Patents by Inventor Naoki Yotsumoto

Naoki Yotsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8847491
    Abstract: An electric light bulb type light source apparatus includes a light source unit, a power source substrate, a drive substrate, a base, and a casing. On the power source substrate, a power source circuit is mounted, and the power source substrate has one of a through hole and a cutout. On the drive substrate, a drive circuit of at least the light source unit is mounted, and the drive substrate includes a part disposed in the one of the through hole and the cutout of the power source substrate. The base is used to supply power to the power source substrate. The casing is configured to contain the light source unit, the power source substrate, and the drive substrate, and the casing has a translucent cover.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: September 30, 2014
    Assignee: Sony Corporation
    Inventors: Naoki Yotsumoto, Kouji Miyata
  • Patent number: 8547502
    Abstract: It is to provide a light source module capable of downsizing an edge-light type backlight in thickness and reducing the usage amount of resin. A method of manufacturing a light source module includes a process of preparing a substrate with a first reflector including a reflecting surface mounted thereon, a process of mounting a plurality of light emitting elements on the substrate, a process of mounting a wiring board having an electrode on the substrate, a process of connecting the electrode of the light emitting element and the electrode of the wiring board with metal wire, a process of mounting a second reflector having a reflecting surface on the wiring board, and a process of filling the space between the first reflector and the second reflector, with resin.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: October 1, 2013
    Assignee: Hitachi Consumer Electronics Co., Ltd.
    Inventors: Norio Nakazato, Kimihiko Sudo, Hiroshi Akai, Naoki Yotsumoto, Hiroshi Oyama, Shigeyuki Sasaki, Atsushi Hatakeyama, Takaaki Maruyama, Kouichi Tanabe
  • Patent number: 7671534
    Abstract: When a long illuminant module is constructed, debonding of a bonded interface or bending occurs due to a difference in a magnitude of thermal deformation between a lens material and a metal substrate. In an illuminant module including light emitting elements, a substrate on which the light emitting elements are mounted, a transparent encapsulating resin which encapsulates the light emitting elements, and a lens material having cavities formed therein, in which the respective light emitting elements and transparent encapsulating resin are stored, notches are formed in a surface of the lens material on the side of the substrate, and the notch surfaces of the notches and the surface of the substrate are bonded using a bonding material.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: March 2, 2010
    Assignee: Hitachi Lighting, Ltd.
    Inventors: Yasushi Kinoshita, Norio Nakazato, Naoki Yotsumoto, Keisuke Nishimura, Daisuke Nakahara
  • Patent number: 7527409
    Abstract: An edge light display unit includes light generating sources, a substrate mounting the light generating sources, a lens, a diffusion plate expanding light input in a side surface of the diffusion plate as to irradiate a front surface of the diffusion plate, and a heat sink thermally contacted with the substrate. A base portion of the heat sink has a substrate mounting surface and a fin constituting surface substantially perpendicular to the substrate mounting surface. At least one fin extends from the fin constituting surface in a direction substantially perpendicular thereto and along the plurality of light generating sources in a direction parallel to substrate. An air supply and exhaust surface of a cooling air are formed in a back surface side of the display unit.
    Type: Grant
    Filed: September 25, 2006
    Date of Patent: May 5, 2009
    Assignee: Hitachi, Ltd,
    Inventors: Takayuki Atarashi, Shuichi Terakado, Hiroshi Akai, Naoki Yotsumoto
  • Publication number: 20090103005
    Abstract: It is to provide a light source module capable of downsizing an edge-light type backlight in thickness and reducing the usage amount of resin. A method of manufacturing a light source module includes a process of preparing a substrate with a first reflector including a reflecting surface mounted thereon, a process of mounting a plurality of light emitting elements on the substrate, a process of mounting a wiring board having an electrode on the substrate, a process of connecting the electrode of the light emitting element and the electrode of the wiring board with metal wire, a process of mounting a second reflector having a reflecting surface on the wiring board, and a process of filling the space between the first reflector and the second reflector, with resin.
    Type: Application
    Filed: October 21, 2008
    Publication date: April 23, 2009
    Inventors: Norio NAKAZATO, Kimihiko SUDO, Hiroshi Akai, Naoki Yotsumoto, Hiroshi Oyama, Shigeyuki Sasaki, Atsushi Hatakeyama, Takaaki Maruyama, Kouichi Tanabe
  • Publication number: 20070076433
    Abstract: When a long illuminant module is constructed, debonding of a bonded interface or bending occurs due to a difference in a magnitude of thermal deformation between a lens material and a metal substrate. In an illuminant module including light emitting elements, a substrate on which the light emitting elements are mounted, a transparent encapsulating resin which encapsulates the light emitting elements, and a lens material having cavities formed therein, in which the respective light emitting elements and transparent encapsulating resin are stored, notches are formed in a surface of the lens material on the side of the substrate, and the notch surfaces of the notches and the surface of the substrate are bonded using a bonding material.
    Type: Application
    Filed: September 27, 2006
    Publication date: April 5, 2007
    Inventors: Yasushi Kinoshita, Norio Nakazato, Naoki Yotsumoto, Keisuke Nishimura, Daisuke Nakahara
  • Publication number: 20070076431
    Abstract: In the case that the LED is used as a light source for a backlight such as a display unit or the like, if a lot of current is circulated for securing a brightness, a lot of heat is generated in view of a characteristic of the LED, so that the LED comes to a high temperature, and there is a problem that the characteristic of the LED itself is deteriorated such as a light output is lowered, a long-term service life can not secured, or the like. Further, in the case that a temperature difference exists between a plurality of LEDs, there is a problem that it appears as a brightness irregularity of a screen of the display unit.
    Type: Application
    Filed: September 25, 2006
    Publication date: April 5, 2007
    Inventors: Takayuki Atarashi, Shuichi Terakado, Hiroshi Akai, Naoki Yotsumoto