Patents by Inventor Naoki Shibata
Naoki Shibata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160274317Abstract: An opto-electric hybrid board according to the present invention includes a substrate including an insulation layer and a metal reinforcement layer. An electric circuit part is provided on the front surface of the substrate, and an optical waveguide part is provided on the back surface thereof. The metal reinforcement layer includes an optical coupling through hole and an alignment through hole. The electric circuit part includes an electrical interconnect line, an optical element, a first alignment mark for positioning of a mirror part, and a second alignment mark for positioning of the optical element. The mirror part of the optical waveguide part is positioned with respect to the first alignment mark visually recognized through the alignment through hole, and the optical element of the electric circuit part is positioned with respect to the second alignment mark.Type: ApplicationFiled: October 15, 2014Publication date: September 22, 2016Applicant: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Naoki Shibata
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Publication number: 20160266338Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and each including a first electric wiring of an electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion defined on a portion of the insulation layer extending from the opto-electric module portions, and including an optical waveguide optically coupled with the optical elements. A metal reinforcement layer provided on a back surface of the insulation layer extending over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present the interconnection portion has a smaller width than the opto-electric module portions, and the smaller width portion has rounded proximal corners.Type: ApplicationFiled: September 11, 2014Publication date: September 15, 2016Applicant: NITTO DENKO CORPORATIONInventors: Naoki Shibata, Yuichi Tsujita
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Patent number: 9417384Abstract: An opto-electric hybrid module is provided, which is excellent in bending resistance and optical element mountability. In the opto-electric hybrid module, a light-path core of an optical waveguide is provided on a surface of an under-cladding layer, and non-light-path dummy cores are provided on opposite sides of the light-path core in spaced relation to the light-path core as projecting from the surface of the under-cladding layer. An electric circuit having mounting pads is provided on top surfaces of the dummy cores. An over-cladding layer is provided on side surfaces and a top surface of the light-path core, and projects to cover the core. The non-light-path dummy cores each have an elastic modulus that is set higher than the elastic modulus of the under-cladding layer and the elastic modulus of the over-cladding layer. The optical element is mounted on the mounting pads, and positioned above the projecting over-cladding layer.Type: GrantFiled: May 7, 2014Date of Patent: August 16, 2016Assignee: NITTO DENKO CORPORATIONInventors: Naoyuki Tanaka, Yasuto Ishimaru, Naoki Shibata, Yuichi Tsujita
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Publication number: 20160231520Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.Type: ApplicationFiled: September 11, 2014Publication date: August 11, 2016Applicant: NITTO DENKO CORPORATIONInventors: Naoki Shibata, Yuichi Tsujita
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Publication number: 20160216464Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively provided on opposite end portions of an elongated insulation layer and including a first electric wiring of a first electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion provided on a portion of the insulation layer extending from the opto-electric module portions, and including an elongated optical waveguide on a back surface of the insulation layer optically coupled with the optical elements, and having a light signal transmission core. Further, an electrically conductive dummy pattern is provided on the front surface of the insulation layer in the interconnection portion for reinforcing the interconnection portion. The electrically conductive dummy pattern reinforces the interconnection portion to protect the waveguide from bending and twisting, while ensuring the flexibility of the interconnection portion.Type: ApplicationFiled: June 24, 2014Publication date: July 28, 2016Applicant: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Naoki Shibata
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Publication number: 20160219181Abstract: An image forming apparatus includes an image scanning section, an exit tray, and an upper housing. The image scanning section scans an image of an original document. The exit tray is disposed below the image scanning section. A sheet bearing an image is ejected onto the exit tray. The upper housing houses the image scanning section. The image forming apparatus has a sheet ejection space that is formed between the exit tray and the upper housing. A user's hand is inserted into the sheet ejection space for taking out the sheet from the exit tray. The upper housing includes a bottom plate having a surface that faces the exit tray. The bottom plate includes a plurality of reinforcing members that are disposed on the surface of the bottom plate and that extend in a direction in which the user takes out the recording medium from the exit tray.Type: ApplicationFiled: January 22, 2016Publication date: July 28, 2016Applicant: KYOCERA Document Solutions Inc.Inventor: Naoki SHIBATA
