Abstract: Provided is a flux which is rosin-free and contains 50% by mass or more and 90% by mass or less of 2,4-diethyl-1,5-pentanediol, more than 0% by mass and less than 50% by mass of a solvent, 1% by mass or more and 15% by mass or less of an organic acid, wherein the total amount of the 2,4-diethyl-1,5-pentanediol and the solvent is 83% by mass or more and 99% by mass or less. This flux does not require washing with an organic detergent when transferred to solder balls is provided.

Abstract: A flux is provided which maintains activity by suppressing formation of an ester due to a reaction between an organic acid and a hydroxy group of an alcohol contained in a solvent and improves solderability. The flux includes: 40 mass % to 90 mass % of water; 2 mass % to 15 mass % of an organic acid; and greater than 0 mass % and less than or equal to 48 mass % of a solvent having a hydroxy group, in which when a molar mass % of all organic acid carboxyl group unit contained in the organic acid is regarded as 100 unit mol %, the content ratio of all carboxylic acid ester unit esterified by the organic acid and the hydroxy group which is contained in the solvent is 0 unit mol % to 50 unit mol %.

Abstract: A cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine. An addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight. The cleaning flux further includes one or both of an organic acid and a halogen compound. The addition amount of the organic acid is within the range of 0-18% by weight and the addition amount of the halogen compound is within the range of 0-4% by weight.

Abstract: Provided is a flux which is rosin-free and contains 50% by mass or more and 90% by mass or less of 2,4-diethyl-1,5-pentanediol, more than 0% by mass and less than 50% by mass of a solvent, 1% by mass or more and 15% by mass or less of an organic acid, wherein the total amount of the 2,4-diethyl-1,5-pentanediol and the solvent is 83% by mass or more and 99% by mass or less. This flux does not require washing with an organic detergent when transferred to solder balls is provided.

Abstract: A cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine. An addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight. The cleaning flux further includes one or both of an organic acid and a halogen compound. The addition amount of the organic acid is within the range of 0-18% by weight and the addition amount of the halogen compound is within the range of 0-4% by weight.

Abstract: An ice blasting apparatus comprises: an ice making device operating a cutting blade to shave off ice freezing on an inner wall of the freezing casing and continuously discharges the shaved ice as flake-shaped ice pellets; an ice mixing tank mixing the ice pellets and water and maintaining the resulting ice slurry at a predetermined concentration with a concentration sensor; and a blast gun blasting the ice slurry. A trimming method is performed on a film insert molding with a film material adhering to a face of a resin molding and extending beyond a periphery edge of the resin molding. A blast gun facing the face with the film adhering to it blasts ice slurry of a required concentration toward the vicinity of the periphery edge of the resin molding to remove the unnecessary portion of the film material extending beyond the periphery edge of the resin molding.

Abstract: In an apparatus for measuring the concentration of ice slurry, a pair of through holes 2 is provided in diametrically opposite positions in a pipe wall 9 of an ice-slurry pipe 1 through which ice slurry 8 flows. Leading ends 4 of optical fibers 3 are fitted respectively in the through holes 2. The other end of each of the optical fibers 3 is connected to a light-quantity measurement unit 6. The light-quantity measurement unit 6 measures the concentration of the ice slurry 8 on the basis of information about the light quantity sent from the optical fibers 3.

Abstract: An ice blasting apparatus comprises: an ice making device operating a cutting blade to shave off ice freezing on an inner wall of the freezing casing and continuously discharges the shaved ice as flake-shaped ice pellets; an ice mixing tank mixing the ice pellets and water and maintaining the resulting ice slurry at a predetermined concentration with a concentration sensor; and a blast gun blasting the ice slurry. A trimming method is performed on a film insert molding with a film material adhering to a face of a resin molding and extending beyond a periphery edge of the resin molding. A blast gun facing the face with the film adhering to it blasts ice slurry of a required concentration toward the vicinity of the periphery edge of the resin molding to remove the unnecessary portion of the film material extending beyond the periphery edge of the resin molding.

Abstract: Ice grains of uniform grain size are produced through the change of state of supercooled water and the ice grains are mixed into cold water for obtaining an ice slurry of proper concentration. The ice slurry is injected from an injection means to the surface of a workpiece. As the ice grains are fine and uniform and they are injected with water in the state of ice slurry of stable concentration, a surface processing of a soft workpiece susceptible to damage can be performed without causing damage, and the cleaning of the processed surface is performed concurrently with the surface processing, eliminating the necessity of after cleaning. The apparatus is compact and the initial cost is low. The energy needed for preparing the ice slurry is small.

Abstract: A solder coating apparatus for coating lead sections of a lead frame, including a liquid solder bath and a coating block having a first slit-like passage therethrough for permitting a lead frame to pass through the block and a second passage of enlarged cross section communicating with and extending along the first passage for permitting the lead frame package to pass through the block. A pair of liquid solder supply slits are formed in the block and communicates with the first passage along the length thereof and on opposite sides of the second passage. A pump at least partially immersed in the liquid solder bath provides for positive supply of liquid solder to and through the slits into the first passage to coat the lead sections. A conduit connects between the delivery side of the pump and the liquid solder supply slits.

Abstract: A lead frame having thereon a plurality of semiconductor devices is prepared by immersing it in a flux solution to activate the lead frame surface and to remove oxide film. The lead frame is then transferred to a coating block unit, and the lead frame is moved along a lateral passage which extend through the coating block unit. During movement through the passage, the lead sections of the lead frame are coated on both upper and lower surfaces thereof with liquid solder which ascends by capillary action along a slit which projects upwardly from a liquid solder bath and communicates with the passage. The solder in the slit, where it communicates with the passage, is continually replenish by capillary action from the bath as the solder coats the lead sections as the lead frame moves through the passage.

Abstract: A lead frame having thereon a plurality of semiconductor devices is prepared by immersing it in a flux solution to activate the lead frame surface and to remove oxide film. The lead frame is then transferred to a coating block unit, and the lead frame is moved along a lateral passage which extend through the coating block unit. During movement through the passage, the lead sections of the lead frame are coated on both upper and lower surfaces thereof with liquid solder which ascends by capillary action along a slit which projects upwardly from a liquid solder bath and communicates with the passage. The solder in the slit, where it communicates with the passage, is continually replenish by capillary action from the bath as the solder coats the lead sections as the lead frame moves through the passage.

Abstract: A pair of solder coating rolls are disposed horizontally adjacent one another for rotation about parallel horizontal axes, and are spaced apart to define a narrow vertically-oriented nip therebetween for accommodating a lead frame therein. Lower parts of the rolls contact a solder bath, and counter rotation of the rolls carries the solder upwardly on the periphery of the rolls to create a small pool of solder at the upper end of the nip. The lead frame is driven vertically upwardly through the nip, which nip has a minimal dimension greater than the lead frame thickness. The lead frame is driven vertically upwardly at a linear speed which is different from, and preferably slower than, the peripheral speed fo the solder coating rolls. This enables preheating of the surface of the lead frame due to its longer exposure to and contact with the hot solder which coats the periphery of the rolls, thereby improving the wetability of the lead frame surface.