Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: An input/output device includes a terminal base to be mounted to a structure. A terminal block is connected to the terminal base and includes wiring terminals to be connected to I/O field wiring. A latch body is connected to the terminal block. The latch body is manually movable between an unlatched position and a latched position. An input/output module is connected to the terminal base adjacent the terminal block and includes a locking tab. The latch body, when in the latched position, engages the locking tab and captures the input/output module to the terminal block. The terminal block includes first and second module retaining rails or projections that engage respective slots of the input/output module to restrain the module relative to the terminal base. The terminal base includes first and second notches that receive inner ends of the first and second module retaining projections to rigidify the terminal base.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: An input/output device includes a terminal base to be mounted to a structure. A terminal block is connected to the terminal base and includes wiring terminals to be connected to I/O field wiring. A latch body is connected to the terminal block. The latch body is manually movable between an unlatched position and a latched position. An input/output module is connected to the terminal base adjacent the terminal block and includes a locking tab. The latch body, when in the latched position, engages the locking tab and captures the input/output module to the terminal block. The terminal block includes first and second module retaining rails or projections that engage respective slots of the input/output module to restrain the module relative to the terminal base. The terminal base includes first and second notches that receive inner ends of the first and second module retaining projections to rigidify the terminal base.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: Present embodiments include an automation control system that includes an input/output device module with a device bus therein. The input/output module also includes a first bus contact on a first side of the input/output device module and communicatively coupled with a first end of the device bus, and a second bus contact on a second side of the input/output device module and communicatively coupled with a second end of the device bus. The second side generally faces an opposite direction from the first side and the input/output device module is configured to be coupled with additional input/output device modules positioned on the first and second sides of the input/output device module via the first and second bus contacts.

Abstract: Present embodiments include an adaptable automation control component that includes a base capable of communicatively coupling with a system bus and with a functional module that includes communication and control circuitry. The adaptable automation control component also includes a device power bus including electrical contacts that are capable of communicatively coupling the adaptable automation control component with a separate automation control component, and an activation mechanism including circuitry capable of continuing the device power bus when the activation mechanism is engaged, and capable of discontinuing the device power bus when the activation mechanism is disengaged. The adaptable automation control component facilitates functionality of the adaptable automation control component as an input/output module or a power distribution module depending on whether the activation mechanism is engaged or disengaged.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: An electronics module includes a latch with a first latch portion and a second latch portion. The latch portions move between a latched position and an unlatched position. A spring is located between the first and second latch portions and biases the first and second latch portions in first and second directions. The first latch portion comprises an actuation portion located externally from the housing and that is adapted to be manually engaged and moved linearly in the second direction to move the first latch portion from its latched position toward its unlatched position. The second latch portion includes a resilient tail with a locator tab that seats in either a first receiving location or a second receiving location of the first latch portion and that is selectively deflectable to disengage the locator tab from the second receiving location so that the spring moves the latch to the latched configuration.

Abstract: An electronics module includes a latch with a first latch portion and a second latch portion. The latch portions move between a latched position and an unlatched position. A spring is located between the first and second latch portions and biases the first and second latch portions in first and second directions. The first latch portion comprises an actuation portion located externally from the housing and that is adapted to be manually engaged and moved linearly in the second direction to move the first latch portion from its latched position toward its unlatched position. The second latch portion includes a resilient tail with a locator tab that seats in either a first receiving location or a second receiving location of the first latch portion and that is selectively deflectable to disengage the locator tab from the second receiving location so that the spring moves the latch to the latched configuration.

Abstract: Systems and methods are provided for aligning status indicators on a terminal block of an I/O device by locating the status indicators directly adjacent to or integrated directly within their respective terminals on the terminal block. The status indicators are illuminated by LEDs or other light emitters disposed within a housing of the I/O device. Light from the LEDs are directed to the status indicators by light pipes disposed within the housing of the I/O device. LED activation circuitry disposed within the housing determines a manner in which to activate the LEDs to illuminate the status indicators based on inputs and outputs between the I/O device and a controlled process. In certain embodiments, the status indicators are disposed on a raised section of the I/O device, which may be part of a removable LED indication assembly including the LEDs, light pipes, and LED activation circuitry.

Abstract: An electronics module includes a latch with a first latch portion and a second latch portion. The latch portions move between a latched position and an unlatched position. A spring is located between the first and second latch portions and biases the first and second latch portions in first and second directions. The first latch portion comprises an actuation portion located externally from the housing and that is adapted to be manually engaged and moved linearly in the second direction to move the first latch portion from its latched position toward its unlatched position. The second latch portion includes a resilient tail with a locator tab that seats in either a first receiving location or a second receiving location of the first latch portion and that is selectively deflectable to disengage the locator tab from the second receiving location so that the spring moves the latch to the latched configuration.

Abstract: An electronics module includes a latch with a first latch portion and a second latch portion. The latch portions move between a latched position and an unlatched position. A spring is located between the first and second latch portions and biases the first and second latch portions in first and second directions. The first latch portion comprises an actuation portion located externally from the housing and that is adapted to be manually engaged and moved linearly in the second direction to move the first latch portion from its latched position toward its unlatched position. The second latch portion includes a resilient tail with a locator tab that seats in either a first receiving location or a second receiving location of the first latch portion and that is selectively deflectable to disengage the locator tab from the second receiving location so that the spring moves the latch to the latched configuration.

Abstract: An electronics module housing includes an external recess adapted to receive an associated DIN rail or other associated mounting structure. A latch mechanism is associated with the external recess and is adapted to engage the DIN rail. An electronics circuit board is located in the housing. An electrical connector is physically and electrically connected to the circuit board. The electrical connector includes: (i) a connector body; (ii) a plurality of electrical contacts secured to said connector body and comprising contact pins physically and electrically connected to the circuit board; and (iii) a ground contact secured to the connector body and including a ground pin physically and electrically connected to said circuit board. The ground contact includes a ground contact body that extends from the connector body into the housing recess. The ground contact body includes a ground contact face located adjacent the recess and adapted to contact the associated DIN rail to which the module is mounted.

Abstract: Present embodiments include an automation control system that includes an input/output device module with a device bus therein. The input/output module also includes a first bus contact on a first side of the input/output device module and communicatively coupled with a first end of the device bus, and a second bus contact on a second side of the input/output device module and communicatively coupled with a second end of the device bus. The second side generally faces an opposite direction from the first side and the input/output device module is configured to be coupled with additional input/output device modules positioned on the first and second sides of the input/output device module via the first and second bus contacts.

Abstract: Systems and methods are provided for aligning status indicators on a terminal block of an I/O device by locating the status indicators directly adjacent to or integrated directly within their respective terminals on the terminal block. The status indicators are illuminated by LEDs or other light emitters disposed within a housing of the I/O device. Light from the LEDs are directed to the status indicators by light pipes disposed within the housing of the I/O device. LED activation circuitry disposed within the housing determines a manner in which to activate the LEDs to illuminate the status indicators based on inputs and outputs between the I/O device and a controlled process. In certain embodiments, the status indicators are disposed on a raised section of the I/O device, which may be part of a removable LED indication assembly including the LEDs, light pipes, and LED activation circuitry.