Patents by Inventor Nariaki Nawa

Nariaki Nawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing wiring board
    Patent number: 10477679
    Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 ?m or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 ??·cm or less.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: November 12, 2019
    Assignee: Toppan Forms Co., Ltd.
    Inventors: Kumi Hirose, Takuya Sekiguchi, Nariaki Nawa
  • WIRING BOARD
    Publication number: 20180153034
    Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 ?m or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 ??·cm or less.
    Type: Application
    Filed: January 8, 2018
    Publication date: May 31, 2018
    Inventors: Kumi Hirose, Takuya Sekiguchi, Nariaki Nawa
  • WIRING BOARD
    Publication number: 20160330835
    Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 ?m or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 ??·cm or less.
    Type: Application
    Filed: January 23, 2015
    Publication date: November 10, 2016
    Inventors: Kumi Hirose, Takuya Sekiguchi, Nariaki Nawa