Patents by Inventor Naoto Kawamura

Naoto Kawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020191054
    Abstract: The invention is a fluid ejection device, such as a printhead, that has a substrate with a first surface mating to an orifice layer, preferably through a stack of thin-film layers. The orifice layer defines a fluid chamber interfacing to an orifice opening or nozzle. The substrate has a second surface having a truncated pyramidal structure; either polyhedral or triangular ridge shaped defining an opening through the substrate to the fluid chamber. The substrate further has an ejection element, preferably disposed as a resistor in the stack of thin-film layers. When energy is transferred from the ejection element to the fluid in the fluid chamber, fluid is ejected from the orifice opening. The fluid ejection device may have one or a plurality of fluid chambers and one or a plurality of frustums of a truncated polyhedral, truncated pyramidal, truncated conical or truncated triangular cross-sectional ridge structures defining openings from the second surface of the substrate to the fluid chambers.
    Type: Application
    Filed: July 29, 2002
    Publication date: December 19, 2002
    Inventors: Qin Liu, Naoto Kawamura, Chien-Hua Chen
  • Patent number: 6481832
    Abstract: The invention is a fluid ejection device, such as a printhead, that has a substrate with a first surface mating to an orifice layer, preferably through a stack of thin-film layers. The orifice layer defines a fluid chamber interfacing to an orifice opening or nozzle. The substrate has a second surface having a truncated pyramidal structure; either polyhedral or triangular ridge shaped defining an opening through the substrate to the fluid chamber. The substrate further has an ejection element, preferably disposed as a resistor in the stack of thin-film layers. When energy is transferred from the ejection element to the fluid in the fluid chamber, fluid is ejected from the orifice opening. The fluid ejection device may have one or a plurality of fluid chambers and one or a plurality of frustums of a truncated polyhedral, truncated pyramidal, truncated conical or truncated triangular cross-sectional ridge structures defining openings from the second surface of the substrate to the fluid chambers.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: November 19, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Qin Liu, Naoto Kawamura, Chien-Hua Chen
  • Patent number: 6477281
    Abstract: An image processing apparatus is composed of an image memory comprising a plurality of memory elements, and a processor unit comprising a plurality of processor elements. By suitably engineering the arrangement of the image memory of memory elements, the arrangement of the processor unit of processor elements and the connections among the memory elements and processor elements, it is possible to realize, through a simple construction, high-speed image processing such as image density conversion, image color conversion, image masking, image spatial filtering, image enlargement, image reduction, image rotation, image compression, image extension and image color correction. Also provided are an image processing apparatus for a color image, composed of a plurality of image memories and a plurality of processor elements, and a generalized, multifunctional data parallel processing apparatus capable of processing a large volume of data at high speed.
    Type: Grant
    Filed: July 3, 1997
    Date of Patent: November 5, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yoshinobu Mita, Miyuki Enokida, Yoshihiro Ishida, Naoto Kawamura
  • Patent number: 6474772
    Abstract: A method of determining thermal turn on energy is disclosed. The method comprises heating a fluid ejection device to a predetermined temperature that is below a fluid ejection temperature; applying firing pulse bursts to a resistor of said fluid ejection device, the pulses in each of said bursts having a predetermined reference pulse energy and a predetermined pulse frequency to eject a predetermined count of fluid droplets; and incrementally varying the drop count from said predetermined count while sampling the temperature of the fluid ejection device after said pulse bursts are applied.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: November 5, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Naoto Kawamura, Erik D Ness
  • Publication number: 20020153346
    Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
    Type: Application
    Filed: May 10, 2002
    Publication date: October 24, 2002
    Inventors: Naoto Kawamura, David R. Thomas, David J. Walter, Timothy L. Weber
  • Publication number: 20020149650
    Abstract: Disclosed is an ink jet printhead having an integrated filter. The ink jet printhead includes a first substrate, a second substrate and an orifice layer. The first substrate defines an ink fluid supply conduit for the printhead. The second substrate of the printhead is affixed to an upper surface of the first substrate. The second substrate includes a plurality of individually addressable ink energizing elements, and defines a plurality of fluid filter openings that are in fluid communication with the ink fluid supply conduit of the first substrate. The fluid filter openings function as an ink fluid filter for the printhead. The orifice layer is coupled to an upper surface of the second substrate. The orifice layer defines a firing chamber in fluid communication with the fluid filter openings of the second substrate. The firing chamber is positioned over the ink energizing elements of the second substrate, with each firing chamber opening through a nozzle aperture in an exterior surface of the orifice layer.