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Publication number: 20160209748Abstract: There are provided a liquid processing method, a liquid processing apparatus and a recording medium for liquid processing which can enhance the uniformity of the coating state of a processing liquid on a substrate. A coating unit U1 includes a rotary holder 20 for rotating a wafer W, a nozzle 32 for supplying a processing liquid R onto a surface Wa of the wafer W, and a controller 60 for controlling the position of the nozzle 32 with respect to the wafer W.Type: ApplicationFiled: December 9, 2015Publication date: July 21, 2016Inventors: Takafumi HASIMOTO, Shinichi HATAKEYAMA, Naoki SHIBATA
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Patent number: 9395505Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. The opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit includes fitting holes for fitting engagement with the aligning protrusion, the fitting holes being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide. The connector and the opto-electric hybrid unit are coupled together.Type: GrantFiled: December 11, 2013Date of Patent: July 19, 2016Assignee: NITTO DENKO CORPORATIONInventors: Naoki Shibata, Yuichi Tsujita, Naoyuki Tanaka, Shotaro Masuda
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Publication number: 20160179189Abstract: With a vehicle-mounted equipment operating device, upon receipt of an input from an operator by an operation input unit, and when any one of a plurality of vehicle-mounted instruments, for example, an air conditioner, exists on a line of sight of the operator, a control unit sets the vehicle-mounted instrument that exists on the line of sight as an operation target device, and thereafter, the control unit controls the operation target device based on the input of the operator that has been received by the operation input unit.Type: ApplicationFiled: February 13, 2015Publication date: June 23, 2016Inventor: Naoki Shibata
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Publication number: 20160178863Abstract: An opto-electric hybrid module is provided which has a linear light-path core and an electric circuit including mounting pads and an electric circuit body provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted with its electrodes in abutment against the mounting pads. The electric circuit body and a portion of the surface of the under-cladding layer other than a core formation portion and an electric circuit formation portion are covered with a stack including a core material layer and an over-cladding material layer. A surface portion of the stack present between the mounting pads and the electric circuit body is located at a lower height position than a surface portion of the stack present on the electric circuit body.Type: ApplicationFiled: July 3, 2014Publication date: June 23, 2016Applicant: NITTO DENKO CORPORATIONInventors: Naoyuki TANAKA, Yasuto ISHIMARU, Naoki SHIBATA, Yuichi TSUJITA
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Publication number: 20160167079Abstract: There is provided a coating method which can apply a coating solution uniformly onto a substrate surface while reducing the amount of the coating solution supplied. The coating method for applying a coating solution onto a wafer includes the steps of: supplying a solvent for the coating solution onto the wafer to form an annular liquid film of the solvent in a peripheral area of the wafer; supplying the coating solution to the center of the wafer while rotating the wafer at a first rotational speed (time t1-t2); and allowing the coating solution to spread on the wafer by rotating the wafer at a second rotational speed which is higher than the first rotational speed (time t4-t5). The supply of the solvent is continued until just before the coating solution comes into contact with the liquid film of the solvent (time t0-t3).Type: ApplicationFiled: December 9, 2015Publication date: June 16, 2016Inventors: Takafumi HASIMOTO, Shinichi HATAKEYAMA, Naoki SHIBATA, Kousuke YOSHIHARA, Minoru KUBOTA, Hiroyuki IDE
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Publication number: 20160131834Abstract: An opto-electric hybrid module is provided, which is excellent in bending resistance and optical element mountability. In the opto-electric hybrid module, a light-path core of an optical waveguide is provided on a surface of an under-cladding layer, and non-light-path dummy cores are provided on opposite sides of the light-path core in spaced relation to the light-path core as projecting from the surface of the under-cladding layer. An electric circuit having mounting pads is provided on top surfaces of the dummy cores. An over-cladding layer is provided on side surfaces and a top surface of the light-path core, and projects to cover the core. The non-light-path dummy cores each have an elastic modulus that is set higher than the elastic modulus of the under-cladding layer and the elastic modulus of the over-cladding layer. The optical element is mounted on the mounting pads, and positioned above the projecting over-cladding layer.Type: ApplicationFiled: May 7, 2014Publication date: May 12, 2016Applicant: NITTO DENKO CORPORATIONInventors: Naoyuki Tanaka, Yasuto Ishimaru, Naoki Shibata, Yuichi Tsujita
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Publication number: 20160116690Abstract: An opto-electric hybrid module is provided, which is configured so that no air bubbles are present in a sealing resin which seals a space defined between an optical waveguide and an optical element. In the opto-electric hybrid module, an electric circuit is provided directly on an over-cladding layer of the optical waveguide, and the optical element is provided on predetermined portions (mounting pads) of the electric circuit. The over-cladding layer has a projection which covers a core, and a center portion of the optical element is positioned above the projection with the intervention of a sealing resin.Type: ApplicationFiled: March 31, 2014Publication date: April 28, 2016Applicant: NITTO DENKO CORPORATIONInventors: Naoyuki Tanaka, Naoki Shibata, Yuichi Tsujita, Shotaro Masuda
