Abstract: A semiconductor circuitry includes a first circuitry having a differential transistor pair and a pair of current sources connected in series to the differential transistor pair, a pair of transmission lines connected to the differential transistor pair at the opposite side to the current sources, and a second circuitry, connected to a node between the differential transistor pair and the current sources, and configured to test operations of at least the differential transistor pair and a latter-stage circuity connected to the transmission lines, in the state where the current outputs of the pair of current sources are stopped.

Abstract: A semiconductor circuitry includes a first circuitry having a differential transistor pair and a pair of current sources connected in series to the differential transistor pair, a pair of transmission lines connected to the differential transistor pair at the opposite side to the current sources, and a second circuitry, connected to a node between the differential transistor pair and the current sources, and configured to test operations of at least the differential transistor pair and a latter-stage circuity connected to the transmission lines, in the state where the current outputs of the pair of current sources are stopped.

Abstract: According to an embodiment, a control circuit of an equalizer configured to set a first amount to a linear equalizer, determine a second amount optimizing a non-linear equalizer with respect to a first signal generated by the linear equalizer to which the first amount is set, set the second amount to the non-linear equalizer, update an amount from the first amount to a third amount smaller than the first amount based on a magnitude of the first amount, set the third amount to the linear equalizer, determine a fourth amount optimizing the non-linear equalizer with respect to a second signal generated by the linear equalizer to which the third amount is set, and update an amount from the second amount to the fourth amount.

Abstract: According to one embodiment, an equalizer circuit includes a nonlinear equalizer including: a determination circuit configured to generate a second signal indicating a digital value of a first signal, based on a first clock signal; a clock generation circuit configured to generate a second clock signal having a time constant of a falling edge larger than a time constant of a rising edge, based on the first clock signal; and a feedback circuit configured to generate a third signal by feeding back the second signal to the first signal, based on the second clock signal.

Abstract: According to one embodiment, an equalizer circuit includes a nonlinear equalizer including: a determination circuit configured to generate a second signal indicating a digital value of a first signal, based on a first clock signal; a clock generation circuit configured to generate a second clock signal having a time constant of a falling edge larger than a time constant of a rising edge, based on the first clock signal; and a feedback circuit, configured to generate a third signal by feeding back the second signal to the first signal, based on the second clock signal.

Abstract: According to an embodiment, a control circuit of an equalizer configured to set a first amount to a linear equalizer, determine a second amount optimizing a non-linear equalizer with respect to a first signal generated by the linear equalizer to which the first amount is set, set the second amount to the non-linear equalizer, update an amount from the first amount to a third amount smaller than the first amount based on a magnitude of the first amount, set the third amount to the linear equalizer, determine a fourth amount optimizing the non-linear equalizer with respect to a second signal generated by the linear equalizer to which the third amount is set, and update an amount from the second amount to the fourth amount.

Abstract: In the vane pump comprising the housing, the vane, and the cap, the sliding surface of the cap is configured as arc shape in the view from the rotational axis direction and the width toward the sliding direction of the cap is configured to be smaller than the width at the sliding angle field which is virtual area for contacting the inner surface of the pump room among the circumference including the arc shape of the sliding surface of the cap and to be bigger than the width at the high loading area where the load added to the sliding surface which is bigger than the predetermined value among the sliding angle field.

Abstract: In the vane pump comprising the housing, the vane, and the cap, the sliding surface of the cap is configured as arc shape in the view from the rotational axis direction and the width toward the sliding direction of the cap is configured to be smaller than the width at the sliding angle field which is virtual area for contacting the inner surface of the pump room among the circumference including the arc shape of the sliding surface of the cap and to be bigger than the width at the high loading area where the load added to the sliding surface which is bigger than the predetermined value among the sliding angle field.

Abstract: There is disclosed a thermoplastic resin composition comprising as principal components a [A] thermoplastic resin having a functional group reactive with an amino group, a [B] olefinic polymer and/or styrenic polymer, the subtotal of the above [A]+[B] being 100 parts by weight, and 0.

Abstract: A novel formamide group-containing copolymer, or a salt thereof, which can be used as a high-molecular weight amino reagent, a starting material for functional high-molecular weight compounds, a starting material for adhesives, a polymer compatibilizer, a resin modifier, etc., and can undergo hydrolysis to give a copolymer containing a primary amino group, and a novel copolymer containing a primary amino group obtained by hydrolysis.

Abstract: A process for producing a novel formamide group-containing copolymer, or a salt thereof, which can be used as a high-molecular weight amino reagent, a starting material for functional high-molecular weight compounds, a starting material for adhesives, a polymer compatibilizer, a resin modifier, etc.

Abstract: Thermoplastic resin compositions having the following component A-1 or A-2, component B and component C:(A-1): a polymer component having a functional group capable of reacting with an amino group, or(A-2): a composition of component (A-1) and a resin that is non-reactive with an amino group and is different from the resin used in the following component B(B) a thermoplastic resin component that is non-reactive with an amino group under the conditions required to mold the entire resin composition; and(C) a graft copolymer obtained by a graft reaction of a thermoplastic polymer, with a compound (I), or a copolymer having the repeating unit (II) and the repeating unit of an ethylenic unsaturated monomer, ##STR1## wherein R.sup.1 -R.sup.4, the same or different represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group.