Abstract: A process for purifying raw carbon nanotubes to obtain a content in metallic impurities of between 5 ppm and 200 ppm. The process includes an increase in the bulk density of the raw carbon nanotubes via compacting to produce compacted carbon nanotubes. The process further includes sintering the compacted carbon nanotubes by undergoing thermal treatment under gaseous atmosphere in order to remove at least a portion of the metallic impurities contained in the raw carbon nanotubes, and consequently producing purified carbon nanotubes. These purified carbon nanotubes are directly usable as electronic conductors serving as basis additive to an electrode material without requiring any subsequent purification step. The electrode material can then be used to manufacture an electrode destined to a lithium-ion battery.

Abstract: The present invention proposes a process for purifying raw carbon nanotubes to obtain an content in metallic impurities comprised between 5 ppm and 200 ppm. The process includes an increase in the bulk density of the raw carbon nanotubes via compacting to produce compacted carbon nanotubes. The process further includes sintering the compacted carbon nanotubes by undergoing thermal treatment under gaseous atmosphere in order to remove at least a portion of the metallic impurities contained in the raw carbon nanotubes, and consequently producing purified carbon nanotubes. These purified carbon nanotubes are directly usable as electronic conductors serving as basis additive to an electrode material without requiring any subsequent purification step. The electrode material can then be used to manufacture an electrode destined to a lithium-ion battery.

Abstract: A semiconductor device according to an embodiment includes a semiconductor chip, a semiconductor element, a stacked body, and a structure body. The semiconductor chip includes a first surface, a second surface, and a side surface between the first surface and the second surface. The semiconductor element is provided in the center of the semiconductor chip when viewed from the normal direction of the first surface. The stacked body is provided at the outer peripheral end portion of the semiconductor chip when viewed from the normal direction and includes a plurality of first layers and a plurality of second layers alternately stacked in the normal direction. The structure body is provided in at least a part between the semiconductor element and the side surface when viewed from the normal direction and extending from a position higher than the stacked body to a position lower than the stacked body.

Abstract: An optical-waveguide-clad composition includes a bisphenol type epoxy compound (A), and an epoxy compound (B) containing, in a molecule, at least one of a structure represented by the following formula (1) and a structure represented by the following formula (2), and having a molecular weight of 350 or higher. In the formula (1), R1 and R2 each independently represent a hydrogen atom or an alkyl group, and m represents 2 to 15. In the formula (2), R3 and R4 each independently represent a hydrogen atom or an alkyl group, and n represents 2 to 15.

Abstract: The present invention proposes a process for purifying raw carbon nanotubes to obtain an content in metallic impurities comprised between 5 ppm and 200 ppm. The process includes an increase in the bulk density of the raw carbon nanotubes via compacting to produce compacted carbon nanotubes. The process further includes sintering the compacted carbon nanotubes by undergoing thermal treatment under gaseous atmosphere in order to remove at least a portion of the metallic impurities contained in the raw carbon nanotubes, and consequently producing purified carbon nanotubes. These purified carbon nanotubes are directly usable as electronic conductors serving as basis additive to an electrode material without requiring any subsequent purification step. The electrode material can then be used to manufacture an electrode destined to a lithium-ion battery.

Abstract: A semiconductor device according to an embodiment, includes a plurality of wires, a first dielectric film, and a second dielectric film. The plurality of wires are arranged above a semiconductor substrate so as to extend in a first direction and aligned via a first cavity. The first dielectric film has a plurality of portions arranged above the plurality of wires so as to extend in a second direction substantially perpendicular to the plurality of wires and aligned along the first direction via a second cavity leading to the first cavity. The second dielectric film is formed above the first dielectric film so as to cover the second cavity.

Abstract: A spindle motor has a base plate, a stator core fixed to the base plate, a rotor member rotatable with respect to the base plate, a rotor magnet facing the stator core in a radial direction and fixed to the rotor member and a ring-shaped magnetic attractive plate attached to the base plate bottom surface facing the rotor magnet in an axial direction to generate a magnetic attracting force between the rotor magnet and the magnetic attractive plate. A ring-shaped wall surface is on the base plate bottom surface. At least one of an outer and inner circumference of the ring-shaped magnetic attractive plate has a polygonal shape formed of linear parts and corner parts. In a state in which at least one of the outer and inner circumferences having the polygonal shape contacts the ring-shaped wall surface, the ring-shaped magnetic attractive plate is adhesively fixed to the base plate.

Abstract: The present invention relates to a dry film for optical waveguides, obtained through sequential stacking of a carrier film, a plating adhesion layer, an uncured cladding layer and a cover film. Solid microparticles are dispersed in a resin composition that constitutes the plating adhesion layer.

Abstract: The present invention relates to a dry film for an optical waveguide which has a carrier base material, a resin layer for an optical waveguide that can be cured by active energy ray or heat, and a protective film. The surface of the protective film that is in contact with the resin layer for an optical waveguide is a roughened surface.

