Abstract: A novel methodology of forming a three-dimensional electronic device according to various embodiments of the present invention is described. The methodology comprises, at least, a step of laser folding, using only a laser, a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer, with the laser impinging upon the at least one metal layer to make one or more folds of the printed circuit board to form a three-dimensional electronic device structure.

Abstract: Novel dielectric capacitor devices include an electrically conductive porous scaffold forming a first conductor, a conformal thin dielectric uniformly coating the pores, and a metal or alloy which fills the conformal dielectric coated pores of the scaffold forming a second conductor. This structure's design provides high surface area for high energy storage and capacitance density as well as high thermal conductivity. The metal or alloy can be a liquid metal and flowed within the device to change the electrical or mechanical properties of the device.

Abstract: A deformable array of semiconductor devices, and a method of manufacturing such a deformable array. The deformable array comprises a plurality of islands, where each island contains at least one semiconductor device, and the plurality of islands are arranged in an auxetic geometry.

Abstract: A method and apparatus for using a laser to form and release an element of an actuator. The method comprising forming an actuator from sheet stock using a laser, where the actuator is three dimensional; releasing an element of the actuator from the sheet stock using the laser; and moving the released part relative to the sheet stock using laser ablation propulsion.

Abstract: A method and apparatus for electroless plating of a conductive composite created using fused filament fabrication. The method comprises fused filament fabricating a three-dimensional object with conductive filament and non-conductive filament. The object is then plated with electroless plating, with the metal in the conductive filament forming nucleation sites.

Abstract: A method and apparatus for using a laser to form and release an element of an actuator. The method comprising forming an actuator from sheet stock using a laser, where the actuator is three dimensional; and releasing an element of the actuator from the sheet stock using the laser.

Abstract: Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

Abstract: Photonic annealing is used to treat electrically-conductive thermoplastic. The thermoplastic forms, partially or wholly, a part which may be formed by additive manufacturing, like fused filament fabrication (FFF). The photonic annealing improves part conductivity and also alter, enhance, or give rise to other material properties while taking significantly less time than other conventional post-process methods. For instance, the baseline conductivity of the electrically-conductive thermoplastic material may be on the order of 103 S/m or lower. After the photonic annealing, its conductivity may be raised to the order of 104-105 S/m or more. This represents an improvement of 10-100× or even more of conductivity of the electrically-conductive thermoplastic compared to electrically-conductive thermoplastic prior to the photonic annealing.

Abstract: A method and apparatus for using a laser to form and release an element of an actuator. The method comprising forming an actuator from sheet stock using a laser, where the actuator is three dimensional; and releasing an element of the actuator from the sheet stock using the laser.

Abstract: A deformable array of semiconductor devices, and a method of manufacturing such a deformable array. The deformable array comprises a plurality of islands, where each island contains at least one semiconductor device, and the plurality of islands are arranged in an auxetic geometry.

Abstract: Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

Abstract: A deformable inductive device includes an elastomer material having at least one deformable electrode and a liquid magnetic core formed in the elastomer material and containing a magnetic liquid. Depending on the device's configuration, the deformable element may be embedded in, attached to, or in close proximity with the liquid magnetic core. In some embodiments, the deformable inductive device may be configured as an inductor, solenoid, or transformer and the deformable electrode is at least partially embedded in the liquid magnetic core, for instance. In another embodiment, the deformable inductive device may be configured as part of a wireless power transfer system which includes a coil and a magnetic backplane having the liquid magnetic core with the coil being attached to or in close proximity to the magnetic backplane.

Abstract: Systems, methods, architectures, mechanisms and/or apparatus configured to provide selective electroplating of a fused deposition modeling (FDM) printed article without the use of additional intermediate steps.

Abstract: A deformable inductive device includes a magnetic core formed of an elastomer material having magnetic particles dispersed in it and at least one deformable electrode. Depending on the device's configuration, the deformable element may be embedded in, attached to, or in close proximity with the magnetic core. In some embodiments, the deformable inductive device may be configured as an inductor, solenoid, or transformer and the deformable electrode is at least partially embedded in the magnetic core, for instance. In another embodiment, the deformable inductive device may be configured as part of a wireless power transfer system which includes a coil and a magnetic backplane having the magnetic core with the coil being attached to or in close proximity to the magnetic backplane.

Abstract: A variable capacitor includes a substrate; a plurality of electrodes on the substrate; a phase change material on the plurality of electrodes; and a thermo-modifying element adjacent to the phase change material, wherein the thermo-modifying element changes a temperature of the phase change material. The change in temperature of the phase change material may change a capacitance between the plurality of electrodes. The thermo-modifying element may be integrated into the substrate. The thermo-modifying element may include a heater that raises a temperature of the phase change material to change from a solid state to a liquid state. The thermo-modifying element may include a layer of metal adjacent to the substrate, and wherein when electrical current flows through the layer of metal, the layer of metal forms a resistive heater and raises a temperature of the phase change material to change from a solid state to a liquid state.

Abstract: Self-cooling stretchable electrical circuits with a conduit forming an electrical component and containing electrically conductive liquid are disclosed. They are formed of a platform made of a stretchable material. At least one fluid conduit is formed in the platform and the conduit is formed into an electrical component and filled with the electrically conductive liquid metal. A portion of the conduit is positioned adjacent a heat sink while a pump circulates the liquid through the conduit wherein the metal is cooled at the heat sink.

Abstract: A DC-DC power converter having a power source, a load, and a transmission line terminated at one end. A first switch is electrically connected between the power source and the second end of the transmission line. A second switch is electrically connected between the second end of the transmission line and the load and both switches are movable between an open and a closed position. A switch control circuit switches the first and second electric switches between their open and closed positions at a selected high frequency. A plurality of variable impedance elements are electrically connected to the transmission line at spaced intervals while an impedance control circuit is electrically connected to the variable impedance elements to vary the impedance of the impedance elements and thereby vary the voltage applied to the load.

Abstract: A variable capacitor includes a substrate; a plurality of electrodes on the substrate; a phase change material on the plurality of electrodes; and a thermo-modifying element adjacent to the phase change material, wherein the thermo-modifying element changes a temperature of the phase change material. The change in temperature of the phase change material may change a capacitance between the plurality of electrodes. The thermo-modifying element may be integrated into the substrate. The thermo-modifying element may include a heater that raises a temperature of the phase change material to change from a solid state to a liquid state. The thermo-modifying element may include a layer of metal adjacent to the substrate, and wherein when electrical current flows through the layer of metal, the layer of metal forms a resistive heater and raises a temperature of the phase change material to change from a solid state to a liquid state.

Abstract: A DC-DC power converter having a power source, a load, and a transmission line terminated at one end. A first switch is electrically connected between the power source and a second end of the transmission line and movable between an open and a closed position. A second switch is electrically connected between the second end of the transmission line and the load and is movable between an open and a closed position. A switch control circuit switches the first and second switches between their respective open and closed positions. A pulse forming network forms the transmission line to store the charge in the transmission line.

Abstract: A deformable inductive device includes an elastomer material having at least one deformable electrode and a liquid magnetic core formed in the elastomer material and containing a magnetic liquid. Depending on the device's configuration, the deformable element may be embedded in, attached to, or in close proximity with the liquid magnetic core. In some embodiments, the deformable inductive device may be configured as an inductor, solenoid, or transformer and the deformable electrode is at least partially embedded in the liquid magnetic core, for instance. In another embodiment, the deformable inductive device may be configured as part of a wireless power transfer system which includes a coil and a magnetic backplane having the liquid magnetic core with the coil being attached to or in close proximity to the magnetic backplane.