Abstract: A through-silicon via self-routing circuit includes a plurality of through-silicon vias (TSVs) and a plurality of planar die. The plurality of planar die are connected by the plurality of TSVs. And each one of the plurality of planar die includes a built-in self-tester, a built-in self-routing switching network, and a core circuit. The built-in self-tester has a plurality of valid-bit leads and a plurality of through-silicon via leads to connect the plurality of TSVs. The built-in self-routing switching network is connected to the built-in self-tester, for selecting from the plurality of TSVs for conducting. The core circuit has a to plurality of I/O leads linked to the built-in self-routing switching network.