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Patent number: 9292472Abstract: A vehicular display apparatus on a vehicle includes a display device which displays a magnitude of an acceleration which is being detected by an acceleration sensor on a display unit, and also displays a magnitude of an acceleration detected by the acceleration sensor when an ESC controller generated a braking force on road wheels on the display unit.Type: GrantFiled: May 24, 2013Date of Patent: March 22, 2016Assignee: HONDA MOTOR CO., LTD.Inventors: Naotoshi Fujimoto, Kentaro Kegai, Naoki Shibata
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Publication number: 20160070075Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.Type: ApplicationFiled: March 7, 2014Publication date: March 10, 2016Applicant: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Naoki Shibata, Naoyuki Tanaka, Shotaro Masuda
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Patent number: 9229366Abstract: A developer storage container includes a container main body, a developer discharge port, a moving shaft, a moving plate, a guide portion and an elastic member. The container main body includes a wall defining an internal storing space. The developer discharge port is arranged at a predetermined position of the container main body. The moving shaft is arranged to extend in a first direction in the internal space. The moving plate moves in the first direction along the moving shaft in the internal space and conveys the developer toward the developer discharge port. The guide portion guides a movement of the moving plate in the first direction while maintaining the posture of the moving plate. The elastic member is attached to the moving plate and slides in contact with an inner surface of the wall of the container main body when the moving plate moves in the first direction.Type: GrantFiled: December 23, 2014Date of Patent: January 5, 2016Assignee: KYOCERA Document Solutions Inc.Inventor: Naoki Shibata
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Patent number: 9214339Abstract: Group III nitride semiconductor having reduced threading dislocation density and uniform Ga-polar surface is provided. Forming a capping layer on a buffer layer containing Al as an essential element at a temperature lower than a temperature at which an oxide of element constituting the buffer layer is formed. Heat treating the substrate having the buffer layer covered by the capping layer at a temperature higher than a temperature at which a crystal of body semiconductor grows without exposing the surface of the buffer layer. The substrate temperature is decreased to a temperature at which a crystal of the body semiconductor grows and the body semiconductor is grown.Type: GrantFiled: February 11, 2014Date of Patent: December 15, 2015Assignee: TOYODA GOSEI CO., LTD.Inventors: Koji Okuno, Takahide Oshio, Naoki Shibata, Hiroshi Amano
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Publication number: 20150355422Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. The opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit includes fitting holes for fitting engagement with the aligning protrusion, the fitting holes being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide. The connector and the opto-electric hybrid unit are coupled together.Type: ApplicationFiled: December 11, 2013Publication date: December 10, 2015Applicant: NITTO DENKO CORPORATIONInventors: Naoki Shibata, Yuichi Tsujita, Naoyuki Tanaka, Shotaro Masuda
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Patent number: 9209021Abstract: A first side surface of post of the first stripe is formed so that a plane which is most parallel to the first side surface among low-index planes of the growing Group III nitride semiconductor is a m-plane (10-10), and a first angle between the first lateral vector obtained by orthogonally projecting a normal vector of the first side surfaces to the main surface and a m-axis projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing semiconductor to the main surface is from 0.5° to 6°. A second side surface of post of the second stripe is formed so that a plane which is most parallel to the second side surface among low-index planes of the growing semiconductor is an a-plane (11-20), and a second angle between the second lateral vector and an a-axis projected vector of the a-plane is from 0° to 10°.Type: GrantFiled: May 29, 2014Date of Patent: December 8, 2015Assignee: TOYODA GOSEI CO., LTD.Inventors: Koji Okuno, Takahide Oshio, Naoki Shibata, Hiroshi Amano
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Patent number: 9190268Abstract: A method for producing a Ga-containing group III nitride semiconductor having reduced threading dislocation is disclosed. A buffer layer in a polycrystal, amorphous or polycrystal/amorphous mixed state, comprising AlGaN is formed on a substrate. The substrate having the buffer layer formed thereon is heat-treated at a temperature higher than a temperature at which a single crystal of a Ga-containing group III nitride semiconductor grows on the buffer layer and at a temperature that the Ga-containing group III nitride semiconductor does not grow, to reduce crystal nucleus density of the buffer layer as compared with the density before the heat treatment. After the heat treatment, the temperature of the substrate is decreased to a temperature that the Ga-containing group III nitride semiconductor grows, the temperature is maintained, and the Ga-containing group III nitride semiconductor is grown on the buffer layer.Type: GrantFiled: March 4, 2013Date of Patent: November 17, 2015Assignee: TOYODA GOSEI CO. LTD.Inventors: Koji Okuno, Takahide Oshio, Naoki Shibata, Hiroshi Amano