Abstract: A molten iron refining method having, an auxiliary material, and an oxidizing gas supplied through a top-blowing lance, to a cold iron source and molten pig iron that are contained/fed in a converter-type vessel, and molten iron is subjected to a refining process. A pre-charged cold iron source is charged into the converter-type vessel at an amount not larger than 0.15 times. A furnace-top-added cold iron source that's part or all of the cold iron source and added from a furnace top is fed during the refining process. A burner at a leading end of the top-blowing lance that spray holes through which a fuel and a combustion-supporting gas are ejected. During the refining process, a powdery auxiliary material processed into powder that's part of the auxiliary material is blown in, to pass through a flame formed by the burner.

Abstract: A one-chip type magnetic sensor is provided in which thin-film anisotropic magnetoresistance elements are formed on an IC substrate. Applied magnetic fields can be detected in the magnetic sensor in vertical and horizontal directions, and detection sensitivity can be adjusted with respect to direction. The influence on a magnetic-sensitive property can be suppressed when another magnetic field is applied from another direction. A semiconductor substrate, lead frame, and lead frame(s) are accommodated in a package in the magnetic sensor. Thin-film magnetoresistance elements are formed on the substrate, which includes an electric circuit having comparison and amplification functions. The lead frame is used to mount the semiconductor substrate thereon. The lead frames are connected to the semiconductor substrate, which is attached to a semiconductor attachment surface.

Abstract: A one-chip type magnetic sensor is provided in which thin-film anisotropic magnetoresistance elements are formed on an IC substrate. Applied magnetic fields can be detected in the magnetic sensor in vertical and horizontal directions, and detection sensitivity can be adjusted with respect to direction. The influence on a magnetic-sensitive property can be suppressed when another magnetic field is applied from another direction. A semiconductor substrate, lead frame, and lead frame(s) are accommodated in a package in the magnetic sensor. Thin-film magnetoresistance elements are formed on the substrate, which includes an electric circuit having comparison and amplification functions. The lead frame is used to mount the semiconductor substrate thereon. The lead frames are connected to the semiconductor substrate, which is attached to a semiconductor attachment surface.