Abstract: A light emitting device includes a semiconductor light emitting element to emit an excitation light, a wavelength converting member to emit fluorescent light upon being irradiated with the excitation light, a package supporting the semiconductor light emitting element and the wavelength converting member, and a first photodetector configured to detect the excitation light and a second photodetector to detect the fluorescent light, located in the package.

Abstract: A light emitting device includes a semiconductor light emitting element to emit an excitation light, a wavelength converting member to emit fluorescent light upon being irradiated with the excitation light, a package supporting the semiconductor light emitting element and the wavelength converting member, and a first photodetector configured to detect the excitation light and a second photodetector to detect the fluorescent light, located in the package.

Abstract: A light emitting device includes a base member, a laser element, a retaining member, a fluorescent member, and first and second fixing members. The retaining member has a first surface on a laser element side and a second surface not on the laser element side. The fluorescent member is fixed to a through hole of the retaining member. The first and second fixing members clamp the retaining member. The first and second fixing members have first and second contact surfaces in contact with the first and second surfaces of the retaining member, respectively. A distance between the first and second contact surfaces becomes smaller as the first and second contact surfaces become farther from the through hole. The retaining member, the first and second fixing members are arranged such that a space surrounded by the retaining member, and the first and second fixing members exists around the retaining member.

Abstract: A light emitting device wherein discoloration of a reflective layer in an optical component can be prevented and a stable optical output power can be maintained, and a method of manufacturing an optical component used in the light emitting device. The optical component includes a supporting member defining a through-hole, a reflective layer formed on an inner wall defining the through-hole, a protective layer formed on the reflective layer, and a light transmissive member having a light incident surface, a light emitting surface, and an outer circumference side-surface, and disposed in the through hole. The light transmissive member is fixed in the through-hole with a joining portion where the outer circumference side-surface and the protective layer are joined, and an end portion at the light emitting side of the joining portion is covered with a second protective layer disposed continuously on the protective layer and the light transmissive member.

Abstract: The light emitting device according to the present invention comprises a laser diode; a wavelength converting member which is configured to convert a wavelength of a light emitted from the laser diode; and a support member which is configured to support the wavelength converting member so that the light passes through two surfaces of the wavelength converting member. The wavelength converting member comprises a fluorescent material and a binder. At least one light transmissive member is disposed on at least one of these two surfaces of the wavelength converting member. The binder has a melting point higher than a melting point of the light transmissive member. The light transmissive member is fixed to the support member by fusion bonding.

Abstract: A light emitting device includes a base member, a laser element, a retaining member, a fluorescent member, and first and second fixing members. The retaining member has a first surface on a laser element side and a second surface not on the laser element side. The fluorescent member is fixed to a through hole of the retaining member. The first and second fixing members clamp the retaining member. The first and second fixing members have first and second contact surfaces in contact with the first and second surfaces of the retaining member, respectively. A distance between the first and second contact surfaces becomes smaller as the first and second contact surfaces become farther from the through hole. The retaining member, the first and second fixing members are arranged such that a space surrounded by the retaining member, and the first and second fixing members exists around the retaining member.

Abstract: A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space between the lateral surfaces of the recess and the support member.

Abstract: The light emitting device according to the present invention comprises a laser diode; a wavelength converting member which is configured to convert a wavelength of a light emitted from the laser diode; and a support member which is configured to support the wavelength converting member so that the light passes through two surfaces of the wavelength converting member. The wavelength converting member comprises a fluorescent material and a binder. At least one light transmissive member is disposed on at least one of these two surfaces of the wavelength converting member. The binder has a melting point higher than a melting point of the light transmissive member. The light transmissive member is fixed to the support member by fusion bonding.

Abstract: A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space to between the lateral surfaces of the recess and the support member.

Abstract: A light emitting device wherein discoloration of a reflective layer in an optical component can be prevented and a stable optical output power can be maintained, and a method of manufacturing an optical component used in the light emitting device. The optical component includes a supporting member defining a through-hole, a reflective layer formed on an inner wall defining the through-hole, a protective layer formed on the reflective layer, and a light transmissive member having a light incident surface, a light emitting surface, and an outer circumference side-surface, and disposed in the through hole. The light transmissive member is fixed in the through-hole with a joining portion where the outer circumference side-surface and the protective layer are joined, and an end portion at the light emitting side of the joining portion is covered with a second protective layer disposed continuously on the protective layer and the light transmissive member.

