Abstract: Provided is an X-ray inspection device having a pair of conveyor frames that is disposed symmetrically with respect to a center line as an axis along a substrate conveying direction, and clamps a printed substrate in a substrate width direction. A substrate conveying mechanism conveys in an X axis direction the printed substrate supported by the conveyor frames. A distance adjustment mechanism drives the pair of conveyor frames so that the conveyor frames approach or depart from each other in the Y axis direction, thereby adjusting the width dimension of a printed substrate that can be conveyed by the substrate conveying mechanism disposed on each of the conveyor frames.

Abstract: Disclosed is an inspection machine provided with an imaging device that capture a close-up image of the imaging target portion of the printed circuit board on which a plurality of electronic components are mounted, by coming close to a printed circuit board. The inspection machine has a sensor unit that detects the heights of the electronic components on the printed circuit board by irradiation light in a first direction that is along the surface of the printed circuit board. Control means of the inspection machine sets a limit distance to a position above the highest electronic component among heights detected from the electronic components. The control means also restricts a facing distance by which the imaging device is accepted to approach the printed circuit board, to be the limit distance.

Abstract: Provided is an X-ray inspection device having a pair of conveyor frames that is disposed symmetrically with respect to a center line as an axis along a substrate conveying direction, and clamps a printed substrate in a substrate width direction. A substrate conveying mechanism conveys in an X axis direction the printed substrate supported by the conveyor frames. A distance adjustment mechanism drives the pair of conveyor frames so that the conveyor frames approach or depart from each other in the Y axis direction, thereby adjusting the width dimension of a printed substrate that can be conveyed by the substrate conveying mechanism disposed on each of the conveyor frames.

Abstract: Disclosed is an inspection machine provided with an imaging device that capture a close-up image of the imaging target portion of the printed circuit board on which a plurality of electronic components are mounted, by coming close to a printed circuit board. The inspection machine has a sensor unit that detects the heights of the electronic components on the printed circuit board by irradiation light in a first direction that is along the surface of the printed circuit board. Control means of the inspection machine sets a limit distance to a position above the highest electronic component among heights detected from the electronic components. The control means also restricts a facing distance by which the imaging device is accepted to approach the printed circuit board, to be the limit distance.