Abstract: In a ceramic base and metallic member assembly, a metallic member such as an input/output terminal is joined by solder to a ceramic base substrate by way of a stress relief layer. The ceramic base substrate has a metallized layer on which the stress relief layer is formed by plating. The stress relief layer is made of soft metal such as copper and has the thickness equal to or larger than 25 .mu.m. In one embodiment, a barrier made of glass or an organic insulating material for preventing outflow of solder is formed on a peripheral portion of a joining surface of the stress relief layer.

Abstract: A ceramic substrate is described consisting essentially of a crystallized glass and having at least one throught-hole filled with a conductor material having 100 parts by weight of copper and form 1 to 30 parts by weight of a glass having a softening point of 1,000.degree. C. or less and a thermal expansion coefficient of from 1.5.times.10.sup.-6 /K to 4.0.times.10.sup.-6 /K as measured in a temperature range of from room temperature to 400.degree. C.

Abstract: A charged particle emission source structure comprising a needle-like electrode for emission of charged particles, a reservoir for a liquid metal for wetting the surface of the needle-like electrode, heat-generating support members for heating the liquid metal and holding the reservoir or the needle-like electrode, and an extraction electrode for applying an electric field as between it and the needle-like electrode, which is characterized in that conductive partitions hardly wettable with the liquid metal are provided between the heat-generating support members and the reservoir or the needle-like electrode.