Patents by Inventor Naru Yasuda
Naru Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090279827Abstract: An optical module has an optical element which transmits or receives an optical signal, an optical transmission line optically coupled to the optical element to transmit the optical signal, and a board to which at least one end portion including an incident and outgoing port of the optical signal in the optical transmission line and the optical element are fixed. A wall facing a side surface of the optical transmission line is provided in the board. A first space is provided between the board and the optical transmission line, and a second space is provided between the side surface of the optical transmission line and the wall. The first and second spaces are filled with a bonding agent.Type: ApplicationFiled: April 26, 2007Publication date: November 12, 2009Applicant: OMRON CORPORATIONInventors: Akihiko Sano, Junichi Tanaka, Toshiaki Okuno, Naru Yasuda, Hayami Hosokawa
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Publication number: 20090274412Abstract: An optical module comprising has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of said optical transmission path or a light incidence surface of the optical transmission path is arranged such that said optical element and said optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of said optical element. Said optical element is sealed by a sealing agent. A gap is provided between said optical transmission path and the surface of said sealing agent on the light receiving surface or the light emitting surface of said optical element.Type: ApplicationFiled: April 12, 2007Publication date: November 5, 2009Applicant: OMRON CORPORATIONInventors: Akihiko Sano, Hiroto Nozawa, Toshiaki Okuno, Junichi Tanaka, Naru Yasuda, Hayami Hosokawa
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Publication number: 20090202199Abstract: An optical module (1) including a light receiving/emitting element (3) for transmitting or receiving an optical signal, an optical waveguide (2) having a core part made of a material with translucency and a clad part made of a material having an index of refraction different from an index of refraction of the core part for optically coupling with the light receiving/emitting element (3) and transmitting the optical signal, and a package (5) for accommodating at least one end including an entrance/exit port (2c) of the optical signal in the optical waveguide (2) and the light receiving/emitting element (3); wherein a surface on a side facing a bottom plate mounted with the light receiving/emitting element (3) in the package (5) at the end of the optical waveguide (2) accommodated in the package (5) is configured by a first region including a portion projected into a space inside the package (5), and a second region different from the first region; and the package (5) includes a supporting part (5a) for supportType: ApplicationFiled: December 28, 2006Publication date: August 13, 2009Applicant: OMRON CORPORATIONInventors: Hiroshi Sameshima, Takayoshi Koike, Naru Yasuda, Hayami Hosokawa, Hiroto Nozawa
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Publication number: 20090175579Abstract: A connection member electrically connects an optical element configured to convert an electric signal to an optical signal or to convert an optical signal to an electric signal, a first substrate including an incident/releasing port of an optical transmission path for an optical signal at least one end portion thereof, and a second substrate to each other. The optical transmission path is optically coupled with the optical element to transmit the optical the connection. The connection member includes a connection unit connected to the second substrate and a holding unit having elasticity and holding the first substrate. The holding unit is provided with an electrode at a connecting position to the first substrate, and the holding unit holds the first substrate by connecting the first substrate to the electrode.Type: ApplicationFiled: April 13, 2007Publication date: July 9, 2009Applicant: OMRON CORPORATIONInventors: Junichi Tanaka, Akihiko Sano, Toshiaki Okuno, Yoshihisa Ishida, Akira Enami, Hiroshi Sameshima, Naru Yasuda, Hayami Hosokawa
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Publication number: 20090110350Abstract: An optical cable module has an optical waveguide formed by surrounding a core with a clad layer and a light-receiving/emitting element, installed on a supporting substrate. A light-releasing face of the optical waveguide or a light-incident face to the optical waveguide is aligned so as to face a light-receiving face or a light-emitting face of the light-receiving/emitting element. The optical waveguide is formed into a film shape having flexibility, and provided with a reinforcing member that prevents a deflection from occurring in the optical waveguide. The optical waveguide is placed on a protruding portion from a supporting face of the optical waveguide on the supporting substrate.Type: ApplicationFiled: April 9, 2007Publication date: April 30, 2009Applicant: OMRON CORPORATIONInventors: Toshiaki Okuno, Hayami Hosokawa, Naru Yasuda, Akihiko Sano, Junichi Tanaka, Hiroto Nozawa, Hirokatsu Nakayama
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Patent number: 7460747Abstract: A waveguide includes a core part, clad layer surrounding the core part about an optical axis of the core part, and an optical path conversion mirror formed at the end face of at least one of the core part or the clad layer. The optical path conversion mirror converts an optical path of a signal light. The shape of the end face of the core part and the shape of the end face of the clad layer are different in the optical path conversion mirror.Type: GrantFiled: December 13, 2006Date of Patent: December 2, 2008Assignee: OMRON CorporationInventors: Junichi Tanaka, Hirokatsu Nakayama, Naru Yasuda, Hayami Hosokawa
