinafter sometimes referred to as ADCC activity) and is useful as a pharmaceutical agent.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: March 17, 2009
    Assignee: Kyowa Hakko Kogyo Co., Ltd.
    Inventors: Tatsuya Ogawa, Yoshinobu Konno, Naohisa Akashi, Hiroshi Takasugi, Seiji Sugimoto, Keiichi Yano