Abstract: A milling tool includes a cylindrical base and a plurality of abrasive grain clusters. The cylindrical base is centrally formed with a through-hole, and has an annular surface extending around the through-hole, a peripheral surface extending perpendicularly to the annular surface, and an inclined or rounded surface connecting the annular and peripheral surfaces. The annular surface is formed with a circular recess groove coaxially with the through-hole for separating the annular surface into first and second planar areas that respectively are closer to and farther from the peripheral surface. The second planar area is higher than the first planar area. Abrasive grains are brazed on the annular surface. The abrasive grain clusters are brazed on the inclined surface at predetermined intervals, each cluster including a predetermined number of abrasive grains having substantially the same diameter, each cluster being positioned substantially on a circumference almost equidistant from one another.

Abstract: A milling tool includes a cylindrical base and a plurality of abrasive grain clusters. The cylindrical base is centrally formed with a through-hole, and has an annular surface extending around the through-hole, a peripheral surface extending perpendicularly to the annular surface, and an inclined or rounded surface connecting the annular and peripheral surfaces. The annular surface is formed with a circular recess groove coaxially with the through-hole for separating the annular surface into first and second planar areas that respectively are closer to and farther from the peripheral surface. The second planar area is higher than the first planar area. Abrasive grains are brazed on the annular surface. The abrasive grain clusters are brazed on the inclined surface at predetermined intervals, each cluster including a predetermined number of abrasive grains having substantially the same diameter, each cluster being positioned substantially on a circumference almost equidistant from one another.

Abstract: A CMP pad conditioner is provided with a grinding part formed by fixing abrasive grains on a metal base by soldering, wherein the grinding part has a flat part near an inner periphery and an inclined part near an outer periphery, wherein abrasive grains having regular shapes are fixed to the flat part, and wherein abrasive grains having acute shapes are fixed to the inclined part.

Abstract: A CMP pad conditioner is provided with a grinding part formed by fixing abrasive grains on a metal base by soldering, wherein the grinding part has a flat part near an inner periphery and an inclined part near an outer periphery, wherein abrasive grains having regular shapes are fixed to the flat part, and wherein abrasive grains having acute shapes are fixed to the inclined part.

Abstract: A CMP pad conditioner including: (a) a disk-shaped substrate having a working surface which is provided by one of its axially opposite end surfaces and which is to be brought into contact with the CMP pad; and (b) abrasive grains which are fixed to the working surface. The substrate includes a radially inner portion and a radially outer portion which is located radially outwardly of the radially inner portion. The working surface in the radially outer portion is inclined with respect to the working surface in the radially inner portion, such that a thickness of the radially outer portion as measured in an axial direction of the substrate is reduced as viewed in a direction away from an axis of the substrate toward a periphery of the substrate. A ratio of an outside diameter of the radially inner portion to an outside diameter of the substrate is 60–85%.

Abstract: A CMP pad conditioner including: (a) a disk-shaped substrate having a working surface which is provided by one of its axially opposite end surfaces and which is to be brought into contact with the CMP pad; and (b) abrasive grains which are fixed to the working surface. The substrate includes a radially inner portion and a radially outer portion which is located radially outwardly of the radially inner portion. The working surface in the radially outer portion is inclined with respect to the working surface in the radially inner portion, such that a thickness of the radially outer portion as measured in an axial direction of the substrate is reduced as viewed in a direction away from an axis of the substrate toward a periphery of the substrate. A ratio of an outside diameter of the radially inner portion to an outside diameter of the substrate is 60-85%.

Abstract: A grinding wheel having a tool portion formed by firmly fixing diamond grains to an end face of a cup-shaped core by brazing. A circumferentially continuous groove is formed in a substantially central portion of the end face of the core. The abrasive grains are firmly fixed to an end face portion excluding regions near an outer rim and near an inner rim of the end face and near the boundaries with the groove under the condition that, with respect to all the abrasive grains, skirts of a brazing material layer for holding the abrasive grains have a length one or more times an average grain size of the abrasive grains. The provision of the groove in the end face of the core can enhance the capability of ejecting chips that occur during machining; besides, chips can be captured in the groove to preclude the occurrence of scratches resulting from the chips.

Abstract: A grinding wheel having a tool portion formed by firmly fixing diamond grains to an end face of a cup-shaped core by brazing. A circumferentially continuous groove is formed in a substantially central portion of the end face of the core. The abrasive grains are firmly fixed to an end face portion excluding regions near an outer rim and near an inner rim of the end face and near the boundaries with the groove under the condition that, with respect to all the abrasive grains, skirts of a brazing material layer for holding the abrasive grains have a length one or more times an average grain size of the abrasive grains. The provision of the groove in the end face of the core can enhance the capability of ejecting chips that occur during machining; besides, chips can be captured into the groove to preclude the occurrence of scratches resulting from the chips.