    Type: Application
    Filed: April 3, 2002
    Publication date: October 17, 2002
    Inventors: Antonio S. Cruz-Uribe, Naoto A. Kawamura
  • Publication number: 20020134752
    Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
    Type: Application
    Filed: May 10, 2002
    Publication date: September 26, 2002
    Inventors: Naoto Kawamura, David R. Thomas, David J. Waller, Timothy L. Weber
  • Patent number: 6454955
    Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: September 24, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Timothy E. Beerling, Marvin G. Wong, Wan Sin Ng, Juliana Arifin, Jiansan Sun, Arief Budiman Suriadi, Naoto Kawamura
  • Patent number: 6447102
    Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.
    Type: Grant
    Filed: June 26, 2000
    Date of Patent: September 10, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Chien-Hau Chen, Donald E. Wenzel, Qin Liu, Naoto Kawamura, Richard W. Seaver, Carl Wu, Colby Van Vooren, Jeffery S. Hess, Colin C. Davis
  • Publication number: 20020122097
    Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.
    Type: Application
    Filed: February 22, 2002
    Publication date: September 5, 2002
    Inventors: Timothy E. Beerling, Marvin G. Wong, Wan Sin Ng, Juliana Arifin, Jiansan Sun, Arief Budiman Suriadi, Naoto Kawamura
  • Publication number: 20020101485
    Abstract: The invention is a fluid ejection device, such as a printhead, that has a substrate with a first surface mating to an orifice layer, preferably through a stack of thin-film layers. The orifice layer defines a fluid chamber interfacing to an orifice opening or nozzle. The substrate has a second surface having a truncated pyramidal structure; either polyhedral or triangular ridge shaped defining an opening through the substrate to the fluid chamber. The substrate further has an ejection element, preferably disposed as a resistor in the stack of thin-film layers. When energy is transferred from the ejection element to the fluid in the fluid chamber, fluid is ejected from the orifice opening. The fluid ejection device may have one or a plurality of fluid chambers and one or a plurality of frustums of a truncated polyhedral, truncated pyramidal, truncated conical or truncated triangular cross-sectional ridge structures defining openings from the second surface of the substrate to the fluid chambers.
    Type: Application
    Filed: January 29, 2001
    Publication date: August 1, 2002
    Inventors: Qin Liu, Naoto Kawamura, Chien-Hua Chen
  • Publication number: 20020071006
    Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.
    Type: Application
    Filed: February 1, 2002
    Publication date: June 13, 2002
    Inventors: Chien-Hau Chen, Donald E. Wenzel, Qin Liu, Naoto Kawamura, Richard W. Seaver, Carl Wu, Colby Van Vooren, Jeffery S. Hess, Colin C. Davis
  • Publication number: 20020067861
    Abstract: An image processing apparatus is composed of an image memory comprising a plurality of memory elements, and a processor unit comprising a plurality of processor elements. By suitably engineering the arrangement of the image memory of memory elements, the arrangement of the processor unit of processor elements and the connections among the memory elements and processor elements, it is possible to realize, through a simple construction, high-speed image processing such as image density conversion, image color conversion, image masking, image spatial filtering, image enlargement, image reduction, image rotation, image compression, image extension and image color correction. Also provided are an image processing apparatus for a color image, composed of a plurality of image memories and a plurality of processor elements, and a generalized, multifunctional data parallel processing apparatus capable of processing a large volume of data at high speed.
    Type: Application
    Filed: July 3, 1997
    Publication date: June 6, 2002
    Inventors: YOSHINOBU MITA, MIYUKI ENOKIDA, YOSHIHIRO ISHIDA, NAOTO KAWAMURA
  • Patent number: 6365058
    Abstract: One method of fabricating a fluid ejection device comprises forming a heating element on a first surface of a substrate. Adjacent the heating element, a hole is formed through the first surface to define a fill channel. The fill channel is filled with a filler material, and after filled, a fluid chamber is formed over the heating element. The filler material is removed. The fluid chamber is fluidically coupled with the fill channel, and is capable of ejecting fluid heated by the heating element.
