Patents by Inventor Naoki Azuma
Naoki Azuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11991831Abstract: A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.Type: GrantFiled: August 4, 2020Date of Patent: May 21, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hideaki Katou, Naoki Azuma, Koji Sakurai, Masanori Ikeda
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Patent number: 11987408Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: GrantFiled: June 22, 2023Date of Patent: May 21, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroki Kobayashi, Naoki Azuma, Chikara Takata, Yuzo Asano, Toru Chikuma, Hiroshi Satoh
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Patent number: 11946962Abstract: An analysis system includes inference processer circuitry configured to infer a corresponding classification by inputting part of frequency spectrum data corresponding to reference measurement data to a learned model having learned a relation between part of frequency spectrum data corresponding to sample measurement data and a classification related to noise corresponding to the part, causal component identification processer circuitry configured to identify causal component data of noise from a component data list based on the inferred classification, and a presentation information generator configured to generate presentation information for a user based on the causal component data.Type: GrantFiled: December 16, 2021Date of Patent: April 2, 2024Assignee: TOYO CorporationInventors: Congbing Li, Kazu Kitagawa, Nozomu Miura, Tetsuya Nakamura, Naoki Azuma
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Patent number: 11925753Abstract: The disclosure provides a liquid administering device capable of accurately administering a liquid to a predetermined part in a nasal cavity. A liquid administering device 2 includes a main body 4, a first nozzle 6 that protrudes from the main body 4 in a predetermined direction and dispenses a liquid while being inserted into one nasal cavity 28a of a user, and a second nozzle 8 that protrudes from the main body 4 in the predetermined direction and is inserted into the other nasal cavity 28b of the user to position the first nozzle 6 with respect to one nasal cavity 28a.Type: GrantFiled: May 2, 2021Date of Patent: March 12, 2024Assignee: FUNAI ELECTRIC CO., LTD.Inventors: Hideki Tanabe, Ryo Yonekawa, Naoki Motobayashi, Akihiro Azuma
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Publication number: 20230331413Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: ApplicationFiled: June 22, 2023Publication date: October 19, 2023Inventors: HIROKI KOBAYASHI, NAOKI AZUMA, CHIKARA TAKATA, YUZO ASANO, TORU CHIKUMA, HIROSHI SATOH
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Patent number: 11724842Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: GrantFiled: January 6, 2023Date of Patent: August 15, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroki Kobayashi, Naoki Azuma, Chikara Takata, Yuzo Asano, Toru Chikuma, Hiroshi Satoh
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Publication number: 20230253761Abstract: A method for manufacturing a laser diode element includes preparing a stacked body including a nitride semiconductor substrate, a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. Element regions are defined by planned cleavage lines and planned division lines. The stacked body defines protrusions each including first and second side surfaces, and a ridge. Lower ends of the first and second side surfaces are located below a lower surface of the active layer. A first distance from the first side surface to the ridge is different from a second distance from the second side surface to the ridge. The first distance is the same for all of the protrusions in the at least one of the element regions. The stack body is cleaved from the first side surface to the second side surface.Type: ApplicationFiled: May 31, 2021Publication date: August 10, 2023Inventor: Naoki AZUMA
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Publication number: 20230146855Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: ApplicationFiled: January 6, 2023Publication date: May 11, 2023Inventors: HIROKI KOBAYASHI, NAOKI AZUMA, CHIKARA TAKATA, YUZO ASANO, TORU CHIKUMA, HIROSHI SATOH
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Patent number: 11584552Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: GrantFiled: January 6, 2022Date of Patent: February 21, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroki Kobayashi, Naoki Azuma, Chikara Takata, Yuzo Asano, Toru Chikuma, Hiroshi Satoh
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Publication number: 20220386517Abstract: A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.Type: ApplicationFiled: August 4, 2020Publication date: December 1, 2022Inventors: HIDEAKI KATOU, NAOKI AZUMA, KOJI SAKURAI, MASANORI IKEDA