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Patent number: 7300183Abstract: On a front wall of a mold resin (13) sealing a light emitter (12), a direct emission region (18), through which the light emitted from the light emitter (12) directly passes to the outside, and a total reflection region (19), by which the light emitted from the light emitter (12) is totally reflected, are formed. The direct emission region (18) is formed into a shape of a convex lens. A light reflection portion (20) which is made of a concave mirror is provided on the rear face of the mold resin (13). When a part of the light emitted from the light emitter (12) passes through the direct emission region (18), it is affected by the lens to be emitted to the front direction. After another part of the light emitted from the light emitter (12) is totally reflected by the total reflection region (19), it is reflected by the light reflection portion (20) to be emitted to the front direction through the total reflection region (19).Type: GrantFiled: May 23, 2005Date of Patent: November 27, 2007Assignee: Omron CorporationInventors: Hironobu Kiyomoto, Hayami Hosokawa, Naru Yasuda, Kenji Homma, Yukari Terakawa
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Patent number: 7244924Abstract: This invention improves the use efficiency of light emitted by a solid light emitter such as a light emitting diode, and realizes a desired directional pattern. On a front boundary surface of a mold resin 13 sealing a light emitter 12, there are formed a direct emission region 18 for emitting the light from the light emitter 12 and a total reflection region 19 for totally reflecting the light from the light emitter 12. The direct emission region 18 is convex lens-shaped. A light reflecting portion 20 having a concave mirror shape is disposed on a rear wall of the mold resin 13. A part of light emitted from the light emitter 12 is emitted forward by receiving an optical lens action when it passes through the direct emission region 18. Another part of the light emitted by from the light emitter 12 is totally reflected by the total reflection region 19, and is reflected by the light reflecting portion 20, and emitted forward from the total reflection region 19.Type: GrantFiled: February 7, 2006Date of Patent: July 17, 2007Assignee: Omron CorporationInventors: Hironobu Kiyomoto, Hayami Hosokawa, Naru Yasuda, Kenji Homma, Yukari Terakawa
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Publication number: 20070140615Abstract: A waveguide includes a core part, clad layer surrounding the core part about an optical axis of the core part, and an optical path conversion mirror formed at the end face of at least one of the core part or the clad layer. The optical path conversion mirror converts an optical path of a signal light. The shape of the end face of the core part and the shape of the end face of the clad layer are different in the optical path conversion mirror.Type: ApplicationFiled: December 13, 2006Publication date: June 21, 2007Applicant: OMRON CorporationInventors: Junichi Tanaka, Hirokatsu Nakayama, Naru Yasuda, Hayami Hosokawa
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Patent number: 7177517Abstract: In the upper face of a lower clad layer, a core trench is formed having a cross-sectional trapezoidal shape having a narrow bottom face and a wide upper face, a core is formed within the core trench, and an upper clad layer is formed at the upper face of the core for sealing. The bottom face of the core trench becomes a low refractive index layer having a refractive index smaller than the lower clad layer. The substantive difference of refractive index between the core and the lower clad layer is thus increased.Type: GrantFiled: February 15, 2005Date of Patent: February 13, 2007Assignee: Omron CorporationInventors: Akihiko Sano, Shuichi Misuimi, Akihiko Hatamura, Naru Yasuda, Hayami Hosokawa
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Patent number: 7174081Abstract: An optical waveguide device includes a first substrate, where the first substrate includes a first plate and an optical waveguide region disposed on the first plate, and where the optical waveguide region includes a core for transmitting light and a cladding surrounding the core. The optical waveguide device further includes a second substrate, where the second substrate includes a second plate having a spacer. Additionally, a surface including the optical waveguide region of the first substrate opposes a surface including the spacer of the second substrate, the spacer is formed the region which is out of the core of the first substrate, a top surface of the spacer is in contact with the first substrate, the first substrate and the second substrate are bound with adhesive material, and the entire surface of the core is in contact with the adhesive material.Type: GrantFiled: December 20, 2005Date of Patent: February 6, 2007Assignee: Omron CorporationInventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
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Patent number: 7155103Abstract: To provide an optical wave guide that may be produced by reproduction method in easy and simple manner, and has a structure that prevents light signal in its inside from leaking out from core, and a method for producing the same optical wave guide. A concave slot for forming a core is formed on the upper surface of a cladding substrate. And on both sides of the concave slot, cavities are formed via flat portions. An ultraviolet ray hardening type transparent resin is applied onto the surface of the cladding substrate, thereafter the transparent resin is pressed by a stamper. At this moment, a core is formed in the concave slot and excessive transparent resin is pressed between the stamper and the flat portions flows into cavities, as a result, it is possible to make the transparent resin thin in a short time. Thereby, it is possible to make the transparent resin left on the flat portions into thickness and width enough to prevent light in the core from leaking out.Type: GrantFiled: September 25, 2002Date of Patent: December 26, 2006Assignee: Omron CorporationInventors: Masayoshi Higuchi, Toshiyuki Takahashi, Hiromi Totani, Naru Yasuda, Hayami Hosokawa, Fumihiko Sato
