Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate for a printed wiring board includes an insulating base, a first conductive layer that is stacked on the insulating base, and a second conductive layer that is stacked on the first conductive layer, in which the first conductive layer is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer is a plating layer.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate for a printed wiring board includes an insulating base, a first conductive layer that is stacked on the insulating base, and a second conductive layer that is stacked on the first conductive layer, in which the first conductive layer is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer is a plating layer.

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer.

Abstract: Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.

Abstract: Provided is an adhesive resin composition containing (A) an epoxy resin and/or a phenoxy resin; (B) an epoxy-containing styrene copolymer containing a monomer unit having an epoxy group and a styrene monomer unit; (C) a thermoplastic resin; and (D) a curing agent, in which the content percentage of the epoxy-containing styrene copolymer (B) relative to the total amount of the resin components contained in the adhesive resin composition is 3% to 25% by mass. The adhesive resin composition is a halogen-free adhesive composition having good flame retardancy and a high peel strength. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.

Abstract: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer.

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract: Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.

Abstract: A method for producing an organic crystal is disclosed. One embodiment comprises maintaining a capillary tube containing a fused liquid of an organic crystal material and having a fused liquid reservoir at one end thereof at a temperature not less than the fusion point of the organic crystal material together with the fused liquid reservoir, reducing the temperature of the fused liquid in the fused liquid reservoir to precipitate seed crystals, and then slowly cooling the capillary tube successively from the end toward the other end to allow a single crystal to grow from the seed crystal in the capillary tube. Because of the large quantity of the fused liquid, a seed crystal can be formed and allowed to grow even from a fused liquid of an organic crystal material which hardly crystallizes in the form of a fused liquid.

Abstract: An optical wavelength conversion module having a laser light source, a lens system for managing the laser beam, and a conversion element. The laser light source generates a beam of laser light of a substantially circular cross-section having an aspect ratio of 1.3 or less. The substantially circular beam is collimated and condensed by the lenses and directed into the core of the conversion element which then emits converted light. The optical wavelength conversion module is small in size and produces converted light with high efficiency.

Abstract: An optical fiber device comprising an optical fiber comprising a core made of an organic crystal and a cladding made of glass, the device generating second harmonics of a laser light that has been launched into the core, the device further comprising a buffer layer on at least one end faces of the optical fiber, and a water barrier layer on the surface of the buffer layer, the buffer layer being such that the organic crystal of the core is not dissolved therein.

Abstract: A fiber-type wavelength converting device comprises a nonlinear optical crystal core; and a glass cladding surrounding the core that produces a second harmonic utilizing Cherenkov radiation. An exit end face of the cladding is flat, and an exit end face of the core has asperities. The exit end face of the core is formed inside with respect to the exit end face of the cladding, and particles may be filled in a recess portion composed of a bottom surface of the exit end face of the core and side surface of an inner wall of the cladding. The cladding has an outer diameter of at least 1 mm to prevent breakage of device upon polishing and grinding. A thin film may be formed on an input end face of the device.

Abstract: An apparatus and method of manufacturing a wavelength converter of an optical fiber type, having a core and a clad covering the core. At least one of the core and clad is made of a nonlinear optical material such that copious amounts of second harmonic light are emitted form a light emitting end face of the optical fiber. Grooves and/or flanges are formed in or on the clad or a transparent layer covering the clad. The transparent layer also covers the light emitting end face of the optical fiber. A collimating surface is formed on the transparent layer at the light emitting end face for collimating the second harmonic light emitted. Various molds are used to form different collimating surfaces, grooves, and flanges in and on the transparent layer.

Abstract: An optical wavelength conversion module includes a semiconductor laser light source; a lens for focusing semiconductor laser light; and a fiber-type optical wavelength converter with a core and a clad having a refractive index lower than the core. At least one of the core and clad is formed of a non-linear optical material. The number of longitudinal modes of oscillation of the semiconductor laser light source is not less than three.

Abstract: A light source unit for receiving and transmitting information to and from an optical disk or the like, which reshapes an elliptical in cross-section beam of laser light into a circular in cross-section beam of laser light by a beam shaping assembly composed of at least one lens having a cylindrical surface and an optical axis, the cylindrical surface having generatrix lines that are perpendicular to the optical axis of the lens, where the circularly shaped beam of laser light then enters a wavelength converter for generation of a second harmonic (half wavelength of the fundamental).

Abstract: In a wavelength converter, nonlinear medium layers containing material having an increased second order susceptibility, and linear medium layers, not containing material having a nonlinear optical characteristic of the second degree, are alternatively layered. A fundamental wave (of which the angular frequency is .omega.) is incident on the multi-layered structure in a direction normal to the major surfaces of the nonlinear medium layers and the linear medium layers, thereby generating the second harmonic of the fundamental wave (of which the angular frequency is 2.omega.). The thickness of each of the linear and nonlinear medium layers is selected to be an odd-number times as long as the coherence length. The wavelength can be converted utilizing the diagonal element d.sub.ii of the second degree, nonlinear optical tensor.

Abstract: A light source device that converts a beam of light radiated from an optical fiber-type second-harmonic generating element to a parallel beam of light filled with a bundle of rays up to a central portion of the parallel beam by causing a portion of the beam of light to pass through an apex of a conical surface. The light source device is unlikely to be affected by the spherical aberrations of members constituting an optical system such as lenses, which makes it unnecessary to make the component members of the optical sysem special, thereby simplifying the optical system.

Abstract: A method for the production of a thin film on an end surface of a fiber made up of a core of an organic material, and a clad made of glass. This method involves the steps of placing the fiber in a vacuum chamber, reducing the pressure in the chamber, cutting the fiber under reduced pressure, and either simultaneously, or immediately after cutting the fiber, forming a thin film on the cut surface of the fiber.

Abstract: A method of coating the ends of a fiber wavelength-conversion element with a macromolecular film. This serves to protect the crystal core and change in quality without changing the state of the core end surface.