Patents by Inventor Naresh Akkarapaka

Naresh Akkarapaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120065641
    Abstract: A bone repair apparatus includes a partially polymerized biocompatible adhesive provided in a state wherein polymerization of the biocompatible adhesive is substantially suspended. A method for repairing a bone defect includes preparing the biocompatible adhesive, suspending polymerization of the biocompatible adhesive prior to full cure, delivering the biocompatible adhesive to the bone defect while polymerization is substantially suspended and accelerating polymerization of the biocompatible adhesive to achieve full cure. The method provides an implanted biocompatible adhesive with a malleable osteoconductive structure without compromising the physical characteristics of the biocompatible adhesive, thereby improving handling and delivery of the bone adhesive.
    Type: Application
    Filed: September 14, 2010
    Publication date: March 15, 2012
    Applicant: Doctors Research Group, Inc.
    Inventors: Richard J. Deslauriers, Eric Kolb, John A. Tomich, John Boxberger, Naresh Akkarapaka
  • Publication number: 20120046698
    Abstract: A pedicle fastener for implantation during a spinal fusion procedure includes a head and shank, the shank being connectable to the head and extending outwardly therefrom. The shank may include a shielding feature formed therein for accommodating an adhesive augmenting the pedicle fastener and improving implantation strength and stiffness thereof. A method for implanting the pedicle fastener includes forming a hole in a pedicle, applying the adhesive to the hole and sliding the shank of the pedicle fastener into the hole. The adhesive may also be applied to the hole through direct injection, injection through a longitudinal cannula formed in the pedicle fastener or by depositing the adhesive on the shank and inserting the shank into the hole. Polymerization of the adhesive may be accelerated by heating the pedicle fastener.
    Type: Application
    Filed: August 18, 2010
    Publication date: February 23, 2012
    Applicant: Doctors Research Group, Inc.
    Inventors: Eric Kolb, Naresh Akkarapaka, John Boxberger, John Tomich
  • Publication number: 20110012280
    Abstract: A multi-density polymeric interbody spacer formed from biocompatible material for osteoconductivity includes multiple density regions of different porosity to provide both strength and osteoconductivity. An interface region is formed between the density regions to provide both direct adhesion and mechanical interlocking between the different density regions to increase the strength of the multi-density polymeric interbody spacer. A method for forming the multi-density polymeric interbody spacer includes curing a first density region to achieve a first target porosity. A second density region may then be molded to the first density region to achieve a second target porosity. A portion of the second density region partially flows into pores of the first density region, providing direct adhesion and mechanical interlocking between the first and second density regions.
    Type: Application
    Filed: July 14, 2009
    Publication date: January 20, 2011
    Applicant: DOCTORS RESEARCH GROUP, INC.
    Inventors: Richard J. Deslauriers, Joseph Jannetty, Eric Kolb, John A. Tomich, Naresh Akkarapaka
  • Publication number: 20110015743
    Abstract: A multi-density polymeric interbody spacer formed from biocompatible material for osteoconductivity includes multiple density regions of different porosity to provide both strength and osteoconductivity. An interface region is formed between the density regions to provide both direct adhesion and mechanical interlocking between the different density regions to increase the strength of the multi-density polymeric interbody spacer. A method for forming the multi-density polymeric interbody spacer includes curing a first density region to achieve a first target porosity. A second density region may then be molded to the first density region to achieve a second target porosity. A portion of the second density region partially flows into pores of the first density region, providing direct adhesion and mechanical interlocking between the first and second density regions.
    Type: Application
    Filed: July 14, 2009
    Publication date: January 20, 2011
    Applicant: DOCTORS RESEARCH GROUP, INC.
    Inventors: Richard J. Deslauriers, Joseph Jannetty, Eric Kolb, John A. Tomich, Naresh Akkarapaka