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Publication number: 20220252646Abstract: An analysis system includes inference processer circuitry configured to infer a corresponding classification by inputting part of frequency spectrum data corresponding to reference measurement data to a learned model having learned a relation between part of frequency spectrum data corresponding to sample measurement data and a classification related to noise corresponding to the part, causal component identification processer circuitry configured to identify causal component data of noise from a component data list based on the inferred classification, and a presentation information generator configured to generate presentation information for a user based on the causal component data.Type: ApplicationFiled: December 16, 2021Publication date: August 11, 2022Applicant: TOYO CorporationInventors: Congbing LI, Kazu KITAGAWA, Nozomu MIURA, Tetsuya NAKAMURA, Naoki AZUMA
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Publication number: 20220127028Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: ApplicationFiled: January 6, 2022Publication date: April 28, 2022Inventors: HIROKI KOBAYASHI, NAOKI AZUMA, CHIKARA TAKATA, YUZO ASANO, TORU CHIKUMA, HIROSHI SATOH
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Patent number: 11293626Abstract: A light emitting component mounting method for holding a light emitting component with a light emitter by a mounting head and mounting the light emitting component on a board is provided. The method includes energizing the light emitter to emit a light, measuring a luminance distribution of the light emitter and detecting a position of a luminance distribution center in the light emitter based on the measured luminance distribution.Type: GrantFiled: January 15, 2019Date of Patent: April 5, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hideaki Katou, Koji Sakurai, Masanori Ikeda, Naoki Azuma
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Patent number: 11266026Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.Type: GrantFiled: December 23, 2020Date of Patent: March 1, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Ryota Inoue, Naoki Azuma
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Patent number: 11254456Abstract: There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: GrantFiled: July 16, 2020Date of Patent: February 22, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hiroki Kobayashi, Naoki Azuma, Chikara Takata, Yuzo Asano, Toru Chikuma, Hiroshi Satoh
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Publication number: 20210291484Abstract: The present disclosure provides a laminated structure with a through hollow structure having heat insulation, a light weight, durability, and sound absorption performance to reduce wind noise, transmitted noise, and the like. The laminated structure of the present disclosure has a foamed resin layer having continuous pores containing fused resin foam particles, and an air-impermeable outer layer provided on one side of the foamed resin layer, where a part of the foamed resin layer of the laminated structure cut out with a diameter of 41.5 mm? has an amount of air permeability of 2.5 cm3/(cm2·s) to 40 cm3/(cm2·s) measured by the Frazier method in which the foamed resin layer is set as an air introduction side.Type: ApplicationFiled: August 1, 2019Publication date: September 23, 2021Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Naoki AZUMA, Tetsuo NAKAMOTO
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Publication number: 20210112667Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.Type: ApplicationFiled: December 23, 2020Publication date: April 15, 2021Inventors: Ryota INOUE, Naoki AZUMA
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Patent number: 10912203Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.Type: GrantFiled: March 1, 2019Date of Patent: February 2, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Ryota Inoue, Naoki Azuma
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Publication number: 20200346800Abstract: There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.Type: ApplicationFiled: July 16, 2020Publication date: November 5, 2020Inventors: HIROKI KOBAYASHI, NAOKI AZUMA, CHIKARA TAKATA, YUZO ASANO, TORU CHIKUMA, HIROSHI SATOH
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Patent number: 10821468Abstract: A workpiece holding body holding a workpiece having a three-dimensional shape is swung around a lateral swing axis to position the workpiece so that one mounting surface of the workpiece faces a predetermined worked direction and a viscous substance is printed on the one mounting surface of the workpiece which is positioned. The workpiece holding body is swung around the swing axis to position the workpiece so that another mounting surface of the workpiece in which the viscous substance is printed on one mounting surface faces the worked direction and to print the viscous substance on the other mounting surface of the workpiece which is positioned.Type: GrantFiled: February 19, 2018Date of Patent: November 3, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoshinori Isobata, Masayuki Mantani, Naoki Azuma, Seiji Mizuoka, Takahiro Endo