Abstract: A microphone assembly including a main board and a microphone. The microphone includes a capacitor or a MEMS chip, a case accommodating the capacitor or the MEMS chip, and a microphone board electrically connected to the capacitor or the MEMS chip. The microphone board has a larger outer dimension than the case and includes a fixing portion and a connecting portion. The case is fixed onto the fixing portion. The connecting portion is a portion of the microphone board, the portion being located outside the case and electrically and mechanically connected to the main board.

Abstract: A microphone assembly including a main board and a microphone. The microphone includes a capacitor or a MEMS chip, a case accommodating the capacitor or the MEMS chip, and a microphone board electrically connected to the capacitor or the MEMS chip. The microphone board has a larger outer dimension than the case and includes a fixing portion and a connecting portion. The case is fixed onto the fixing portion. The connecting portion is a portion of the microphone board, the portion being located outside the case and electrically and mechanically connected to the main board.

Abstract: Affixed in intimate contact to the inside surface of a front board 10a of a conductive capsule 10 provided with a receiving sound aperture 10aa is a conductive back electrode board provided with air vent apertures 11a, 11b which are positioned not in alignment with the receiving sound aperture, these apertures 10a and 11a, 11b being connected by a slit 10ad. A polarized FEP film 12 which is an electret film is disposed on the surface of the back electrode board 11 opposite from the front board 10a, and a conductive diaphragm 14 is disposed on the surface of the FEP 12 opposite from the back electrode board 11 with a spacer 13 interposed therebetween which extends around the outer periphery of the opposite surface of the FEP 12. These component parts are accommodate in the capsule 10 to constitute an electret condenser microphone which is capable of suppressing sensitivity degradation due to ingress of grit from the outside to the electret film.

Abstract: An electret-condenser microphone according to the present invention includes a vibrating diaphragm and a back electrode which compose a condenser; a cylindrical case which houses the vibrating diaphragm and the back electrode; a circuit board which is housed in an opening of the cylindrical case, is fixed to the opening by crimping a crimp edge formed by bending an opening end of the cylindrical case inward, and covers the opening; and a substrate fastened to an outer surface of the circuit board. A circular pattern and annular pattern are formed on the outer surface of the circuit board and a circular pattern and annular pattern are formed on that surface of the substrate which is farther from the circuit board. The circular pattern and annular pattern are connected with the circular pattern and annular pattern via thru-holes in the substrate, and that surface of the substrate on which and are formed serves as a reflow-soldering surface.

Abstract: Affixed in intimate contact to the inside surface of a front board 10a of a conductive capsule 10 provided with a receiving sound aperture 10aa is a conductive back electrode board provided with air vent apertures 11a, 11b which are positioned not in alignment with the receiving sound aperture, these apertures 10a and 11a, 11b being connected by a slit 10ad. A polarized FEP film 12 which is an electret film is disposed on the surface of the back electrode board 11 opposite from the front board 10a, and a conductive diaphragm 14 is disposed on the surface of the FEP 12 opposite from the back electrode board 11 with a spacer 13 interposed therebetween which extends around the outer periphery of the opposite surface of the FEP 12. These component parts are accommodate in the capsule 10 to constitute an electret condenser microphone which is capable of suppressing sensitivity degradation due to ingress of grit from the outside to the electret film.