    Type: Grant
    Filed: August 19, 1999
    Date of Patent: April 2, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Christopher Beatty, Naoto Kawamura
  • Publication number: 20020030720
    Abstract: The present invention is a printing system comprising an inkjet printhead that is capable of being operated in close proximity of a print media. The printhead has an orifice layer with orifices disposed thereto for selectively ejecting fluid in response to excitation signals. The printhead further comprises a carrier having an upper surface that defines a countersunk recess configured to receive a fluid ejecting substrate and an encapsulant that at least partially encapsulates a portion of the fluid ejecting substrate. The encapsulant is molded to form a planar surface with the orifice layer. The planar surface offers the following advantages: (1) the effect of trajectory error is reduced (2) the printhead can be efficiently cleaned by the cleaning mechanism of the printing system, and (3) ink leakage of the printhead during storage is eliminated.
    Type: Application
    Filed: August 23, 2001
    Publication date: March 14, 2002
    Inventors: Naoto Kawamura, Marvin G. Wong
  • Patent number: 6336714
    Abstract: Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. The trench completely etches away portions of the substrate near the ink feed holes so that the thin film layers form a shelf in the vicinity of the ink feed holes. In one embodiment, the shelf supports the ink ejection elements. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: January 8, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Naoto A. Kawamura, Colin C. Davis, Timothy L. Weber, Kenneth E. Trueba, John Paul Harmon, David R. Thomas
  • Publication number: 20010050705
    Abstract: This disclosure provides a valve which is controlled by a magnetic actuator. More specifically, the actuator is a polarized, magnetic actuator, that is, a magnetic actuator containing both a permanent magnet and an electromagnet. The actuator can be an inexpensive commercial relay having a pivoting armature that pushes a compliant diaphragm against a valve seat to close the valve. Preferably, the armature is configured as a “see-saw,” such that as the valve is opened, an opposing end of the see-saw also displaces the diaphragm. In this manner, fluid pressure in a valve chamber is relatively constant, and there are no significant pressures which prevent the valve from opening and closing. The preferred application of the valve is to actively drive printer ink supply, such that ink can be selectively drawn using the valve from a remote ink supply into a local ink reservoir, mounted near a print head.
    Type: Application
    Filed: August 14, 2001
    Publication date: December 13, 2001
    Inventors: Storrs T. Hoen, Naoto Kawamura, Jonah A. Harley
  • Patent number: 6325354
    Abstract: This disclosure provides a valve which is controlled by a magnetic actuator. More specifically, the actuator is a polarized, magnetic actuator, that is, a magnetic actuator containing both a permanent magnet and an electromagnet. The actuator can be an inexpensive commercial relay having a pivoting armature that pushes a compliant diaphragm against a valve seat to close the valve. Preferably, the armature is configured as a “see-saw,” such that as the valve is opened, an opposing end of the see-saw also displaces the diaphragm. In this manner, fluid pressure in a valve chamber is relatively constant, and there are no significant pressures which prevent the valve from opening and closing. The preferred application of the valve is to actively drive printer ink supply, such that ink can be selectively drawn using the valve from a remote ink supply into a local ink reservoir, mounted near a print head.
    Type: Grant
    Filed: April 7, 1999
    Date of Patent: December 4, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Storrs T. Hoen, Naoto Kawamura, Jonah A. Harley
  • Patent number: 6322201
    Abstract: A printhead has a substrate with a first surface, an opposite substantially parallel second surface, and an edge surface extending from the first surface to the second surface. The substrate further includes a fluid channel that extends from the edge surface inward away from the edge surface and through a recess in the first surface. The printhead further has a heating element disposed over the first surface, and a firing chamber disposed over the heating element. The fluid channel directs fluid to the firing chamber through the recess, where the fluid is heated by the heating element and ejected therefrom.
    Type: Grant
    Filed: October 22, 1997
    Date of Patent: November 27, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Christopher Beatty, Naoto Kawamura
  • Patent number: 6309054
    Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: October 30, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Naoto Kawamura, David R Thomas, David J Waller, Timothy L Weber