Abstract: The light emitting device according to the present invention comprises a laser diode; a wavelength converting member which is configured to convert a wavelength of a light emitted from the laser diode; and a support member which is configured to support the wavelength converting member so that the light passes through two surfaces of the wavelength converting member. The wavelength converting member comprises a fluorescent material and a binder. At least one light transmissive member is disposed on at least one of these two surfaces of the wavelength converting member. The binder has a melting point higher than a melting point of the light transmissive member. The light transmissive member is fixed to the support member by fusion bonding.

Abstract: A light emitting device wherein discoloration of a reflective layer in an optical component can be prevented and a stable optical output power can be maintained, and a method of manufacturing an optical component used in the light emitting device. The optical component includes a supporting member defining a through-hole, a reflective layer formed on an inner wall defining the through-hole, a protective layer formed on the reflective layer, and a light transmissive member having a light incident surface, a light emitting surface, and an outer circumference side-surface, and disposed in the through hole. The light transmissive member is fixed in the through-hole with a joining portion where the outer circumference side-surface and the protective layer are joined, and an end portion at the light emitting side of the joining portion is covered with a second protective layer disposed continuously on the protective layer and the light transmissive member.

Abstract: The light emitting device according to the present invention comprises a laser diode; a wavelength converting member which is configured to convert a wavelength of a light emitted from the laser diode; and a support member which is configured to support the wavelength converting member so that the light passes through two surfaces of the wavelength converting member. The wavelength converting member comprises a fluorescent material and a binder. At least one light transmissive member is disposed on at least one of these two surfaces of the wavelength converting member. The binder has a melting point higher than a melting point of the light transmissive member. The light transmissive member is fixed to the support member by fusion bonding.

Abstract: In a semiconductor light-emitting device, light from a laser diode is output to the outside after the luminance of the light being enhanced. It includes a support body provided with lead terminals, one or more laser diodes mounted on the support body, a cylindrical reflector fixed to the support body to surround the laser diode(s) and provided with a light reflection surface formed on an inner surface thereof, and a cap placed to cover an opening distal end face of the reflector and held at an opening distal end part of the reflector, the cap being provided at a central part thereof with a solid fluorescent member including a fluorescent substance that is excited by the light from the laser diode and emits light different in colors from light emitted by the laser diode.

Abstract: A light emitting device wherein discoloration of a reflective layer in an optical component can be prevented and a stable optical output power can be maintained, and a method of manufacturing an optical component used in the light emitting device. The optical component includes a supporting member defining a through-hole, a reflective layer formed on an inner wall defining the through-hole, a protective layer formed on the reflective layer, and a light transmissive member having a light incident surface, a light emitting surface, and an outer circumference side-surface, and disposed in the through hole. The light transmissive member is fixed in the through-hole with a joining portion where the outer circumference side-surface and the protective layer are joined, and an end portion at the light emitting side of the joining portion is covered with a second protective layer disposed continuously on the protective layer and the light transmissive member.

Abstract: An optical component that can be attached to an end portion of an optical guiding member, and a light converting member used in the optical component. The optical component comprises a cap having an engaging portion defining a bore engaged with an end member of a light guiding member, and an arranging portion defining a opening connected to the bore in the engaging portion, and a light converting member disposed in the opening formed in the arranging portion.

Abstract: There is provided a light emitting device using an optical component capable of emitting light having a wavelength different from that of light exit from an optical fiber and obtaining light of high output, and capable of being easily attached to an end of the optical fiber. The optical component includes an optical fiber holding member for holding an optical fiber, a light conversion member, and a cap having an inner hole allowing the light conversion member and the optical fiber holding member to be inserted into and an engagement part with an opening for engaging inserted members at one end of the inner hole. The light conversion member inserted into the inner hole of the cap is fitted into the inner hole with the optical fiber holding member pressed against the engagement part. The opening of the engagement part is smaller than a maximum diameter of the light conversion member.

Abstract: An optical component comprises: an optical fiber having the core and the clad; a light guide holding member attached to the exit end of the optical fiber; a wavelength conversion member that contains a fluorescent substance; and a reflection means provided between the exit end of the optical fiber and the wavelength conversion member, or between the light guide holding member and the wavelength conversion member. An increase in optical output is made possible not by reducing reflection as with conventional optical components, but on the contrary by actually producing reflection. Therefore, optical output can be increased by a means other than forming an optical film that reduces Fresnel reflection.