Abstract: There is provided a semiconductor device including a semiconductor substrate, the semiconductor device including: a sensing portion that is provided on the semiconductor substrate and that is configured to detect predetermined physical information; a sensing pad portion that is provided above an upper surface of the semiconductor substrate and that is connected to the sensing portion; a gate runner which is provided above the upper surface of the semiconductor substrate and to which a gate potential is applied; and one or more separated conductive portions in which each separated conductive portion is provided between the sensing pad portion and the semiconductor substrate and that is separated from the gate runner.

Abstract: There is provided a semiconductor device including: a pad portion that is provided above the upper surface of the semiconductor substrate and that is separated from the emitter electrode; a wire wiring portion that is connected to a connection region on an upper surface of the pad portion; a wiring layer that is provided between the semiconductor substrate and the pad portion and that includes a region overlapping the connection region; an interlayer dielectric film that is provided between the wiring layer and the pad portion and that has a through hole below the connection region; a tungsten portion that contains tungsten and that is provided inside the through hole and electrically connects the wiring layer and the pad portion; and a barrier metal layer that contains titanium and that is provided to cover an upper surface of the interlayer dielectric film below the connection region.

Abstract: A resin enclosure includes: an inner wall portion from a wall surface defining the space to a side surface of the lead terminal close to the space; and a covering portion that covers at least a part of a top surface of a first portion of the lead terminal.

Abstract: Provided is a semiconductor device that can improve yield and non-defective rate by obtaining the thickness of a melt-bonding material and suppressing inclination of a circuit board. The semiconductor device includes a circuit board including a circuit pattern layer, a semiconductor element mounted on the circuit board, a melt-bonding portion arranged on an upper surface of the circuit pattern layer, a bonding lead including a bonding portion facing the upper surface of the circuit pattern layer and electrically connected to the circuit pattern layer via the melt-bonding portion, and a pressing portion directly contacted with an upper surface of the circuit board.

Abstract: Provided is a semiconductor device that can improve yield and non-defective rate by obtaining the thickness of a melt-bonding material and suppressing inclination of a circuit board. The semiconductor device includes a circuit board including a circuit pattern layer, a semiconductor element mounted on the circuit board, a melt-bonding portion arranged on an upper surface of the circuit pattern layer, a bonding lead including a bonding portion facing the upper surface of the circuit pattern layer and electrically connected to the circuit pattern layer via the melt-bonding portion, and a pressing portion directly contacted with an upper surface of the circuit board.

Abstract: A semiconductor device includes a lead frame. One end portion of the lead frame is disposed outside a case, the other end portion of the lead frame is disposed over a front surface of an insulating board inside the case and near a semiconductor element, and the lead frame is formed in the case. Furthermore, the semiconductor device includes a temperature transducer disposed on a side of the other end portion of the lead frame opposite a laminated substrate and near a side portion of a semiconductor element. As a result, the temperature transducer is disposed near the side portion of the semiconductor element in the semiconductor device. Therefore, the temperature of the semiconductor element is properly detected. In addition, the length in the vertical direction of the case of the semiconductor device is reduced and miniaturization is realized.

Abstract: An in-vehicle device includes an operation screen display unit that displays a specific operation screen containing an operation key for causing the in-vehicle device to perform a specific action, an operation key moving unit that moves the operation key in a predetermined direction, a camera and a movement recognition unit that detect a movement of part of a body of a user or a movement of an operation member held by the user, and an operation selection unit that, when a movement direction of the operation key matches a direction of the detected movement of the user, selects the operation key moved by the operation key moving unit.

Abstract: A semiconductor device includes a lead frame. One end portion of the lead frame is disposed outside a case, the other end portion of the lead frame is disposed over a front surface of an insulating board inside the case and near a semiconductor element, and the lead frame is formed in the case. Furthermore, the semiconductor device includes a temperature transducer disposed on a side of the other end portion of the lead frame opposite a laminated substrate and near a side portion of a semiconductor element. As a result, the temperature transducer is disposed near the side portion of the semiconductor element in the semiconductor device. Therefore, the temperature of the semiconductor element is properly detected. In addition, the length in the vertical direction of the case of the semiconductor device is reduced and miniaturization is realized.

Abstract: A semiconductor device has an insulating substrate, a semiconductor element which is mounted on the insulating substrate, a hollow casing which surrounds a peripheral edge of the insulating substrate to contain the semiconductor element therein, and a sealing material which is charged into the casing to seal the inside of the casing. The casing has protrusion portions each of which partially protrudes from an upper surface of the casing. Thus, it is possible to provide a semiconductor device in which poor external appearance or lowering of adhesion to a cover can be prevented even when a sealing material is injected up to the vicinity of an upper surface of a casing.

Abstract: A semiconductor device has an insulating substrate, a semiconductor element which is mounted on the insulating substrate, a hollow casing which surrounds a peripheral edge of the insulating substrate to contain the semiconductor element therein, and a sealing material which is charged into the casing to seal the inside of the casing. The casing has protrusion portions each of which partially protrudes from an upper surface of the casing. Thus, it is possible to provide a semiconductor device in which poor external appearance or lowering of adhesion to a cover can be prevented even when a sealing material is injected up to the vicinity of an upper surface of a casing.

Abstract: A system and method for displaying a web page prevents an operation error when the contents of display of the web page change. A vehicle-mounted device includes a touch panel and an input processor for performing an input operation corresponding to a position of contact of an indicator with a display screen. A proximity sensor and an indicator detector detects that the indicator has a predetermined positional relationship relative to the screen. A web browser obtains data on the web page, and a rendering engine performs web page display processing, including web page analysis processing and screen layout calculation for the data obtained. A display processor and a display device for displaying the web page subjected to the web page display processing are included. When the indicator has the predetermined positional relationship relative to the display screen, the web page display processing is stopped.

Abstract: An in-vehicle device includes an operation screen display unit that displays a specific operation screen containing an operation key for causing the in-vehicle device to perform a specific action, an operation key moving unit that moves the operation key in a predetermined direction, a camera and a movement recognition unit that detect a movement of part of a body of a user or a movement of an operation member held by the user, and an operation selection unit that, when a movement direction of the operation key matches a direction of the detected movement of the user, selects the operation key moved by the operation key moving unit.