Patents by Inventor Nati Sinuany

Nati Sinuany has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embossing with printed relief pattern
    Patent number: 10864718
    Abstract: An embossing apparatus includes an embossing die that includes a printed relief pattern made up of multiple layers of a deposited material. A resilient surface presses media against the embossing die such that embossed features corresponding to the embossing die are formed in the media. A method for embossing media includes forming an embossing die by depositing multiple layers of ink on a impression layer to form a relief pattern and pressing media against the embossing die to transfer the relief image to the media.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: December 15, 2020
    Assignee: HP Indigo B.V.
    Inventors: Mark Sandler, Shai Lior, Eyal Peleg, Nati Sinuany, Dror Kella, Shahar Stein, George Trendafilov, Tsahi Rosenbaom
  • EMBOSSING WITH PRINTED RELIEF PATTERN
    Publication number: 20160200093
    Abstract: An embossing apparatus includes an embossing die that includes a printed relief pattern made up of multiple layers of a deposited material. A resilient surface presses media against the embossing die such that embossed features corresponding to the embossing die are formed in the media. A method for embossing media includes forming an embossing die by depositing multiple layers of ink on a impression layer to form a relief pattern and pressing media against the embossing die to transfer the relief image to the media.
    Type: Application
    Filed: March 21, 2016
    Publication date: July 14, 2016
    Applicant: HEWLETT-PACKARD INDIGO B.V.
    Inventors: Mark Sandler, Shai Lior, Eyal Peleg, Nati Sinuany, Dror Kella, Shahar Stein, George Trendafilov, Tsahi Rosenbaom
  • Embossing with printed relief pattern
    Patent number: 9296199
    Abstract: An embossing apparatus includes an embossing die that includes a printed relief pattern made up of multiple layers of a deposited material. A resilient surface presses media against the embossing die such that embossed features corresponding to the embossing die are formed in the media. A method for embossing media includes forming an embossing die by depositing multiple layers of ink on a impression layer to form a relief pattern and pressing media against the embossing die to transfer the relief image to the media.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: March 29, 2016
    Assignee: Hewlett-Packard Indigo B.V.
    Inventors: Mark Sandler, Shai Lior, Eyal Peleg, Nati Sinuany, Dror Kella, Shahar Stein, George Trendafilov, Tsahi Rosenbaom
  • EMBOSSING WITH PRINTED RELIEF PATTERN
    Publication number: 20140083315
    Abstract: An embossing apparatus includes an embossing die that includes a printed relief pattern made up of multiple layers of a deposited material. A resilient surface presses media against the embossing die such that embossed features corresponding to the embossing die are formed in the media. A method for embossing media includes forming an embossing die by depositing multiple layers of ink on a impression layer to form a relief pattern and pressing media against the embossing die to transfer the relief image to the media.
    Type: Application
    Filed: May 11, 2011
    Publication date: March 27, 2014
    Applicant: HEWLETT-PACKARD INDIGO B.V.
    Inventors: Mark Sandler, Shai Lior, Eyal Peleg, Nati Sinuany, Dror Kella, Shahar Stein, George Trendafilov, Tsahi Rosenbaom