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Patent number: 7113683Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.Type: GrantFiled: December 20, 2005Date of Patent: September 26, 2006Assignee: OMRON CorporationInventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
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Publication number: 20060124835Abstract: This invention improves the use efficiency of light emitted by a solid light emitter such as a light emitting diode, and realizes a desired directional pattern. On a front boundary surface of a mold resin 13 sealing a light emitter 12, there are formed a direct emission region 18 for emitting the light from the light emitter 12 and a total reflection region 19 for totally reflecting the light from the light emitter 12. The direct emission region 18 is convex lens-shaped. A light reflecting portion 20 having a concave mirror shape is disposed on a rear wall of the mold resin 13. A part of light emitted from the light emitter 12 is emitted forward by receiving an optical lens action when it passes through the direct emission region 18. Another part of the light emitted by from the light emitter 12 is totally reflected by the total reflection region 19, and is reflected by the light reflecting portion 20, and emitted forward from the total reflection region 19.Type: ApplicationFiled: February 7, 2006Publication date: June 15, 2006Applicant: OMRON CorporationInventors: Hironobu Kiyomoto, Hayami Hosokawa, Naru Yasuda, Kenji Homma, Yukari Terakawa
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Publication number: 20060110098Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.Type: ApplicationFiled: December 20, 2005Publication date: May 25, 2006Applicant: OMRON CorporationInventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
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Publication number: 20060104587Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.Type: ApplicationFiled: December 20, 2005Publication date: May 18, 2006Inventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
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Patent number: 7013055Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.Type: GrantFiled: July 1, 2003Date of Patent: March 14, 2006Assignee: Omron CorporationInventors: Kazuyuki Hayamizu, Yoshiyuki Komura, Yukari Terakawa, Hayami Hosokawa, Toshiyuki Takahashi, Masayoshi Higuchi, Yoshitaka Tatara, Naru Yasuda, Hiroto Nozawa
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Publication number: 20050212089Abstract: On a front wall of a mold resin (13) sealing a light emitter (12), a direct emission region (18), through which the light emitted from the light emitter (12) directly passes to the outside, and a total reflection region (19), by which the light emitted from the light emitter (12) is totally reflected, are formed. The direct emission region (18) is formed into a shape of a convex lens. A light reflection portion (20) which is made of a concave mirror is provided on the rear face of the mold resin (13). When a part of the light emitted from the light emitter (12) passes through the direct emission region (18), it is affected by the lens to be emitted to the front direction. After another part of the light emitted from the light emitter (12) is totally reflected by the total reflection region (19), it is reflected by the light reflection portion (20) to be emitted to the front direction through the total reflection region (19).Type: ApplicationFiled: May 23, 2005Publication date: September 29, 2005Applicant: OMRON CorporationInventors: Hironobu Kiyomoto, Hayami Hosokawa, Naru Yasuda, Kenji Homma, Yukari Terakawa
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Publication number: 20050180714Abstract: In the upper face of a lower clad layer, a core trench is formed having a cross-sectional trapezoidal shape having a narrow bottom face and a wide upper face, a core is formed within the core trench, and an upper clad layer is formed at the upper face of the core for sealing. The bottom face of the core trench becomes a low refractive index layer having a refractive index smaller than the lower clad layer. The substantive difference of refractive index between the core and the lower clad layer is thus increased.Type: ApplicationFiled: February 15, 2005Publication date: August 18, 2005Applicant: OMRON CorporationInventors: Akihiko Sano, Shuichi Misuimi, Akihiko Hatamura, Naru Yasuda, Hayami Hosokawa
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Publication number: 20050180696Abstract: An oxide film is formed on an end surface of a waveguide which includes an under cladding, a core and a over cladding. An end surface of a fiber guide holding an optical fiber is coupled the end surface of the waveguide formed the oxide film with a glue. It is preferable that the oxide film is SiOx (1?x?1.5). This oxide film has a composition ratio of an oxygen atom smaller than the stable composition, and thus it is easy for OH radicals to appear on the surface of the oxide film. Such OH radicals bond chemically with the resin of the waveguide and the glue. Thus, an adhesive strength between the waveguide and the fiber guide is improved.Type: ApplicationFiled: February 16, 2005Publication date: August 18, 2005Applicant: OMRON CorporationInventors: Toshiyuki Takahashi, Naru Yasuda, Naoki Yoshitake, Hayami Hosokawa