Abstract: Some examples described herein relate to multi-chip devices. In an example, a multi-chip device includes first and second chips. The first chip includes a power supply circuit and a logic circuit. The first and second chips are coupled together. The second chip is configured to receive power from the power supply circuit. The second chip includes a programmable circuit, a pull-up circuit, and a detector circuit. The detector circuit is configured to detect a presence of a power voltage on the second chip and responsively output a presence signal. The power voltage on the second chip is based on the power from the power supply circuit. The logic circuit is configured to generate a pull-up signal based on the presence signal. The pull-up circuit is configured to receive the pull-up signal and configured to pull up a voltage of a node of the programmable circuit responsive to the pull-up signal.

Abstract: Some examples described herein relate to multi-chip devices. In an example, a multi-chip device includes first and second chips. The first chip includes a power supply circuit and a logic circuit. The first and second chips are coupled together. The second chip is configured to receive power from the power supply circuit. The second chip includes a programmable circuit, a pull-up circuit, and a detector circuit. The detector circuit is configured to detect a presence of a power voltage on the second chip and responsively output a presence signal. The power voltage on the second chip is based on the power from the power supply circuit. The logic circuit is configured to generate a pull-up signal based on the presence signal. The pull-up circuit is configured to receive the pull-up signal and configured to pull up a voltage of a node of the programmable circuit responsive to the pull-up signal.

Abstract: Examples described herein provide a method for disabling a defective portion of a fabric die of a stacked IC device. The method includes receiving a signal indicating that a portion of a fabric die of a stacked IC device including at least two fabric dies is defective. The method further includes, in response to the signal, pulling a source voltage rail of the defective portion to ground, thereby disabling the portion, and operating the remainder of the fabric die without interference from or contention with the disabled portion. In one example, the stacked IC device is an active on active (AoA) device, and the portion of the fabric die includes a configuration memory cell. In one example, the signal is received after power-up of the stacked IC device.

Abstract: Apparatus and associated methods relate to a consolidated power-on-reset system (PORS) at a system-on-chip (SoC) level. In an illustrative example, an integrated circuit may include a first power domain and a second power region. A level shifter circuit may be coupled to translate data from the first power domain to the second power domain. A PORS including a voltage detection circuit, a glitch filter circuit, and logic gates may be configured to generate isolation signals between the first power domain and the second power domain. The level shifter circuit may be enabled in response to the generated isolation signals. By using the isolation signals, multiple power domains on IC may be managed comprehensively during power-up to avoid unstable operation.

Abstract: An example read address generation circuit for a static random access memory (SRAM) cell includes an operational amplifier having a non-inverting input coupled to a reference voltage, a memory emulation circuit having an output coupled to an inverting input of the operational amplifier and a control input coupled to an output of the operational amplifier, and a multiplexer having a first input coupled to receive a constant read voltage, a second input coupled to the output of the operational amplifier, and an output coupled to supply a read address voltage to the SRAM cell.

Abstract: A circuit includes a divider circuit block configured to generate a trim term signal (VBG_TRIM) that is temperature and process independent. The circuit further includes a processing circuit block configured to multiply a temperature dependent reference voltage signal (TAP_GG) by a factor, and to sum the trim term signal with a result of the multiplication to generate an output reference voltage (VGG).