Abstract: The present invention provides an optical waveguide excellent in all of transparency, a bending property and heat resistance and a dry film for manufacturing an optical waveguide. A clad layer of the optical waveguide according to the present invention is formed by using a dry film containing a polymer comprising at least a (meth)acrylate monomer with an epoxy group and a (meth)acrylate monomer without an epoxy group; and cationic or anionic curing initiator.

Abstract: A motor includes: a base including a holder portion; a shaft supporting member fitted inside the holder portion and fixed onto an inner circumferential surface of the holder portion; a shaft supported by the shaft supporting member; a rotor assembly rotatably supported with respect to the shaft supporting member via the shaft; and a stator assembly arranged on an outer circumferential portion of the holder portion. An adhesive groove on the base side and an adhesive groove on the shaft supporting member side, to which an adhesive is applied, are formed respectively on the inner circumferential surface of the holder portion and on an outer circumferential surface of the shaft supporting member facing the inner circumferential surface of the holder portion, and the adhesive grooves on the base side and on the shaft supporting member side are disposed to face each other at least in part.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes first word lines equipped with flag-like portions on one side of the block in the row direction and equipped with no flag-like portions on the other side of the block in the row direction, and second word lines equipped with no flag-like portions on the one side of the block in the row direction and equipped with flag-like portions on the other side of the block in the row direction.

Abstract: A semiconductor device according to an embodiment, includes a plurality of wires, a first dielectric film, and a second dielectric film. The plurality of wires are arranged above a semiconductor substrate so as to extend in a first direction and aligned via a first cavity. The first dielectric film has a plurality of portions arranged above the plurality of wires so as to extend in a second direction substantially perpendicular to the plurality of wires and aligned along the first direction via a second cavity leading to the first cavity. The second dielectric film is formed above the first dielectric film so as to cover the second cavity.

Abstract: The present invention relates to a dry film for optical waveguides, obtained through sequential stacking of a carrier film, a plating adhesion layer, an uncured cladding layer and a cover film. Solid microparticles are dispersed in a resin composition that constitutes the plating adhesion layer.

Abstract: The present invention relates to a dry film for an optical waveguide which has a carrier base material, a resin layer for an optical waveguide that can be cured by active energy ray or heat, and a protective film. The surface of the protective film that is in contact with the resin layer for an optical waveguide is a roughened surface.

Abstract: An optical-electrical composite flexible circuit substrate having sufficiently high bending resistance is provided. An optical-electrical composite flexible circuit substrate includes: an optical circuit that includes a core portion and a cladding layer that covers the core portion; and an electrical circuit, with the optical circuit and the electrical circuit being disposed at a position that includes a neutral surface when the optical-electrical composite flexible circuit substrate is bent, or at a position near the neutral surface. Alternatively, the optical-electrical composite flexible circuit substrate may include an optical circuit that includes a core portion and a cladding layer that covers the core portion; and a substrate that includes an electrical circuit, with the substrate and the optical circuit being laminated so that the electrical circuit is disposed on a side closer to the optical circuit.

Abstract: The present invention provides an optical waveguide excellent in all of transparency, a bending property and heat resistance and a dry film for manufacturing an optical waveguide. A clad layer of the optical waveguide according to the present invention is formed by using a dry film containing a polymer comprising at least a (meth)acrylate monomer with an epoxy group and a (meth)acrylate monomer without an epoxy group; and cationic or anionic curing initiator.

Abstract: Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and also a dry film obtained from this composition, an optical waveguide, and a photoelectric composite wiring board. The resin composition for an optical waveguide includes: (A) an epoxy resin constituted by a solid epoxy resin with one or less hydroxyl group in a molecule, and a liquid epoxy resin with one or less hydroxyl group in a molecule; (B) a curing agent with one or less hydroxyl group in a molecule; and (C) a nanosize silica sol, and contains no compound including two or more hydroxyl groups in a molecule as a resin component.

Abstract: Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and also a dry film obtained from this composition, an optical waveguide, and a photoelectric composite wiring board. The resin composition for an optical waveguide includes: (A) an epoxy resin constituted by a solid epoxy resin with one or less hydroxyl group in a molecule, and a liquid epoxy resin with one or less hydroxyl group in a molecule; (B) a curing agent with one or less hydroxyl group in a molecule; and (C) a nanosize silica sol, and contains no compound including two or more hydroxyl groups in a molecule as a resin component.

Abstract: An optical-electrical composite flexible circuit substrate having sufficiently high bending resistance is provided. An optical-electrical composite flexible circuit substrate includes: an optical circuit that includes a core portion and a cladding layer that covers the core portion; and an electrical circuit, with the optical circuit and the electrical circuit being disposed at a position that includes a neutral surface when the optical-electrical composite flexible circuit substrate is bent, or at a position near the neutral surface. Alternatively, the optical-electrical composite flexible circuit substrate may include an optical circuit that includes a core portion and a cladding layer that covers the core portion; and a substrate that includes an electrical circuit, with the substrate and the optical circuit being laminated so that the electrical circuit is disposed on a side closer to the optical circuit.